| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2026 | J | jnl |
IEEE Trans. Circuits Syst. Video Technol.
|
| 2026 | J | jnl |
IEEE Trans. Emerg. Top. Comput. Intell.
|
| 2025 | J | jnl |
IEEE Trans. Ind. Informatics
|
| 2025 | J | jnl |
IEEE Trans. Image Process.
|
| 2025 | J | jnl |
IEEE Trans. Instrum. Meas.
|
| 2025 | J | jnl |
IEEE Trans. Reliab.
|
| 2025 | J | jnl |
IEEE Trans. Multim.
|
| 2025 | J | jnl |
IEEE Trans. Image Process.
|
| 2024 | J | jnl |
IEEE Trans. Ind. Informatics
|
| 2024 | J | jnl |
IEEE Trans. Image Process.
|
| 2024 | J | jnl |
IEEE Trans. Circuits Syst. Video Technol.
|
| 2024 | J | jnl |
IEEE Trans. Medical Imaging
|
| 2024 | J | jnl |
IEEE Trans. Circuits Syst. II Express Briefs
|
| 2023 | J | jnl |
IEEE Trans. Instrum. Meas.
|
| 2023 | J | jnl |
IEEE Trans. Circuits Syst. Video Technol.
|
| 2023 | J | jnl |
IEEE Trans. Multim.
|
| 2023 | J | jnl |
IEEE Trans. Cybern.
|
| 2023 | J | jnl |
IEEE Trans. Pattern Anal. Mach. Intell.
|
| 2023 | J | jnl |
IEEE Trans. Ind. Informatics
|
| 2022 | J | jnl |
J. Intell. Robotic Syst.
|
| 2022 | J | jnl |
IEEE Trans. Instrum. Meas.
|
| 2022 | — | conf |
CSE
|
| 2022 | J | jnl |
IEEE Trans. Instrum. Meas.
|
| 2022 | J | jnl |
MRSDI-CNN: Multi-Model Rail Surface Defect Inspection System Based on Convolutional Neural Networks.
IEEE Trans. Intell. Transp. Syst.
|
| 2022 | — | conf |
ASCC
|
| 2022 | J | jnl |
IEEE Trans. Emerg. Top. Comput. Intell.
|
| 2022 | J | jnl |
Eng. Appl. Artif. Intell.
|
| 2022 | J | jnl |
IEEE Trans. Ind. Electron.
|
| 2022 | J | jnl |
IEEE Trans. Instrum. Meas.
|
| 2022 | J | jnl |
IEEE Trans. Instrum. Meas.
|
| 2021 | J | jnl |
IEEE Trans. Medical Imaging
|
| 2021 | — | conf |
ICIG (1)
|
| 2019 | J | jnl |
IEEE Access
|