Zheyao Wang

14 papers A* 1C 1Journal 8Unranked 4
YearRankTypeTitle / Venue / Authors
2024 J jnl
Hiding from thermal imaging pedestrian detectors in the physical world.
Neurocomputing
Xiaopei Zhu, Xiao Li, Jianmin Li, Zheyao Wang, Xiaolin Hu
2023 J jnl
Hiding from infrared detectors in real world with adversarial clothes.
Appl. Intell.
Xiaopei Zhu, Zhanhao Hu, Siyuan Huang, Jianmin Li, Xiaolin Hu, Zheyao Wang
2021 A* conf
Fooling Thermal Infrared Pedestrian Detectors in Real World Using Small Bulbs.
AAAI
Xiaopei Zhu, Xiao Li, Jianmin Li, Zheyao Wang, Xiaolin Hu
2021 J jnl
Fooling thermal infrared pedestrian detectors in real world using small bulbs.
CoRR
Xiaopei Zhu, Xiao Li, Jianmin Li, Zheyao Wang, Xiaolin Hu
2018 — conf
Fabrication of Chalcogenide Microlens Array Using Hot Embossing Method.
IEEE SENSORS
Hao Xiong, Zheyao Wang
2018 J jnl
Research on a Novel MEMS Sensor for Spatial DC Electric Field Measurements in an Ion Flows Field.
Sensors
Ya Mou, Zhanqing Yu, Kaitian Huang, Qing Ma, Rong Zeng, Zheyao Wang
2017 — conf
Fabrication of silicon nanowire pH sensors using high output, low cost sidewall mask technology.
IEEE SENSORS
Kun Zhou, Zhida Zhao, Zheyao Wang
2016 J jnl
Delamination of bonding Interface between benzocyclobutene (BCB) and silicon dioxide/silicon nitride.
Microelectron. Reliab.
Fan Bu, Qing Ma, Zheyao Wang
2016 — conf
Fabrication of ultra-thin silicon chips using thermally decomposable temporary bonding adhesive.
IEEE SENSORS
Xingjun Xue, Shujie Yang, Dong Wu, Liyang Pan, Zheyao Wang
2015 — conf
Air-gap/SiO2 liner TSVs with improved electrical performance.
3DIC
Cui Huang, Dong Wu, Liyang Pan, Zheyao Wang
2013 C conf
A 15-bit two-step sigma-delta ADC with embedded compression for image sensor array.
ISCAS
Mengyun Yue, Dong Wu, Zheyao Wang
2013 J jnl
Reliability of through-silicon-vias (TSVs) with benzocyclobutene liners.
Microelectron. Reliab.
Qianwen Chen, Wuyang Yu, Cui Huang, Zhimin Tan, Zheyao Wang
2012 J jnl
Benzocyclobutene polymer filling of high aspect-ratio annular trenches for fabrication of Through-Silicon-Vias (TSVs).
Microelectron. Reliab.
Qianwen Chen, Cui Huang, Zheyao Wang
2006 J jnl
Permittivity measurement of Ba
IEEE Trans. Instrum. Meas.
Zheyao Wang, Jianshe Liu, Litian Liu