| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2026 | J | jnl |
CoRR
|
| 2026 | J | jnl |
CoRR
|
| 2025 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2024 | A* | conf |
CVPR
|
| 2024 | — | conf |
ECCV (28)
|
| 2024 | J | jnl |
CoRR
|
| 2023 | J | jnl |
CoRR
|
| 2023 | J | jnl |
CoRR
|
| 2023 | A* | conf |
CVPR
|
| 2023 | J | jnl |
CoRR
|
| 2023 | J | jnl |
Proc. ACM Hum. Comput. Interact.
|
| 2022 | J | jnl |
IEEE Trans. Cybern.
|
| 2022 | A | conf |
BMVC
|
| 2022 | J | jnl |
CoRR
|
| 2021 | A | conf |
BMVC
|
| 2021 | J | jnl |
CoRR
|
| 2021 | — | conf |
ATCI (1)
|
| 2020 | J | jnl |
IEEE Trans. Cybern.
|
| 2020 | J | jnl |
Remote. Sens.
|
| 2019 | J | jnl |
CoRR
|
| 2018 | A | conf |
ICME
|
| 2018 | A* | conf |
AAAI
|
| 2017 | A | conf |
ICME
|