| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2025 | J | jnl |
Internet Things
|
| 2025 | J | jnl |
Comput. Networks
|
| 2024 | J | jnl |
Comparative analysis of 2D mesh topologies with additional communication links for on-chip networks.
Comput. Networks
|
| 2024 | J | jnl |
Sensors
|
| 2024 | J | jnl |
IEEE Trans. Dependable Secur. Comput.
|
| 2023 | J | jnl |
IEEE Trans. Software Eng.
|
| 2023 | J | jnl |
Concurr. Comput. Pract. Exp.
|
| 2023 | — | conf |
MobiQuitous (1)
|
| 2023 | J | jnl |
IEEE Trans. Dependable Secur. Comput.
|
| 2023 | J | jnl |
CoRR
|
| 2022 | C | conf |
INDIN
|
| 2022 | J | jnl |
Sensors
|
| 2022 | J | jnl |
J. Parallel Distributed Comput.
|
| 2022 | J | jnl |
Microprocess. Microsystems
|
| 2022 | J | jnl |
IEEE Trans. Dependable Secur. Comput.
|
| 2022 | J | jnl |
Microprocess. Microsystems
|
| 2022 | J | jnl |
IEEE Trans. Big Data
|
| 2022 | J | jnl |
ACM Comput. Surv.
|
| 2022 | A* | conf |
IJCAI
|
| 2022 | J | jnl |
CoRR
|
| 2021 | J | jnl |
IEEE Internet Things J.
|
| 2021 | — | conf |
DASC/PiCom/CBDCom/CyberSciTech
|
| 2021 | C | conf |
INDIN
|
| 2021 | J | jnl |
Neural Comput. Appl.
|
| 2021 | B | conf |
IJCNN
|
| 2021 | J | jnl |
IEEE Intell. Syst.
|
| 2021 | J | jnl |
CoRR
|
| 2021 | B | conf |
SMARTCOMP
|
| 2021 | A* | conf |
ICDM
|
| 2021 | J | jnl |
CoRR
|
| 2020 | J | jnl |
IEEE Trans. Ind. Informatics
|
| 2020 | B | conf |
CCGRID
|
| 2020 | J | jnl |
IEEE Trans. Instrum. Meas.
|
| 2020 | J | jnl |
IEEE Trans. Ind. Informatics
|
| 2020 | J | jnl |
Sensors
|
| 2020 | A | conf |
CIKM
|
| 2020 | J | jnl |
J. Ambient Intell. Humaniz. Comput.
|
| 2019 | C | conf |
INDIN
|
| 2019 | J | jnl |
Allocation and scheduling of SystemJ programs on chip multiprocessors with weighted TDMA scheduling.
J. Syst. Archit.
|
| 2019 | — | conf |
ARCS
|
| 2019 | J | jnl |
IEEE Trans. Ind. Informatics
|
| 2019 | J | jnl |
IEEE Trans. Instrum. Meas.
|
| 2019 | — | conf |
SmartWorld/SCALCOM/UIC/ATC/CBDCom/IOP/SCI
|
| 2019 | J | jnl |
Microprocess. Microsystems
|
| 2019 | Misc | conf |
IVCNZ
|
| 2019 | C | conf |
INDIN
|
| 2018 | J | jnl |
IEEE Trans. Biomed. Eng.
|
| 2018 | C | conf |
ETFA
|
| 2018 | — | conf |
ISPA/IUCC/BDCloud/SocialCom/SustainCom
|
| 2018 | J | jnl |
Medical Biol. Eng. Comput.
|
| 2018 | J | jnl |
IEEE Trans. Ind. Informatics
|
| 2018 | — | conf |
UPINLBS
|
| 2018 | C | conf |
ETFA
|
| 2017 | C | conf |
INDIN
|
| 2017 | J | jnl |
ACM Trans. Embed. Comput. Syst.
|
| 2017 | J | jnl |
J. Signal Process. Syst.
|
| 2017 | C | conf |
INDIN
|
| 2017 | — | conf |
DISE@ICSE
|
| 2017 | J | jnl |
ACM Trans. Design Autom. Electr. Syst.
|
| 2017 | J | jnl |
J. Syst. Archit.
|
| 2017 | J | jnl |
J. Syst. Archit.
|
| 2016 | — | conf |
DASIP
|
| 2016 | C | conf |
INDIN
|
| 2016 | — | conf |
IEEE SENSORS
|
| 2016 | J | jnl |
Knowl. Based Syst.
|
| 2016 | A | conf |
CIKM
|
| 2016 | J | jnl |
Microprocess. Microsystems
|
| 2016 | C | conf |
ISCAS
|
| 2015 | J | jnl |
Sensors
|
| 2015 | B | conf |
Intelligent Environments
|
| 2015 | — | conf |
ISSNIP
|
| 2015 | A | conf |
ICST
|
| 2015 | — | conf |
UIC/ATC/ScalCom
|
| 2015 | A | conf |
ICST
|
| 2015 | A | conf |
ICST
|
| 2015 | — | conf |
APSIPA
|
| 2015 | — | conf |
ICARA
|
| 2014 | — | conf |
UIC/ATC/ScalCom
|
| 2014 | C | conf |
ETFA
|
| 2014 | J | jnl |
Int. J. Intell. Syst. Technol. Appl.
|
| 2014 | A* | conf |
ICRA
|
| 2014 | J | jnl |
IEEE Trans. Instrum. Meas.
|
| 2014 | — | conf |
UIC/ATC/ScalCom
|
| 2014 | J | jnl |
Int. J. Comput. Appl. Technol.
|
| 2013 | C | conf |
IECON
|
| 2013 | — | conf |
TrustCom/ISPA/IUCC
|
| 2013 | C | conf |
GPC
|
| 2013 | A | conf |
ICST
|
| 2013 | A | conf |
ICST
|
| 2013 | C | conf |
IECON
|
| 2013 | — | conf |
ARCS
|
| 2013 | J | jnl |
ACM Trans. Embed. Comput. Syst.
|
| 2013 | — | conf |
ARCS
|
| 2013 | — | conf |
ISSNIP
|
| 2013 | — | conf |
CHINZ
|
| 2013 | C | conf |
ETFA
|
| 2013 | C | conf |
INDIN
|
| 2013 | — | conf |
PerCom Workshops
|
| 2013 | A | conf |
ICST
|
| 2012 | A | conf |
DATE
|
| 2012 | J | jnl |
IEEE Trans. Parallel Distributed Syst.
|
| 2012 | J | jnl |
ACM Trans. Embed. Comput. Syst.
|
| 2012 | — | conf |
ASP-DAC
|
| 2012 | J | jnl |
IEEE Trans. Syst. Man Cybern. Part C
|
| 2012 | J | jnl |
ACM Trans. Embed. Comput. Syst.
|
| 2011 | — | conf |
ACSD
|
| 2011 | J | jnl |
IEEE Trans. Parallel Distributed Syst.
|
| 2011 | A | conf |
DATE
|
| 2011 | J | jnl |
EURASIP J. Embed. Syst.
|
| 2011 | J | jnl |
ACM Trans. Design Autom. Electr. Syst.
|
| 2011 | C | conf |
DASC
|
| 2011 | — | conf |
FPT
|
| 2011 | A* | conf |
DAC
|
| 2011 | J | jnl |
IEEE Embed. Syst. Lett.
|
| 2011 | C | conf |
ATC
|
| 2010 | B | conf |
GLOBECOM
|
| 2010 | J | jnl |
Phys. Commun.
|
| 2010 | — | conf |
ASP-DAC
|
| 2010 | J | jnl |
Comput. Lang. Syst. Struct.
|
| 2009 | C | conf |
ETFA
|
| 2009 | J | jnl |
EURASIP J. Embed. Syst.
|
| 2009 | J | jnl |
IEEE Trans. Instrum. Meas.
|
| 2009 | A | conf |
DATE
|
| 2009 | B | conf |
IWCMC
|
| 2008 | A | conf |
ACSAC
|
| 2007 | J | jnl |
Appl. Soft Comput.
|
| 2007 | — | conf |
ISSPA
|
| 2007 | Misc | conf |
VLSI Design
|
| 2007 | J | jnl |
EURASIP J. Embed. Syst.
|
| 2006 | J | jnl |
IEEE Trans. Instrum. Meas.
|
| 2006 | J | jnl |
EURASIP J. Adv. Signal Process.
|
| 2006 | J | jnl |
IEEE Trans. Ind. Electron.
|
| 2006 | J | jnl |
EURASIP J. Embed. Syst.
|
| 2006 | J | jnl |
EURASIP J. Adv. Signal Process.
|
| 2005 | — | conf |
ISSPA
|
| 2005 | — | conf |
ISSPA
|
| 2005 | — | conf |
ISSPA
|
| 2005 | J | jnl |
EURASIP J. Adv. Signal Process.
|
| 2004 | — | conf |
EUSIPCO
|
| 2003 | — | conf |
ICECS
|
| 2002 | J | jnl |
Microprocess. Microsystems
|
| 2001 | J | jnl |
Wirel. Pers. Commun.
|
| 2000 | J | jnl |
Wirel. Pers. Commun.
|
| 2000 | J | jnl |
IEEE Trans. Aerosp. Electron. Syst.
|
| 1999 | J | jnl |
Microprocess. Microsystems
|
| 1999 | J | jnl |
Microprocess. Microsystems
|
| 1998 | J | jnl |
Microprocess. Microsystems
|
| 1997 | — | conf |
ICONIP (2)
|
| 1997 | J | jnl |
Microprocess. Microsystems
|
| 1997 | — | conf |
ICONIP (2)
|
| 1997 | J | jnl |
Microprocess. Microsystems
|