| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2026 | J | jnl |
Comput. Mater. Continua
|
| 2026 | J | jnl |
J. Intell. Manuf.
|
| 2026 | J | jnl |
Comput. Networks
|
| 2025 | J | jnl |
IEEE Trans Autom. Sci. Eng.
|
| 2025 | J | jnl |
Comput. Ind. Eng.
|
| 2025 | J | jnl |
Eng. Appl. Artif. Intell.
|
| 2024 | J | jnl |
IEEE Trans. Aerosp. Electron. Syst.
|
| 2023 | A | conf |
AAMAS
|
| 2023 | J | jnl |
IEEE Trans. Aerosp. Electron. Syst.
|
| 2023 | J | jnl |
IEEE Geosci. Remote. Sens. Lett.
|
| 2023 | J | jnl |
Digit. Signal Process.
|
| 2023 | A* | conf |
ICDM
|
| 2022 | J | jnl |
IEEE Trans. Intell. Transp. Syst.
|
| 2022 | J | jnl |
IEEE Trans. Veh. Technol.
|
| 2022 | J | jnl |
IEEE Trans. Aerosp. Electron. Syst.
|
| 2022 | A | conf |
ITC
|
| 2022 | J | jnl |
CoRR
|
| 2021 | C | conf |
ICCC
|
| 2020 | — | conf |
ICIAI
|
| 2020 | — | conf |
EUSIPCO
|
| 2020 | — | conf |
HPCC/DSS/SmartCity
|
| 2019 | J | jnl |
IEEE Access
|
| 2019 | B | conf |
ICIP
|
| 2019 | — | conf |
RICAI
|
| 2019 | — | conf |
CISP-BMEI
|
| 2018 | J | jnl |
IEEE Signal Process. Lett.
|
| 2018 | A* | conf |
EMNLP
|
| 2018 | J | jnl |
CoRR
|
| 2018 | — | conf |
NAACL-HLT (2)
|
| 2018 | J | jnl |
CoRR
|