Z. W. Zhong

15 papers Journal 12Unranked 3
YearRankTypeTitle / Venue / Authors
2015 — conf
Studies of Air Transport Management Issues for the Airport and Region.
CE
Z. W. Zhong, Y. Y. Tee, Y. J. Lin
2011 J jnl
Overview of wire bonding using copper wire or insulated wire.
Microelectron. Reliab.
Z. W. Zhong
2009 J jnl
A deterministic way of planning and controlling biped walking of LOCH humanoid robot.
Ind. Robot
Ming Xie, Z. W. Zhong, L. Zhang, L. B. Xian, L. Wang, H. J. Yang, C. S. Song, J. Li
2009 J jnl
Overview of Board-Level Solder Joint Reliability Modeling for Single Die and Stacked Die CSPs.
Proc. IEEE
Z. W. Zhong, T. Y. Tee
2008 — conf
Design of Dexterous Arm-Hand for Human-Assisted Manipulation.
ICIRA (2)
L. Wang, M. Xie, Z. W. Zhong, H. J. Yang, J. Li
2008 — conf
Self learning of gravity compensation by LOCH humanoid robot.
Humanoids
Ming Xie, Z. W. Zhong, L. Zhang, H. J. Yang, C. S. Song, J. Li, L. B. Xian, L. Wang
2006 J jnl
A rule-based computing approach for the segmentation of semiconductor defects.
Microelectron. J.
N. G. Shankar, Z. W. Zhong
2006 J jnl
Chemical mechanical polishing of polymeric materials for MEMS applications.
Microelectron. J.
Z. W. Zhong, Z. F. Wang, Y. H. Tan
2006 J jnl
Improved segmentation of semiconductor defects using area sieves.
Mach. Vis. Appl.
N. G. Shankar, Z. W. Zhong
2006 J jnl
Investigation of ultrasonic vibrations of wire-bonding capillaries.
Microelectron. J.
Z. W. Zhong, K. S. Goh
2005 J jnl
A new rule-based clustering technique for defect analysis.
Microelectron. J.
N. G. Shankar, Z. W. Zhong
2005 J jnl
Effects of thermally induced optical fiber shifts in V-groove arrays for optical MEMS.
Microelectron. J.
Z. W. Zhong, S. C. Lim, Anand K. Asundi
2004 J jnl
Optimization of tool change timing in a nut forming process using genetic algorithms.
J. Intell. Manuf.
Yinghong Guang, Z. W. Zhong, Zhengtao Ding
2003 J jnl
Characterisation Of Electroplated Eutectic Sn-Ag Solder.
Int. J. Comput. Eng. Sci.
Z. W. Zhong, K. C. Chan, Y. H. Chen
2003 J jnl
New Development To Extend The Tool Life Of Ceramic Bonding Tools.
Int. J. Comput. Eng. Sci.
Z. W. Zhong, K. S. Goh