| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2026 | J | jnl |
Eng. Appl. Artif. Intell.
|
| 2026 | J | jnl |
IEEE Trans Autom. Sci. Eng.
|
| 2026 | J | jnl |
Expert Syst. Appl.
|
| 2025 | J | jnl |
IEEE Signal Process. Lett.
|
| 2025 | J | jnl |
IEEE Trans. Instrum. Meas.
|
| 2025 | J | jnl |
IEEE Trans. Instrum. Meas.
|
| 2025 | J | jnl |
Comput. Electr. Eng.
|
| 2025 | J | jnl |
IEEE Trans. Emerg. Top. Comput. Intell.
|
| 2024 | J | jnl |
Artif. Intell. Rev.
|
| 2024 | J | jnl |
Vis. Comput.
|
| 2023 | — | conf |
ICONIP (1)
|
| 2023 | B | conf |
RO-MAN
|
| 2022 | J | jnl |
Int. J. Circuit Theory Appl.
|
| 2021 | — | conf |
VTC Spring
|
| 2020 | J | jnl |
IEEE Access
|
| 2017 | J | jnl |
Sensors
|
| 2017 | J | jnl |
IEEE Access
|
| 2017 | C | conf |
IECON
|