| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2026 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2026 | A* | conf |
HPCA
|
| 2025 | J | jnl |
CoRR
|
| 2025 | A | conf |
DATE
|
| 2025 | J | jnl |
CoRR
|
| 2025 | A* | conf |
MICRO
|
| 2025 | Misc | conf |
SYSTOR
|
| 2024 | J | jnl |
CoRR
|
| 2024 | B | conf |
PACT
|
| 2024 | J | jnl |
Knowl. Inf. Syst.
|
| 2024 | J | jnl |
Multim. Syst.
|
| 2024 | — | conf |
CACML
|
| 2023 | — | conf |
ICIRA (2)
|
| 2023 | C | conf |
ISCAS
|
| 2023 | — | conf |
VISIGRAPP (4: VISAPP)
|
| 2022 | — | conf |
ACCV (7)
|
| 2021 | — | conf |
HPCC/DSS/SmartCity/DependSys
|
| 2021 | C | conf |
CLUSTER
|
| 2019 | — | conf |
HPCC/SmartCity/DSS
|
| 2018 | J | jnl |
IEEE Access
|
| 2018 | J | jnl |
IEICE Electron. Express
|
| 2017 | — | conf |
NOCS
|
| 2017 | — | conf |
SoCC
|
| 2016 | C | conf |
ICCD
|
| 2016 | — | conf |
ACA
|