| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2024 | — | conf |
IEEE SENSORS
|
| 2023 | J | jnl |
IEEE Trans. Instrum. Meas.
|
| 2019 | J | jnl |
IEEE Trans. Biomed. Eng.
|
| 2019 | — | conf |
NEMS
|
| 2018 | — | conf |
NEMS
|
| 2018 | — | conf |
An All-Metal Hollow Microstructure for Pool-Boiling Chip-Integrated Cooling Based on Electroplating.
NEMS
|
| 2016 | — | conf |
IEEE SENSORS
|
| 2013 | J | jnl |
IEEE Trans. Ind. Electron.
|
| 2012 | J | jnl |
Microelectron. J.
|
| 2008 | J | jnl |
Microelectron. J.
|
| 2007 | J | jnl |
Microelectron. J.
|