| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2026 | J | jnl |
IET Image Process.
|
| 2026 | J | jnl |
CoRR
|
| 2026 | J | jnl |
IEEE Trans. Mob. Comput.
|
| 2026 | J | jnl |
IEEE Trans. Netw. Sci. Eng.
|
| 2025 | J | jnl |
Inf.
|
| 2025 | J | jnl |
Appl. Soft Comput.
|
| 2025 | J | jnl |
Neural Networks
|
| 2025 | J | jnl |
Sci. China Inf. Sci.
|
| 2025 | J | jnl |
Microelectron. J.
|
| 2025 | J | jnl |
IEEE Trans. Knowl. Data Eng.
|
| 2025 | B | conf |
GLOBECOM
|
| 2025 | B | conf |
GLOBECOM
|
| 2025 | J | jnl |
Graph. Model.
|
| 2025 | J | jnl |
IEEE Trans. Wirel. Commun.
|
| 2025 | J | jnl |
IEEE Trans. Mob. Comput.
|
| 2025 | J | jnl |
Expert Syst. Appl.
|
| 2025 | J | jnl |
IEEE Trans. Netw.
|
| 2025 | J | jnl |
Microelectron. J.
|
| 2025 | J | jnl |
IEEE Trans. Mob. Comput.
|
| 2025 | J | jnl |
Microelectron. J.
|
| 2025 | J | jnl |
LCGC: Learning from Consistency Gradient Conflicting for Class-Imbalanced Semi-Supervised Debiasing.
CoRR
|
| 2025 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2025 | — | conf |
ICC
|
| 2025 | A* | conf |
AAAI
|
| 2025 | J | jnl |
IEEE Internet Things J.
|
| 2025 | J | jnl |
Ad Hoc Networks
|
| 2025 | J | jnl |
IEEE Trans. Cogn. Commun. Netw.
|
| 2025 | — | conf |
ICC
|
| 2025 | J | jnl |
Phys. Commun.
|
| 2024 | — | conf |
ISAIMS
|
| 2024 | J | jnl |
Adv. Eng. Softw.
|
| 2024 | A | conf |
DATE
|
| 2024 | J | jnl |
IEEE J. Sel. Top. Signal Process.
|
| 2024 | J | jnl |
Symmetry
|
| 2024 | — | conf |
ISAIMS
|
| 2024 | B | conf |
GLOBECOM
|
| 2024 | — | conf |
VTC Spring
|
| 2024 | J | jnl |
BMC Medical Imaging
|
| 2024 | J | jnl |
Digit. Signal Process.
|
| 2024 | J | jnl |
CoRR
|
| 2024 | J | jnl |
CoRR
|
| 2024 | J | jnl |
CoRR
|
| 2024 | J | jnl |
IEEE Signal Process. Lett.
|
| 2024 | J | jnl |
CoRR
|
| 2024 | A* | conf |
NeurIPS
|
| 2024 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2024 | J | jnl |
Microelectron. J.
|
| 2024 | J | jnl |
IEEE Trans. Mob. Comput.
|
| 2024 | B | conf |
GLOBECOM
|
| 2024 | J | jnl |
IEEE Internet Things J.
|
| 2024 | J | jnl |
CoRR
|
| 2024 | — | conf |
ISAIMS
|
| 2024 | — | conf |
ISAIMS
|
| 2024 | J | jnl |
Multim. Tools Appl.
|
| 2024 | — | conf |
ICCIP
|
| 2024 | J | jnl |
IEEE Trans. Netw. Serv. Manag.
|
| 2024 | C | conf |
ICCD
|
| 2024 | C | conf |
FIE
|
| 2024 | — | conf |
Wireless and Stretchable Multichannel Neural Interface Device Based on Conformal Parylene Thin-Film.
BioCAS
|
| 2023 | — | conf |
ASICON
|
| 2023 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2023 | — | conf |
ASICON
|
| 2023 | J | jnl |
ATT-TA: A Cooperative Multiagent Deep Reinforcement Learning Approach for TSV Assignment in 3-D ICs.
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2023 | J | jnl |
IEEE Netw.
|
| 2023 | J | jnl |
Digit. Commun. Networks
|
| 2023 | J | jnl |
Microelectron. J.
|
| 2023 | — | conf |
INFOCOM Workshops
|
| 2023 | J | jnl |
Neural Comput. Appl.
|
| 2023 | — | conf |
ASICON
|
| 2023 | J | jnl |
IEEE Robotics Autom. Lett.
|
| 2023 | J | jnl |
Microelectron. J.
|
| 2023 | — | conf |
ADMA (1)
|
| 2023 | B | conf |
GLOBECOM
|
| 2023 | — | conf |
ACL (Findings)
|
| 2023 | J | jnl |
ACM Trans. Design Autom. Electr. Syst.
|
| 2023 | J | jnl |
IEEE Trans. Mob. Comput.
|
| 2023 | — | conf |
SemEval@ACL
|
| 2023 | — | conf |
NTCIR
|
| 2023 | J | jnl |
Microelectron. J.
|
| 2023 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2022 | J | jnl |
Microelectron. J.
|
| 2022 | J | jnl |
An augmented small-signal model of InP HBT with its analytical-based parameter extraction technique.
Microelectron. J.
|
| 2022 | J | jnl |
Sensors
|
| 2022 | J | jnl |
J. Syst. Control. Eng.
|
| 2022 | J | jnl |
IEEE Trans. Cloud Comput.
|
| 2022 | J | jnl |
IEEE Robotics Autom. Lett.
|
| 2022 | J | jnl |
Comput. Ind.
|
| 2022 | C | conf |
CoDIT
|
| 2022 | J | jnl |
Algorithms
|
| 2022 | J | jnl |
IEEE Trans. Signal Process.
|
| 2022 | J | jnl |
Microelectron. J.
|
| 2022 | J | jnl |
Remote. Sens.
|
| 2021 | — | conf |
ICTA
|
| 2021 | — | conf |
ICTA
|
| 2021 | — | conf |
ICTA
|
| 2021 | J | jnl |
Future Gener. Comput. Syst.
|
| 2021 | J | jnl |
IEEE Trans. Engineering Management
|
| 2021 | J | jnl |
IEEE CAA J. Autom. Sinica
|
| 2021 | J | jnl |
Wirel. Commun. Mob. Comput.
|
| 2021 | J | jnl |
IEEE Access
|
| 2021 | J | jnl |
IEEE Netw.
|
| 2021 | J | jnl |
Algorithms
|
| 2021 | J | jnl |
IEEE Internet Things J.
|
| 2021 | B | conf |
IWQoS
|
| 2020 | J | jnl |
IEEE Access
|
| 2020 | J | jnl |
IEEE Access
|
| 2020 | J | jnl |
Comput. Commun.
|
| 2020 | J | jnl |
IEEE Access
|
| 2020 | C | conf |
FIE
|
| 2020 | J | jnl |
IEEE Access
|
| 2020 | J | jnl |
IEEE Access
|
| 2020 | J | jnl |
Remote. Sens.
|
| 2020 | J | jnl |
IEEE Access
|
| 2020 | B | conf |
IWCMC
|
| 2020 | J | jnl |
IEEE Trans. Wirel. Commun.
|
| 2020 | J | jnl |
IEEE Access
|
| 2020 | J | jnl |
IEEE Trans Autom. Sci. Eng.
|
| 2020 | J | jnl |
IEEE Trans. Instrum. Meas.
|
| 2019 | J | jnl |
IEEE Robotics Autom. Lett.
|
| 2019 | — | conf |
ICC
|
| 2019 | J | jnl |
IEEE Trans. Netw. Serv. Manag.
|
| 2019 | J | jnl |
Int. J. Fuzzy Syst.
|
| 2019 | — | conf |
ASICON
|
| 2019 | J | jnl |
IEEE Netw.
|
| 2019 | J | jnl |
IEEE Robotics Autom. Lett.
|
| 2019 | J | jnl |
IEEE Robotics Autom. Lett.
|
| 2019 | J | jnl |
IEEE Access
|
| 2019 | J | jnl |
IEEE Internet Things J.
|
| 2018 | J | jnl |
IEEE Trans. Intell. Transp. Syst.
|
| 2018 | J | jnl |
IEICE Electron. Express
|
| 2018 | J | jnl |
IEICE Electron. Express
|
| 2018 | — | conf |
PLANS
|
| 2018 | — | conf |
PLANS
|
| 2018 | J | jnl |
J. Circuits Syst. Comput.
|
| 2018 | J | jnl |
Graph. Model.
|
| 2018 | J | jnl |
IEEE Trans. Intell. Transp. Syst.
|
| 2018 | J | jnl |
J. Intell. Fuzzy Syst.
|
| 2018 | — | conf |
ADHIP
|
| 2017 | J | jnl |
IEEE Signal Process. Lett.
|
| 2017 | J | jnl |
Microelectron. Reliab.
|
| 2017 | J | jnl |
Clust. Comput.
|
| 2017 | J | jnl |
J. Intell. Manuf.
|
| 2017 | A* | conf |
ICRA
|
| 2016 | J | jnl |
J. Circuits Syst. Comput.
|
| 2016 | — | conf |
AIM
|
| 2016 | — | conf |
AIM
|
| 2016 | C | conf |
IECON
|
| 2016 | — | conf |
MLICOM
|
| 2015 | — | conf |
CASE
|
| 2015 | J | jnl |
IEEE Trans Autom. Sci. Eng.
|
| 2015 | — | conf |
ASICON
|
| 2015 | — | conf |
CASE
|
| 2015 | — | conf |
WCSP
|
| 2015 | — | conf |
AIM
|
| 2015 | J | jnl |
Neurocomputing
|
| 2015 | — | conf |
ISIE
|
| 2015 | J | jnl |
IEEE Trans Autom. Sci. Eng.
|
| 2015 | J | jnl |
Int. J. Commun. Syst.
|
| 2015 | — | conf |
AIM
|
| 2015 | — | conf |
Welding parameter optimization based on Gaussian process regression Bayesian optimization algorithm.
CASE
|
| 2014 | — | conf |
AIM
|
| 2014 | J | jnl |
Syst. Control. Lett.
|
| 2014 | A | conf |
ICME
|
| 2014 | — | conf |
AIM
|
| 2014 | B | conf |
VRST
|
| 2013 | — | conf |
ICNSC
|
| 2013 | — | conf |
CASE
|
| 2013 | — | conf |
I2MTC
|
| 2013 | J | jnl |
Mach. Vis. Appl.
|
| 2013 | C | conf |
ACC
|
| 2013 | B | conf |
WCNC
|
| 2013 | C | conf |
IECON
|
| 2013 | — | conf |
I2MTC
|
| 2013 | — | conf |
I2MTC
|
| 2013 | C | conf |
IECON
|
| 2012 | J | jnl |
Autom.
|
| 2012 | — | conf |
ISIE
|
| 2012 | — | conf |
ISIE
|
| 2012 | J | jnl |
Mach. Vis. Appl.
|
| 2012 | J | jnl |
Microelectron. Reliab.
|
| 2011 | — | conf |
CMC
|
| 2011 | J | jnl |
Microelectron. Reliab.
|
| 2011 | J | jnl |
Int. J. Model. Identif. Control.
|
| 2011 | — | conf |
EMEIT
|
| 2010 | — | conf |
WCSP
|
| 2010 | J | jnl |
J. Electr. Comput. Eng.
|
| 2010 | J | jnl |
IEEE Trans Autom. Sci. Eng.
|
| 2010 | J | jnl |
IEEE Trans. Control. Syst. Technol.
|
| 2009 | J | jnl |
IEEE Trans Autom. Sci. Eng.
|
| 2008 | J | jnl |
Sci. China Ser. F Inf. Sci.
|
| 2008 | — | conf |
CASE
|
| 2008 | J | jnl |
J. Circuits Syst. Comput.
|
| 2007 | — | conf |
CASE
|
| 2005 | — | conf |
ICNC (3)
|
| 2004 | C | conf |
ACC
|
| 2004 | J | jnl |
Autom.
|
| 2000 | J | jnl |
Discret. Math.
|
| 2000 | C | conf |
ACC
|