| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2026 | A* | conf |
AAAI
|
| 2025 | J | jnl |
CoRR
|
| 2025 | A* | conf |
IJCAI
|
| 2025 | J | jnl |
CoRR
|
| 2025 | A | conf |
ICME
|
| 2025 | J | jnl |
CoRR
|
| 2025 | Misc | conf |
ICASSP
|
| 2025 | J | jnl |
CoRR
|
| 2025 | J | jnl |
CoRR
|
| 2024 | C | conf |
TENCON
|
| 2024 | B | conf |
IJCNN
|
| 2024 | C | conf |
TENCON
|
| 2024 | A* | conf |
AAAI
|
| 2024 | C | conf |
TENCON
|
| 2023 | A* | conf |
ACM Multimedia
|
| 2023 | J | jnl |
CoRR
|
| 2023 | J | jnl |
IEEE Trans. Instrum. Meas.
|
| 2023 | J | jnl |
CoRR
|
| 2023 | C | conf |
VCIP
|
| 2023 | J | jnl |
CoRR
|
| 2023 | C | conf |
IECON
|
| 2022 | J | jnl |
IEEE Trans. Image Process.
|
| 2022 | — | conf |
ICDTE
|
| 2022 | J | jnl |
IEEE Trans. Image Process.
|
| 2021 | Misc | conf |
ICASSP
|
| 2021 | J | jnl |
CoRR
|
| 2021 | J | jnl |
CoRR
|
| 2020 | C | conf |
VCIP
|
| 2020 | — | conf |
Seal Integrity Testing Utilizing Non-Destructive Capacitive Sensing for Product Packaging Assurance.
IEEE SENSORS
|
| 2016 | J | jnl |
IEICE Trans. Electron.
|