| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2026 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2026 | J | jnl |
J. Syst. Archit.
|
| 2026 | J | jnl |
ACM Trans. Design Autom. Electr. Syst.
|
| 2026 | A* | conf |
HPCA
|
| 2026 | J | jnl |
IEEE Trans. Computers
|
| 2026 | A* | conf |
HPCA
|
| 2025 | A* | conf |
ICDE
|
| 2025 | C | conf |
ISCAS
|
| 2025 | J | jnl |
Proc. ACM Softw. Eng.
|
| 2025 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2025 | A* | conf |
IJCAI
|
| 2025 | A* | conf |
DAC
|
| 2025 | — | conf |
APPT
|
| 2025 | A | conf |
FAST
|
| 2025 | A | conf |
FAST
|
| 2025 | J | jnl |
CoRR
|
| 2025 | A | conf |
DATE
|
| 2025 | A* | conf |
MICRO
|
| 2025 | J | jnl |
IEEE Trans. Knowl. Data Eng.
|
| 2025 | J | jnl |
CoRR
|
| 2024 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2024 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2024 | J | jnl |
IEEE Trans. Computers
|
| 2024 | A | conf |
ICCAD
|
| 2024 | A* | conf |
HPCA
|
| 2024 | — | conf |
Course Reform Incorporating Ideological and Political Education in Computer Organization and Design.
ACM TUR-C
|
| 2024 | J | jnl |
CoRR
|
| 2024 | — | conf |
WASA (2)
|
| 2024 | A | conf |
ECAI
|
| 2024 | J | jnl |
Microprocess. Microsystems
|
| 2024 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2024 | C | conf |
ICCD
|
| 2024 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2024 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2024 | J | jnl |
ACM Trans. Embed. Comput. Syst.
|
| 2024 | J | jnl |
ACM Trans. Embed. Comput. Syst.
|
| 2024 | A | conf |
DATE
|
| 2023 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2023 | — | conf |
ICANN (4)
|
| 2023 | J | jnl |
Proc. ACM Manag. Data
|
| 2023 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2023 | — | conf |
ACM TUR-C
|
| 2023 | — | conf |
ICA3PP (6)
|
| 2023 | J | jnl |
High Confid. Comput.
|
| 2023 | A* | conf |
DAC
|
| 2023 | A | conf |
ICCAD
|
| 2022 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2022 | J | jnl |
ACM Trans. Embed. Comput. Syst.
|
| 2022 | B | conf |
LCTES
|
| 2022 | C | conf |
ICCD
|
| 2022 | B | conf |
LCTES
|
| 2022 | J | jnl |
Microprocess. Microsystems
|
| 2022 | J | jnl |
IEEE Trans. Computers
|
| 2022 | — | conf |
HPCC/DSS/SmartCity/DependSys
|
| 2022 | B | conf |
LCTES
|
| 2022 | J | jnl |
Microprocess. Microsystems
|
| 2022 | J | jnl |
J. Syst. Archit.
|
| 2022 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2022 | A | conf |
ICCAD
|
| 2022 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2022 | A | conf |
FAST
|
| 2022 | J | jnl |
IEEE Internet Things J.
|
| 2022 | Misc | conf |
CASES
|
| 2021 | J | jnl |
CoRR
|
| 2021 | J | jnl |
J. Syst. Archit.
|
| 2021 | — | conf |
ICA3PP (3)
|
| 2021 | J | jnl |
J. Syst. Archit.
|
| 2021 | C | conf |
ICCD
|
| 2021 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2021 | J | jnl |
Comput. Networks
|
| 2021 | A* | conf |
ICDE
|
| 2021 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2021 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2021 | A* | conf |
DAC
|
| 2021 | J | jnl |
IEEE Trans. Computers
|
| 2020 | J | jnl |
IEEE Internet Things J.
|
| 2020 | A | conf |
ICCAD
|
| 2020 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2020 | — | conf |
HPCC/DSS/SmartCity
|
| 2020 | — | conf |
HPCC/DSS/SmartCity
|
| 2020 | A* | conf |
DAC
|
| 2020 | A* | conf |
DAC
|
| 2020 | J | jnl |
ACM Trans. Design Autom. Electr. Syst.
|
| 2020 | A | conf |
FPGA
|
| 2020 | — | conf |
WASA (1)
|
| 2020 | A* | conf |
DAC
|
| 2020 | A | conf |
DATE
|
| 2020 | Misc | conf |
ICASSP
|
| 2020 | — | conf |
ICESS
|
| 2020 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2019 | — | conf |
ICA3PP (2)
|
| 2019 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2019 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2019 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2019 | A | conf |
DATE
|
| 2019 | — | conf |
ICESS
|
| 2019 | J | jnl |
J. Syst. Archit.
|
| 2019 | A | conf |
ICDCS
|
| 2019 | J | jnl |
ACM Trans. Embed. Comput. Syst.
|
| 2019 | A | conf |
ICCAD
|
| 2019 | — | conf |
ASP-DAC
|
| 2018 | J | jnl |
ACM Trans. Storage
|
| 2018 | J | jnl |
ACM Trans. Embed. Comput. Syst.
|
| 2018 | J | jnl |
ACM Trans. Storage
|
| 2018 | B | conf |
LCTES
|
| 2018 | — | conf |
ASP-DAC
|
| 2018 | — | conf |
NVMSA
|
| 2017 | J | jnl |
ACM Trans. Embed. Comput. Syst.
|
| 2017 | — | conf |
NVMSA
|
| 2017 | A | conf |
FAST
|
| 2016 | J | jnl |
Softw. Pract. Exp.
|
| 2016 | — | conf |
HotStorage
|
| 2015 | — | conf |
ICCPS
|
| 2015 | — | conf |
MSN
|
| 2014 | J | jnl |
Int. J. Embed. Syst.
|
| 2014 | — | conf |
HPCC/CSS/ICESS
|