| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2025 | J | jnl |
Wirel. Pers. Commun.
|
| 2025 | J | jnl |
IEEE Access
|
| 2025 | J | jnl |
Clust. Comput.
|
| 2025 | J | jnl |
Wirel. Networks
|
| 2025 | J | jnl |
J. Supercomput.
|
| 2025 | J | jnl |
Integr.
|
| 2024 | J | jnl |
IEEE Access
|
| 2024 | J | jnl |
J. Supercomput.
|
| 2024 | J | jnl |
Sensors
|
| 2023 | J | jnl |
J. Supercomput.
|
| 2023 | J | jnl |
Comput. Networks
|
| 2023 | J | jnl |
J. Supercomput.
|
| 2023 | Misc | conf |
CSICC
|
| 2023 | J | jnl |
Comput. Networks
|
| 2022 | J | jnl |
Ad Hoc Sens. Wirel. Networks
|
| 2022 | J | jnl |
IEEE Access
|
| 2022 | J | jnl |
J. Supercomput.
|
| 2022 | J | jnl |
Ad Hoc Sens. Wirel. Networks
|
| 2022 | J | jnl |
IEEE Access
|
| 2021 | J | jnl |
J. Electron. Test.
|
| 2021 | — | conf |
NAS
|
| 2021 | J | jnl |
J. Supercomput.
|
| 2021 | J | jnl |
J. Supercomput.
|
| 2019 | J | jnl |
CoRR
|
| 2019 | J | jnl |
Integr.
|
| 2018 | J | jnl |
Microprocess. Microsystems
|
| 2018 | — | conf |
DASC/PiCom/DataCom/CyberSciTech
|
| 2017 | — | conf |
HLDVT
|
| 2017 | J | jnl |
Microprocess. Microsystems
|
| 2017 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2016 | Misc | conf |
EDCC
|
| 2016 | C | conf |
IOLTS
|
| 2016 | J | jnl |
Microelectron. Reliab.
|
| 2015 | B | conf |
IM
|
| 2015 | — | conf |
ICA3PP (3)
|
| 2015 | — | conf |
CIT/IUCC/DASC/PICom
|
| 2015 | — | conf |
ReCoSoC
|
| 2013 | — | conf |
ISSoC
|