Zeyu Sun - RankMe

28 papers A* 1A 3C 1Journal 13Unranked 9

Year	Rank	Type	Title / Venue / Authors
2021	J	`jnl`	A Fast Semi-Analytic Approach for Combined Electromigration and Thermomigration Analysis for General Multisegment Interconnects. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. Liang Chen, Sheldon X.-D. Tan, Zeyu Sun, Shaoyi Peng, Min Tang, Junfa Mao
2020	J	`jnl`	Accelerating Electromigration Aging: Fast Failure Detection for Nanometer ICs. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. Sheriff Sadiqbatcha, Zeyu Sun, Sheldon X.-D. Tan
2020	C	`conf`	EM-GAN: Data-Driven Fast Stress Analysis for Multi-Segment Interconnects. ICCD Wentian Jin, Sheriff Sadiqbatcha, Zeyu Sun, Han Zhou, Sheldon X.-D. Tan
2020	J	`jnl`	Fast Analytic Electromigration Analysis for General Multisegment Interconnect Wires. IEEE Trans. Very Large Scale Integr. Syst. Liang Chen, Sheldon X.-D. Tan, Zeyu Sun, Shaoyi Peng, Min Tang, Junfa Mao
2020	J	`jnl`	Interconnect Electromigration Modeling and Analysis for Nanometer ICs: From Physics to Full-Chip. IPSJ Trans. Syst. LSI Des. Methodol. Sheldon X.-D. Tan, Zeyu Sun, Sheriff Sadiqbatcha
2020	—	`conf`	Reliable Power Grid Network Design Framework Considering EM Immortalities for Multi-Segment Wires. ASP-DAC Han Zhou, Shuyuan Yu, Zeyu Sun, Sheldon X.-D. Tan
2019	—	`conf`	Dynamic Reliability Management for Multi-Core Processor Based on Deep Reinforcement Learning. SMACD Zeyu Sun, Han Zhou, Sheldon X.-D. Tan
2019	J	`jnl`	EM-Aware and Lifetime-Constrained Optimization for Multisegment Power Grid Networks. IEEE Trans. Very Large Scale Integr. Syst. Han Zhou, Zeyu Sun, Sheriff Sadiqbatcha, Naehyuck Chang, Sheldon X.-D. Tan
2019	—	`conf`	Long-Term Reliability Management For Multitasking GPGPUs. SMACD Zeyu Sun, Taeyoung Kim, Marcus Chow, Shaoyi Peng, Han Zhou, Hyoseung Kim, Daniel Wong, Sheldon X.-D. Tan
2019	—	`book`	Long-Term Reliability of Nanometer VLSI Systems, Modeling, Analysis and Optimization. Sheldon X.-D. Tan, Mehdi Baradaran Tahoori, Taeyoung Kim, Shengcheng Wang, Zeyu Sun, Saman Kiamehr
2019	J	`jnl`	Reliability based hardware Trojan design using physics-based electromigration models. Integr. Chase Cook, Sheriff Sadiqbatcha, Zeyu Sun, Sheldon X.-D. Tan
2019	J	`jnl`	Saturation-Volume Estimation for Multisegment Copper Interconnect Wires. IEEE Trans. Very Large Scale Integr. Syst. Zeyu Sun, Sheriff Sadiqbatcha, Hengyang Zhao, Sheldon X.-D. Tan
2018	—	`conf`	Accelerating Electromigration Wear-Out Effects Based on Configurable Sink-Structured Wires. SMACD Sheriff Sadiqbatcha, Chase Cook, Zeyu Sun, Sheldon X.-D. Tan
2018	—	`conf`	Accelerating electromigration aging for fast failure detection for nanometer ICs. ASP-DAC Zeyu Sun, Sheriff Sadiqbatcha, Hengyang Zhao, Sheldon X.-D. Tan
2018	J	`jnl`	Detection of counterfeited ICs via on-chip sensor and post-fabrication authentication policy. Integr. Taeyoung Kim, Sheldon X.-D. Tan, Chase Cook, Zeyu Sun
2018	—	`conf`	Electromigration-lifetime constrained power grid optimization considering multi-segment interconnect wires. ASP-DAC Han Zhou, Yijing Sun, Zeyu Sun, Hengyang Zhao, Sheldon X.-D. Tan
2018	J	`jnl`	Fast Electromigration Immortality Analysis for Multisegment Copper Interconnect Wires. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. Zeyu Sun, Ertugrul Demircan, Mehul D. Shroff, Chase Cook, Sheldon X.-D. Tan
2018	J	`jnl`	Fast Electromigration Stress Evolution Analysis for Interconnect Trees Using Krylov Subspace Method. IEEE Trans. Very Large Scale Integr. Syst. Chase Cook, Zeyu Sun, Ertugrul Demircan, Mehul D. Shroff, Sheldon X.-D. Tan
2018	J	`jnl`	Recent advances in EM and BTI induced reliability modeling, analysis and optimization (invited). Integr. Sheldon X.-D. Tan, Hussam Amrouch, Taeyoung Kim, Zeyu Sun, Chase Cook, Jörg Henkel
2018	J	`jnl`	Recovery-Aware Proactive TSV Repair for Electromigration Lifetime Enhancement in 3-D ICs. IEEE Trans. Very Large Scale Integr. Syst. Shengcheng Wang, Taeyoung Kim, Zeyu Sun, Sheldon X.-D. Tan, Mehdi Baradaran Tahoori
2018	—	`conf`	Reliability Based Hardware Trojan Design Using Physics-Based Electromigration Models. SMACD Chase Cook, Sheriff Sadiqbatcha, Zeyu Sun, Sheldon X.-D. Tan
2017	—	`conf`	Dynamic temperature-aware reliability modeling for multi-branch interconnect trees. ASICON Jiangtao Peng, Hai-Bao Chen, Hengyang Zhao, Zeyu Sun, Sheldon X.-D. Tan
2017	J	`jnl`	Energy and Lifetime Optimizations for Dark Silicon Manycore Microprocessor Considering Both Hard and Soft Errors. IEEE Trans. Very Large Scale Integr. Syst. Taeyoung Kim, Zeyu Sun, Hai-Bao Chen, Hai Wang, Sheldon X.-D. Tan
2017	A	`conf`	Leveraging recovery effect to reduce electromigration degradation in power/ground TSV. ICCAD Shengcheng Wang, Zeyu Sun, Yuan Cheng, Sheldon X.-D. Tan, Mehdi Baradaran Tahoori
2016	A	`conf`	Dynamic reliability management for near-threshold dark silicon processors. ICCAD Taeyoung Kim, Zeyu Sun, Chase Cook, Jagadeesh Gaddipati, Hai Wang, Hai-Bao Chen, Sheldon X.-D. Tan
2016	—	`conf`	Finite difference method for electromigration analysis of multi-branch interconnects. SMACD Chase Cook, Zeyu Sun, Taeyoung Kim, Sheldon X.-D. Tan
2016	A*	`conf`	Invited - Cross-layer modeling and optimization for electromigration induced reliability. DAC Taeyoung Kim, Zeyu Sun, Chase Cook, Hengyang Zhao, Ruiwen Li, Daniel Wong, Sheldon X.-D. Tan
2016	A	`conf`	Voltage-based electromigration immortality check for general multi-branch interconnects. ICCAD Zeyu Sun, Ertugrul Demircan, Mehul D. Shroff, Taeyoung Kim, Xin Huang, Sheldon X.-D. Tan