| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2026 | J | jnl |
IEEE Wirel. Commun. Lett.
|
| 2026 | J | jnl |
IEEE Internet Things J.
|
| 2026 | J | jnl |
IEEE Trans. Veh. Technol.
|
| 2025 | J | jnl |
IEEE Trans. Intell. Transp. Syst.
|
| 2025 | J | jnl |
CoRR
|
| 2025 | J | jnl |
IEEE Wirel. Commun. Lett.
|
| 2025 | B | conf |
GLOBECOM
|
| 2025 | — | conf |
VTC2025-Fall
|
| 2025 | J | jnl |
IEEE Trans. Veh. Technol.
|
| 2025 | J | jnl |
IEEE Trans. Commun.
|
| 2025 | J | jnl |
IEEE Trans. Aerosp. Electron. Syst.
|
| 2025 | J | jnl |
IEEE Internet Things J.
|
| 2025 | J | jnl |
IEEE Commun. Lett.
|
| 2025 | J | jnl |
IEEE Trans. Veh. Technol.
|
| 2025 | J | jnl |
IEEE Trans. Ind. Informatics
|
| 2025 | J | jnl |
Digit. Signal Process.
|
| 2024 | J | jnl |
IEEE Trans. Instrum. Meas.
|
| 2024 | J | jnl |
IEEE Trans. Veh. Technol.
|
| 2024 | — | conf |
ICVISP
|
| 2024 | J | jnl |
IEEE Trans. Veh. Technol.
|
| 2023 | — | conf |
ICSPCC
|
| 2023 | J | jnl |
IEEE Trans. Aerosp. Electron. Syst.
|
| 2023 | — | conf |
CCHI
|
| 2023 | J | jnl |
IEEE Trans. Pattern Anal. Mach. Intell.
|
| 2022 | A* | conf |
NeurIPS
|
| 2022 | J | jnl |
CoRR
|
| 2021 | J | jnl |
Sci. China Inf. Sci.
|
| 2021 | J | jnl |
IEEE Trans. Intell. Transp. Syst.
|
| 2020 | J | jnl |
IEEE Trans. Veh. Technol.
|
| 2020 | — | conf |
ICC
|
| 2019 | J | jnl |
Wirel. Commun. Mob. Comput.
|
| 2019 | J | jnl |
IEEE Access
|
| 2019 | J | jnl |
Multidimens. Syst. Signal Process.
|
| 2018 | J | jnl |
IEEE Access
|
| 2018 | J | jnl |
Wirel. Commun. Mob. Comput.
|
| 2016 | — | conf |
WOCC
|
| 2009 | Misc | conf |
ICIG
|