| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2023 | J | jnl |
IEEE Trans. Circuits Syst. II Express Briefs
|
| 2022 | J | jnl |
IEEE Trans. Circuits Syst. II Express Briefs
|
| 2021 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2021 | J | jnl |
IEEE Access
|
| 2020 | — | conf |
IRPS
|
| 2020 | J | jnl |
IEEE Access
|
| 2020 | J | jnl |
IEEE Access
|
| 2019 | — | conf |
IRPS
|
| 2019 | — | conf |
IRPS
|
| 2019 | J | jnl |
IEEE Access
|
| 2018 | J | jnl |
Microelectron. Reliab.
|
| 2018 | J | jnl |
The experimental analysis and the mechanical model for the debonding failure of TSV-Cu/Si interface.
Microelectron. Reliab.
|
| 2017 | J | jnl |
IEEE Trans. Instrum. Meas.
|
| 2017 | — | conf |
QRS Companion
|
| 2017 | J | jnl |
Microelectron. Reliab.
|
| 2015 | — | conf |
IRPS
|
| 2010 | J | jnl |
Microelectron. Reliab.
|
| 2008 | — | conf |
APCCAS
|