Zeyu Sun

28 papers A* 1A 3C 1Journal 13Unranked 9
YearRankTypeTitle / Venue / Authors
2021 J jnl
A Fast Semi-Analytic Approach for Combined Electromigration and Thermomigration Analysis for General Multisegment Interconnects.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
Liang Chen, Sheldon X.-D. Tan, Zeyu Sun, Shaoyi Peng, Min Tang, Junfa Mao
2020 J jnl
Accelerating Electromigration Aging: Fast Failure Detection for Nanometer ICs.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
Sheriff Sadiqbatcha, Zeyu Sun, Sheldon X.-D. Tan
2020 C conf
EM-GAN: Data-Driven Fast Stress Analysis for Multi-Segment Interconnects.
ICCD
Wentian Jin, Sheriff Sadiqbatcha, Zeyu Sun, Han Zhou, Sheldon X.-D. Tan
2020 J jnl
Fast Analytic Electromigration Analysis for General Multisegment Interconnect Wires.
IEEE Trans. Very Large Scale Integr. Syst.
Liang Chen, Sheldon X.-D. Tan, Zeyu Sun, Shaoyi Peng, Min Tang, Junfa Mao
2020 J jnl
Interconnect Electromigration Modeling and Analysis for Nanometer ICs: From Physics to Full-Chip.
IPSJ Trans. Syst. LSI Des. Methodol.
Sheldon X.-D. Tan, Zeyu Sun, Sheriff Sadiqbatcha
2020 — conf
Reliable Power Grid Network Design Framework Considering EM Immortalities for Multi-Segment Wires.
ASP-DAC
Han Zhou, Shuyuan Yu, Zeyu Sun, Sheldon X.-D. Tan
2019 — conf
Dynamic Reliability Management for Multi-Core Processor Based on Deep Reinforcement Learning.
SMACD
Zeyu Sun, Han Zhou, Sheldon X.-D. Tan
2019 J jnl
EM-Aware and Lifetime-Constrained Optimization for Multisegment Power Grid Networks.
IEEE Trans. Very Large Scale Integr. Syst.
Han Zhou, Zeyu Sun, Sheriff Sadiqbatcha, Naehyuck Chang, Sheldon X.-D. Tan
2019 — conf
Long-Term Reliability Management For Multitasking GPGPUs.
SMACD
Zeyu Sun, Taeyoung Kim, Marcus Chow, Shaoyi Peng, Han Zhou, Hyoseung Kim, Daniel Wong, Sheldon X.-D. Tan
2019 — book
Long-Term Reliability of Nanometer VLSI Systems, Modeling, Analysis and Optimization.
Sheldon X.-D. Tan, Mehdi Baradaran Tahoori, Taeyoung Kim, Shengcheng Wang, Zeyu Sun, Saman Kiamehr
2019 J jnl
Reliability based hardware Trojan design using physics-based electromigration models.
Integr.
Chase Cook, Sheriff Sadiqbatcha, Zeyu Sun, Sheldon X.-D. Tan
2019 J jnl
Saturation-Volume Estimation for Multisegment Copper Interconnect Wires.
IEEE Trans. Very Large Scale Integr. Syst.
Zeyu Sun, Sheriff Sadiqbatcha, Hengyang Zhao, Sheldon X.-D. Tan
2018 — conf
Accelerating Electromigration Wear-Out Effects Based on Configurable Sink-Structured Wires.
SMACD
Sheriff Sadiqbatcha, Chase Cook, Zeyu Sun, Sheldon X.-D. Tan
2018 — conf
Accelerating electromigration aging for fast failure detection for nanometer ICs.
ASP-DAC
Zeyu Sun, Sheriff Sadiqbatcha, Hengyang Zhao, Sheldon X.-D. Tan
2018 J jnl
Detection of counterfeited ICs via on-chip sensor and post-fabrication authentication policy.
Integr.
Taeyoung Kim, Sheldon X.-D. Tan, Chase Cook, Zeyu Sun
2018 — conf
Electromigration-lifetime constrained power grid optimization considering multi-segment interconnect wires.
ASP-DAC
Han Zhou, Yijing Sun, Zeyu Sun, Hengyang Zhao, Sheldon X.-D. Tan
2018 J jnl
Fast Electromigration Immortality Analysis for Multisegment Copper Interconnect Wires.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
Zeyu Sun, Ertugrul Demircan, Mehul D. Shroff, Chase Cook, Sheldon X.-D. Tan
2018 J jnl
Fast Electromigration Stress Evolution Analysis for Interconnect Trees Using Krylov Subspace Method.
IEEE Trans. Very Large Scale Integr. Syst.
Chase Cook, Zeyu Sun, Ertugrul Demircan, Mehul D. Shroff, Sheldon X.-D. Tan
2018 J jnl
Recent advances in EM and BTI induced reliability modeling, analysis and optimization (invited).
Integr.
Sheldon X.-D. Tan, Hussam Amrouch, Taeyoung Kim, Zeyu Sun, Chase Cook, Jörg Henkel
2018 J jnl
Recovery-Aware Proactive TSV Repair for Electromigration Lifetime Enhancement in 3-D ICs.
IEEE Trans. Very Large Scale Integr. Syst.
Shengcheng Wang, Taeyoung Kim, Zeyu Sun, Sheldon X.-D. Tan, Mehdi Baradaran Tahoori
2018 — conf
Reliability Based Hardware Trojan Design Using Physics-Based Electromigration Models.
SMACD
Chase Cook, Sheriff Sadiqbatcha, Zeyu Sun, Sheldon X.-D. Tan
2017 — conf
Dynamic temperature-aware reliability modeling for multi-branch interconnect trees.
ASICON
Jiangtao Peng, Hai-Bao Chen, Hengyang Zhao, Zeyu Sun, Sheldon X.-D. Tan
2017 J jnl
Energy and Lifetime Optimizations for Dark Silicon Manycore Microprocessor Considering Both Hard and Soft Errors.
IEEE Trans. Very Large Scale Integr. Syst.
Taeyoung Kim, Zeyu Sun, Hai-Bao Chen, Hai Wang, Sheldon X.-D. Tan
2017 A conf
Leveraging recovery effect to reduce electromigration degradation in power/ground TSV.
ICCAD
Shengcheng Wang, Zeyu Sun, Yuan Cheng, Sheldon X.-D. Tan, Mehdi Baradaran Tahoori
2016 A conf
Dynamic reliability management for near-threshold dark silicon processors.
ICCAD
Taeyoung Kim, Zeyu Sun, Chase Cook, Jagadeesh Gaddipati, Hai Wang, Hai-Bao Chen, Sheldon X.-D. Tan
2016 — conf
Finite difference method for electromigration analysis of multi-branch interconnects.
SMACD
Chase Cook, Zeyu Sun, Taeyoung Kim, Sheldon X.-D. Tan
2016 A* conf
Invited - Cross-layer modeling and optimization for electromigration induced reliability.
DAC
Taeyoung Kim, Zeyu Sun, Chase Cook, Hengyang Zhao, Ruiwen Li, Daniel Wong, Sheldon X.-D. Tan
2016 A conf
Voltage-based electromigration immortality check for general multi-branch interconnects.
ICCAD
Zeyu Sun, Ertugrul Demircan, Mehul D. Shroff, Taeyoung Kim, Xin Huang, Sheldon X.-D. Tan