| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2023 | J | jnl |
IEEE Trans. Instrum. Meas.
|
| 2022 | J | jnl |
IEEE Trans. Ind. Electron.
|
| 2021 | J | jnl |
Low-Drift MEMS Thermal Wind Sensor With Symmetric Packaging Using Plastic Injection Molding Process.
IEEE Trans. Instrum. Meas.
|
| 2020 | J | jnl |
Comput. Aided Civ. Infrastructure Eng.
|
| 2018 | — | conf |
NEMS
|
| 2018 | — | conf |
NEMS
|
| 2017 | — | conf |
ICEEG
|
| 2015 | — | conf |
ChinaSIP
|
| 2014 | A | conf |
ICME
|
| 2014 | J | jnl |
Multim. Tools Appl.
|
| 2010 | — | conf |
ITSC
|