Zhaowei Zhong

16 papers Misc 1Journal 13Unranked 2
YearRankTypeTitle / Venue / Authors
2024 Misc conf
Quantum Error Corrected Fidelity Routing Design for Long-Distance Quantum Networks.
ICNC
Yuto Lim, Lishuai Yuan, Zhaowei Zhong
2023 J jnl
A customer-centric IoT-based novel closed-loop supply chain model for WEEE management.
Adv. Eng. Informatics
Rui Guo, Zhaowei Zhong
2015 — conf
Nonlinearly enhanced vortex induced vibrations for energy harvesting.
AIM
Bao Huy Huynh, Tegoeh Tjahjowidodo, Zhaowei Zhong, Youyi Wang, Narasimalu Srikanth
2013 — conf
Correlation analysis of cutting force and acoustic emission signals for tool condition monitoring.
ASCC
Zhaowei Zhong, J.-H. Zhou, Ye Nyi Win
2007 J jnl
Dynamic responses and solder joint reliability under board level drop test.
Microelectron. Reliab.
Jing-en Luan, Tong Yan Tee, Eric Pek, Chwee Teck Lim, Zhaowei Zhong
2006 J jnl
Board level solder joint reliability analysis of stacked die mixed flip-chip and wirebond BGA.
Microelectron. Reliab.
Tong Yan Tee, Hun Shen Ng, Zhaowei Zhong
2006 J jnl
Effects of process conditions on reliability, microstructure evolution and failure modes of SnAgCu solder joints.
Microelectron. Reliab.
Periannan Arulvanan, Zhaowei Zhong, Xunqing Shi
2006 J jnl
Huge Proteins in The Human Proteome and Their Participation in Hereditary Diseases.
Silico Biol.
Meena Kishore Sakharkar, Pandjassarame Kangueane, Kishore R. Sakharkar, Zhaowei Zhong
2004 J jnl
Board level solder joint reliability analysis and optimization of pyramidal stacked die BGA packages.
Microelectron. Reliab.
Tong Yan Tee, Zhaowei Zhong
2004 J jnl
Impact life prediction modeling of TFBGA packages under board level drop test.
Microelectron. Reliab.
Tong Yan Tee, Hun Shen Ng, Chwee Teck Lim, Eric Pek, Zhaowei Zhong
2004 J jnl
Integrated vapor pressure, hygroswelling, and thermo-mechanical stress modeling of QFN package during reflow with interfacial fracture mechanics analysis.
Microelectron. Reliab.
Tong Yan Tee, Zhaowei Zhong
2003 J jnl
Board level solder joint reliability modeling and testing of TFBGA packages for telecommunication applications.
Microelectron. Reliab.
Tong Yan Tee, Hun Shen Ng, Daniel Yap, Xavier Baraton, Zhaowei Zhong
2003 J jnl
Comprehensive board-level solder joint reliability modeling and testing of QFN and PowerQFN packages.
Microelectron. Reliab.
Tong Yan Tee, Hun Shen Ng, Daniel Yap, Zhaowei Zhong
2003 J jnl
Design For Board Level Reliability Of A Miniaturized Mems Package: Stacked Die Tqfn.
Int. J. Comput. Eng. Sci.
Tong Yan Tee, Giovanni Frezza, Mayhuan Lim, Hun Shen Ng, Federico Ziglioli, Zhaowei Zhong
2003 J jnl
Reliability assessment and hygroswelling modeling of FCBGA with no-flow underfill.
Microelectron. Reliab.
Tong Yan Tee, Chek Lim Kho, Daniel Yap, Carol Toh, Xavier Baraton, Zhaowei Zhong
2002 J jnl
High resolution AFM scanning Moiré method and its application to the micro-deformation in the BGA electronic package.
Microelectron. Reliab.
Huimin Xie, Anand K. Asundi, Chai Gin Boay, Lu Yunguang, Jin Yu, Zhaowei Zhong, Bryan K. A. Ngoi