| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2026 | J | jnl |
CoRR
|
| 2025 | J | jnl |
Symmetry
|
| 2024 | A* | conf |
ACM Multimedia
|
| 2024 | A* | conf |
ACM Multimedia
|
| 2024 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2023 | J | jnl |
IEEE Trans. Ind. Electron.
|
| 2022 | J | jnl |
Sci. China Inf. Sci.
|
| 2022 | J | jnl |
Sci. China Inf. Sci.
|
| 2021 | J | jnl |
IEEE Trans. Ind. Electron.
|
| 2021 | C | conf |
IECON
|
| 2019 | J | jnl |
IEEE Trans. Ind. Electron.
|
| 2018 | J | jnl |
Microelectron. Reliab.
|
| 2018 | J | jnl |
Microelectron. Reliab.
|
| 2017 | J | jnl |
IEEE Trans. Ind. Electron.
|
| 2017 | — | conf |
ISIE
|
| 2017 | C | conf |
IECON
|
| 2017 | C | conf |
IECON
|
| 2015 | J | jnl |
IEEE Trans. Ind. Electron.
|
| 2015 | J | jnl |
CoRR
|
| 2014 | Misc | conf |
ICCS
|
| 2014 | B | conf |
GLOBECOM
|