| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2026 | J | jnl |
Eng. Appl. Artif. Intell.
|
| 2025 | J | jnl |
Frontiers Inf. Technol. Electron. Eng.
|
| 2025 | J | jnl |
IEEE Trans. Intell. Transp. Syst.
|
| 2024 | J | jnl |
Remote. Sens.
|
| 2024 | J | jnl |
IEEE Trans. Signal Process.
|
| 2023 | J | jnl |
IEEE Trans. Veh. Technol.
|
| 2023 | — | conf |
ITSC
|
| 2023 | — | conf |
ICCCS
|
| 2023 | J | jnl |
Signal Process.
|
| 2023 | J | jnl |
IEEE Trans. Ind. Electron.
|
| 2023 | A* | conf |
ACM Multimedia
|
| 2023 | J | jnl |
Digit. Signal Process.
|
| 2023 | J | jnl |
Entropy
|
| 2022 | C | conf |
IECON
|
| 2022 | J | jnl |
IEEE Trans. Ind. Electron.
|
| 2022 | J | jnl |
IEEE Trans. Ind. Electron.
|
| 2022 | J | jnl |
IEEE Trans. Ind. Electron.
|
| 2021 | J | jnl |
IEEE Trans. Veh. Technol.
|
| 2021 | J | jnl |
IEEE Trans. Intell. Transp. Syst.
|
| 2021 | J | jnl |
IEEE Trans. Veh. Technol.
|
| 2020 | A | conf |
INTERSPEECH
|
| 2020 | J | jnl |
IEEE Trans. Veh. Technol.
|
| 2019 | J | jnl |
CoRR
|
| 2019 | J | jnl |
IEEE Trans. Veh. Technol.
|
| 2019 | J | jnl |
IEEE Access
|
| 2018 | J | jnl |
IEEE Trans. Ind. Electron.
|
| 2018 | J | jnl |
IEEE Trans. Ind. Electron.
|
| 2018 | J | jnl |
Microelectron. Reliab.
|
| 2017 | — | conf |
ITSC
|
| 2017 | C | conf |
IECON
|
| 2017 | — | conf |
ITSC
|
| 2017 | C | conf |
IECON
|
| 2016 | C | conf |
IECON
|
| 2016 | J | jnl |
IEICE Electron. Express
|
| 2016 | C | conf |
IECON
|
| 2015 | C | conf |
IECON
|
| 2015 | C | conf |
IECON
|
| 2015 | C | conf |
IECON
|
| 2015 | C | conf |
IECON
|
| 2015 | C | conf |
IECON
|
| 2015 | C | conf |
IECON
|
| 2014 | C | conf |
IECON
|
| 2014 | C | conf |
IECON
|
| 2013 | J | jnl |
J. Comput.
|
| 2013 | J | jnl |
J. Comput.
|
| 2011 | — | conf |
EMEIT
|
| 2011 | — | conf |
EMEIT
|
| 2008 | — | conf |
ICNC (5)
|