| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2026 | — | conf |
ASP-DAC
|
| 2026 | A* | conf |
HPCA
|
| 2026 | — | conf |
ASP-DAC
|
| 2026 | J | jnl |
IEEE Trans. Veh. Technol.
|
| 2026 | — | conf |
ASP-DAC
|
| 2026 | J | jnl |
Neurocomputing
|
| 2026 | J | jnl |
IEEE Comput. Archit. Lett.
|
| 2025 | — | conf |
IRPS
|
| 2025 | J | jnl |
IEEE Trans. Circuits Syst. II Express Briefs
|
| 2025 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2025 | A | conf |
DATE
|
| 2025 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2025 | — | conf |
ISQED
|
| 2025 | J | jnl |
Frontiers Artif. Intell.
|
| 2025 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2025 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2025 | A* | conf |
MICRO
|
| 2025 | J | jnl |
IEEE Trans. Circuits Syst. I Regul. Pap.
|
| 2025 | A | conf |
DATE
|
| 2025 | A | conf |
ICME
|
| 2025 | J | jnl |
IEEE Trans. Biomed. Circuits Syst.
|
| 2025 | — | conf |
ASP-DAC
|
| 2025 | A | conf |
ICME
|
| 2025 | A* | conf |
DAC
|
| 2025 | J | jnl |
UIC: A unified and scalable chip integrating neuromorphic computation and general purpose processor.
Microelectron. J.
|
| 2024 | — | conf |
NVMSA
|
| 2024 | A | conf |
DATE
|
| 2024 | — | conf |
ICTA
|
| 2024 | A* | conf |
MICRO
|
| 2024 | — | conf |
ISVLSI
|
| 2024 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2024 | C | conf |
ICCD
|
| 2024 | J | jnl |
J. Supercomput.
|
| 2024 | — | conf |
ISVLSI
|
| 2024 | — | conf |
ICTA
|
| 2024 | J | jnl |
J. Intell. Inf. Syst.
|
| 2024 | J | jnl |
Expert Syst. J. Knowl. Eng.
|
| 2024 | J | jnl |
IEEE Trans. Circuits Syst. II Express Briefs
|
| 2024 | J | jnl |
IEEE Trans. Circuits Syst. II Express Briefs
|
| 2024 | J | jnl |
IEEE Trans. Biomed. Circuits Syst.
|
| 2024 | Misc | conf |
ICASSP
|
| 2024 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2023 | C | conf |
ISCAS
|
| 2023 | J | jnl |
IEICE Electron. Express
|
| 2023 | — | conf |
ISVLSI
|
| 2023 | J | jnl |
A High-Density and Reconfigurable SRAM-Based Digital Compute-In-Memory Macro for Low-Power AI Chips.
IEEE Trans. Circuits Syst. II Express Briefs
|
| 2023 | J | jnl |
IEICE Trans. Electron.
|
| 2023 | J | jnl |
IEICE Trans. Electron.
|
| 2023 | B | conf |
ICPADS
|
| 2023 | — | conf |
ICA3PP (3)
|
| 2023 | J | jnl |
IEEE Internet Things J.
|
| 2023 | J | jnl |
CoRR
|
| 2023 | J | jnl |
IEEE Trans. Circuits Syst. II Express Briefs
|
| 2023 | B | conf |
ICPADS
|
| 2023 | J | jnl |
Parallel-Prefix Adder in Spin-Orbit Torque Magnetic RAM for High Bit-Width Non-Volatile Computation.
IEEE Trans. Circuits Syst. II Express Briefs
|
| 2023 | J | jnl |
Microelectron. J.
|
| 2023 | J | jnl |
CoRR
|
| 2023 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2023 | — | conf |
ICTA
|
| 2023 | — | conf |
ICTA
|
| 2022 | — | conf |
ICTA
|
| 2022 | J | jnl |
Microelectron. J.
|
| 2022 | J | jnl |
IEEE Trans. Circuits Syst. II Express Briefs
|
| 2022 | J | jnl |
IEICE Electron. Express
|
| 2022 | — | conf |
ICTA
|
| 2022 | — | conf |
ICTA
|
| 2022 | — | conf |
ICCSE (3)
|
| 2021 | Misc | conf |
FCCM
|
| 2021 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2021 | J | jnl |
IEEE Trans. Circuits Syst. II Express Briefs
|
| 2021 | — | conf |
ICTA
|
| 2021 | J | jnl |
IEEE Trans. Circuits Syst. I Regul. Pap.
|
| 2021 | J | jnl |
IEEE Trans. Circuits Syst. II Express Briefs
|
| 2021 | J | jnl |
IEICE Electron. Express
|
| 2021 | — | conf |
ICTA
|
| 2021 | J | jnl |
J. Electronic Imaging
|
| 2021 | — | conf |
ICTA
|
| 2021 | J | jnl |
Neurocomputing
|
| 2021 | J | jnl |
IEEE Access
|
| 2020 | C | conf |
ISCAS
|
| 2020 | — | conf |
ICTA
|
| 2020 | — | conf |
ICTA
|
| 2020 | J | jnl |
CoRR
|
| 2020 | J | jnl |
IEICE Electron. Express
|
| 2020 | J | jnl |
IEEE Trans. Biomed. Circuits Syst.
|
| 2020 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2020 | B | conf |
ICPR
|
| 2020 | J | jnl |
CoRR
|
| 2020 | B | conf |
IJCNN
|
| 2020 | J | jnl |
CoRR
|
| 2019 | J | jnl |
IEEE Trans. Circuits Syst. Video Technol.
|
| 2018 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2018 | — | conf |
APSIPA
|
| 2018 | C | conf |
ISCAS
|
| 2017 | J | jnl |
IEEE Trans. Circuits Syst. I Regul. Pap.
|
| 2017 | — | conf |
APSIPA
|
| 2017 | J | jnl |
IEICE Electron. Express
|
| 2017 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2017 | — | conf |
ASICON
|
| 2017 | — | conf |
ASICON
|
| 2015 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2015 | J | jnl |
IEEE Trans. Circuits Syst. I Regul. Pap.
|
| 2015 | — | conf |
ASICON
|
| 2015 | — | conf |
ASICON
|
| 2015 | — | conf |
CICC
|
| 2015 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2015 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2015 | J | jnl |
IEICE Electron. Express
|
| 2015 | — | conf |
ASICON
|
| 2015 | J | jnl |
ACM J. Emerg. Technol. Comput. Syst.
|
| 2014 | J | jnl |
IEEE Trans. Circuits Syst. I Regul. Pap.
|
| 2014 | — | conf |
ISIC
|
| 2014 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2014 | J | jnl |
IEICE Electron. Express
|
| 2014 | J | jnl |
IEEE Trans. Circuits Syst. II Express Briefs
|
| 2013 | — | conf |
ASICON
|
| 2013 | — | conf |
ISSCC
|
| 2013 | — | conf |
ASICON
|
| 2013 | — | conf |
ASICON
|
| 2013 | C | conf |
ISCAS
|
| 2013 | — | conf |
ASICON
|
| 2013 | J | jnl |
IEICE Trans. Fundam. Electron. Commun. Comput. Sci.
|
| 2013 | — | conf |
ISSoC
|
| 2013 | — | conf |
ASICON
|
| 2013 | — | conf |
ASICON
|
| 2013 | C | conf |
ISCAS
|
| 2013 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2013 | C | conf |
ISCAS
|
| 2012 | J | jnl |
IEICE Electron. Express
|
| 2012 | J | jnl |
IEICE Trans. Inf. Syst.
|
| 2012 | — | conf |
ISOCC
|
| 2012 | C | conf |
ISCAS
|
| 2012 | — | conf |
ISSCC
|
| 2012 | J | jnl |
IEICE Electron. Express
|
| 2012 | J | jnl |
IEICE Trans. Commun.
|
| 2012 | C | conf |
ISCAS
|
| 2012 | C | conf |
ISCAS
|
| 2011 | J | jnl |
IEICE Trans. Inf. Syst.
|
| 2011 | — | conf |
ASICON
|
| 2011 | — | conf |
ASICON
|
| 2011 | — | conf |
ASICON
|
| 2011 | — | conf |
ASICON
|
| 2011 | C | conf |
ISCAS
|
| 2011 | — | conf |
ASICON
|
| 2011 | — | conf |
ASICON
|
| 2011 | C | conf |
ISCAS
|
| 2011 | — | conf |
ASICON
|
| 2010 | J | jnl |
IEICE Trans. Fundam. Electron. Commun. Comput. Sci.
|
| 2010 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2010 | C | conf |
ISCAS
|
| 2009 | J | jnl |
IEEE J. Solid State Circuits
|
| 2009 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2008 | C | conf |
ISCAS
|
| 2008 | J | jnl |
J. Signal Process. Syst.
|
| 2008 | J | jnl |
IEEE J. Solid State Circuits
|
| 2007 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2007 | J | jnl |
EURASIP J. Embed. Syst.
|
| 2007 | J | jnl |
IEEE Micro
|
| 2006 | — | conf |
ISSCC
|
| 2006 | — | conf |
Hot Chips Symposium
|
| 2006 | C | conf |
ICCD
|
| 2006 | — | conf |
Performance and Power Analysis of Globally Asynchronous Locally Synchronous Multi-Processor Systems.
ISVLSI
|
| 1998 | J | jnl |
IEEE Trans. Instrum. Meas.
|