| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2025 | J | jnl |
IEEE Trans. Circuits Syst. I Regul. Pap.
|
| 2025 | J | jnl |
J. Comput. Inf. Sci. Eng.
|
| 2025 | J | jnl |
Proc. ACM Interact. Mob. Wearable Ubiquitous Technol.
|
| 2025 | A* | conf |
MobiCom
|
| 2024 | C | conf |
ISCAS
|
| 2024 | — | conf |
A-SSCC
|
| 2024 | J | jnl |
CoRR
|
| 2024 | J | jnl |
CoRR
|
| 2024 | J | jnl |
CoRR
|
| 2024 | J | jnl |
Proc. ACM Interact. Mob. Wearable Ubiquitous Technol.
|
| 2024 | J | jnl |
IEEE J. Solid State Circuits
|
| 2024 | — | conf |
High Speed SPAD Active Quenching and Reset Chipset in 55nm BCDLite Process for Quantum Applications.
IEEE SENSORS
|
| 2024 | J | jnl |
CoRR
|
| 2024 | — | conf |
A-SSCC
|
| 2023 | — | conf |
CICC
|
| 2023 | J | jnl |
IEEE J. Solid State Circuits
|
| 2023 | J | jnl |
CoRR
|
| 2022 | J | jnl |
IEEE J. Solid State Circuits
|
| 2022 | J | jnl |
IEEE J. Solid State Circuits
|
| 2022 | — | conf |
ISSCC
|
| 2022 | J | jnl |
Entropy
|
| 2021 | — | conf |
VLSI Circuits
|
| 2021 | — | conf |
CICC
|
| 2021 | — | conf |
CICC
|
| 2021 | — | conf |
BIC
|
| 2020 | — | conf |
ISSCC
|
| 2020 | A | conf |
DATE
|