| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2026 | J | jnl |
CoRR
|
| 2026 | J | jnl |
Neurocomputing
|
| 2026 | J | jnl |
Displays
|
| 2026 | J | jnl |
CoRR
|
| 2025 | — | conf |
ASPLOS (2)
|
| 2025 | A* | conf |
SIGGRAPH Asia
|
| 2025 | — | conf |
PAKDD (2)
|
| 2025 | J | jnl |
Comput. Electron. Agric.
|
| 2025 | J | jnl |
IEEE J. Sel. Top. Appl. Earth Obs. Remote. Sens.
|
| 2025 | B | conf |
IEEE Big Data
|
| 2024 | J | jnl |
IEEE Internet Things J.
|
| 2024 | — | conf |
ICCT
|
| 2024 | J | jnl |
Sensors
|
| 2024 | B | conf |
SPAA
|
| 2024 | — | conf |
CICC
|
| 2024 | J | jnl |
IEEE Trans. Cogn. Commun. Netw.
|
| 2024 | — | conf |
ACAI
|
| 2024 | J | jnl |
Displays
|
| 2024 | Misc | conf |
RTNS
|
| 2024 | A* | conf |
OSDI
|
| 2024 | J | jnl |
Remote. Sens.
|
| 2024 | J | jnl |
Sensors
|
| 2023 | — | conf |
AIPR
|
| 2023 | J | jnl |
Displays
|
| 2023 | — | conf |
IFTC (1)
|
| 2023 | J | jnl |
CoRR
|
| 2023 | A* | conf |
OSDI
|
| 2023 | J | jnl |
IEEE Trans. Veh. Technol.
|
| 2023 | A | conf |
CIKM
|
| 2023 | — | conf |
IFTC (1)
|
| 2023 | — | conf |
CICAI (1)
|
| 2023 | — | conf |
AIPR
|
| 2023 | — | conf |
CICAI (1)
|
| 2023 | — | conf |
IFTC (1)
|
| 2023 | J | jnl |
IEEE Trans. Cloud Comput.
|
| 2022 | J | jnl |
IEEE J. Solid State Circuits
|
| 2022 | J | jnl |
IEEE Trans. Instrum. Meas.
|
| 2022 | J | jnl |
Comput. Networks
|
| 2022 | A | conf |
ICME
|
| 2022 | J | jnl |
IEEE Signal Process. Lett.
|
| 2021 | — | conf |
ISSCC
|
| 2021 | — | conf |
VLSI Circuits
|
| 2021 | J | jnl |
IEEE Trans. Aerosp. Electron. Syst.
|
| 2021 | J | jnl |
IEEE Access
|
| 2021 | J | jnl |
Wirel. Commun. Mob. Comput.
|
| 2020 | J | jnl |
IEEE Access
|
| 2019 | J | jnl |
IEEE Trans. Circuits Syst. I Regul. Pap.
|
| 2019 | J | jnl |
Signal Process. Image Commun.
|
| 2019 | J | jnl |
IEEE Access
|
| 2019 | J | jnl |
IEEE Commun. Lett.
|
| 2019 | J | jnl |
IEEE Access
|
| 2019 | J | jnl |
Comput. Electron. Agric.
|
| 2018 | A* | conf |
HPCA
|
| 2018 | J | jnl |
Phys. Commun.
|
| 2018 | J | jnl |
J. Comput. Sci. Technol.
|
| 2018 | — | conf |
IFTC
|
| 2017 | — | conf |
CSPS
|
| 2017 | — | conf |
VLSI-DAT
|
| 2017 | — | conf |
CSPS
|
| 2017 | J | jnl |
IEEE Trans. Cloud Comput.
|
| 2017 | A* | conf |
HPCA
|
| 2016 | J | jnl |
Comput. Electron. Agric.
|
| 2016 | J | jnl |
J. Netw. Syst. Manag.
|
| 2015 | — | conf |
VLSI-DAT
|
| 2015 | A* | conf |
CCS
|
| 2014 | J | jnl |
IEEE Trans. Circuits Syst. I Regul. Pap.
|
| 2014 | A* | conf |
HPCA
|
| 2013 | A* | conf |
HPCA
|
| 2013 | J | jnl |
Comput. Electr. Eng.
|
| 2013 | J | jnl |
J. Networks
|
| 2012 | A | conf |
DSN
|
| 2012 | — | conf |
DSN Workshops
|
| 2012 | — | conf |
ICICA (1)
|
| 2011 | — | conf |
CHINACOM
|
| 2010 | — | conf |
APCCAS
|
| 2010 | — | conf |
ISIA
|