| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2025 | J | jnl |
IEEE Trans. Circuits Syst. II Express Briefs
|
| 2025 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2025 | J | jnl |
IEEE Internet Things J.
|
| 2024 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2023 | J | jnl |
IEEE Trans. Circuits Syst. II Express Briefs
|
| 2023 | — | conf |
A-SSCC
|
| 2023 | J | jnl |
IEEE Internet Things J.
|
| 2022 | J | jnl |
Sci. China Inf. Sci.
|
| 2022 | — | conf |
EITCE
|
| 2021 | — | conf |
3DIC
|
| 2021 | J | jnl |
IEEE Access
|
| 2020 | J | jnl |
IEEE Access
|
| 2020 | J | jnl |
IEEE Access
|
| 2019 | J | jnl |
Microelectron. J.
|
| 2019 | J | jnl |
IEICE Electron. Express
|
| 2019 | — | conf |
A-SSCC
|
| 2019 | — | conf |
3DIC
|
| 2018 | J | jnl |
Sensors
|
| 2018 | J | jnl |
Sensors
|
| 2018 | J | jnl |
IEEE Commun. Lett.
|
| 2018 | J | jnl |
Digit. Signal Process.
|
| 2017 | J | jnl |
IEICE Electron. Express
|
| 2016 | — | conf |
3DIC
|
| 2014 | J | jnl |
IEEE J. Solid State Circuits
|
| 2013 | — | conf |
ISSCC
|
| 2013 | — | conf |
GreenCom/iThings/CPScom
|
| 2013 | — | conf |
GreenCom/iThings/CPScom
|
| 2013 | — | conf |
GreenCom/iThings/CPScom
|
| 2013 | — | conf |
GreenCom/iThings/CPScom
|
| 2012 | J | jnl |
IEEE J. Solid State Circuits
|
| 2011 | J | jnl |
IEEE J. Solid State Circuits
|