| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2026 | J | jnl |
IEEE Access
|
| 2026 | J | jnl |
Expert Syst. Appl.
|
| 2026 | J | jnl |
IEEE Trans. Ind. Electron.
|
| 2026 | J | jnl |
Expert Syst. Appl.
|
| 2026 | J | jnl |
Phys. Commun.
|
| 2026 | A* | conf |
AAAI
|
| 2025 | J | jnl |
CoRR
|
| 2025 | J | jnl |
Eng. Appl. Artif. Intell.
|
| 2025 | J | jnl |
Comput. Vis. Media
|
| 2025 | J | jnl |
Comput. Stand. Interfaces
|
| 2025 | J | jnl |
Digit. Signal Process.
|
| 2025 | J | jnl |
IEEE Trans. Medical Imaging
|
| 2025 | C | conf |
ISCAS
|
| 2025 | J | jnl |
CoRR
|
| 2025 | A* | conf |
EMNLP
|
| 2025 | J | jnl |
CoRR
|
| 2025 | — | conf |
MICCAI (6)
|
| 2025 | A* | conf |
CVPR
|
| 2025 | J | jnl |
IEEE Commun. Lett.
|
| 2025 | J | jnl |
Inf. Sci.
|
| 2025 | J | jnl |
IET Image Process.
|
| 2025 | J | jnl |
CoRR
|
| 2025 | A* | conf |
AAAI
|
| 2025 | J | jnl |
Comput. Electron. Agric.
|
| 2025 | J | jnl |
CoRR
|
| 2025 | — | conf |
RFID-TA
|
| 2025 | A | conf |
ICCAD
|
| 2024 | J | jnl |
Neurocomputing
|
| 2024 | — | conf |
BIC
|
| 2024 | — | conf |
DSPP (2)
|
| 2024 | — | conf |
ICBASE
|
| 2024 | J | jnl |
Sensors
|
| 2024 | — | conf |
MICAD
|
| 2024 | J | jnl |
IEEE Trans. Veh. Technol.
|
| 2024 | J | jnl |
CoRR
|
| 2024 | J | jnl |
CoRR
|
| 2024 | J | jnl |
CoRR
|
| 2024 | A | conf |
ECAI
|
| 2024 | — | conf |
RFID-TA
|
| 2024 | J | jnl |
Image Vis. Comput.
|
| 2024 | — | conf |
CISP-BMEI
|
| 2024 | J | jnl |
Entropy
|
| 2024 | J | jnl |
Eng. Appl. Artif. Intell.
|
| 2024 | J | jnl |
CoRR
|
| 2024 | Misc | conf |
ICASSP
|
| 2023 | J | jnl |
IEEE Trans. Instrum. Meas.
|
| 2023 | — | conf |
DMBD (2)
|
| 2023 | — | conf |
APSIPA ASC
|
| 2023 | J | jnl |
Sensors
|
| 2023 | J | jnl |
CoRR
|
| 2023 | — | conf |
ACL (1)
|
| 2023 | — | conf |
CSAI
|
| 2022 | J | jnl |
IEEE Trans. Instrum. Meas.
|
| 2022 | J | jnl |
Appl. Math. Comput.
|
| 2022 | J | jnl |
IEEE Trans. Intell. Transp. Syst.
|
| 2022 | A* | conf |
NeurIPS
|
| 2021 | J | jnl |
IEEE Trans. Instrum. Meas.
|
| 2021 | J | jnl |
CoRR
|
| 2021 | — | conf |
ITSC
|
| 2021 | J | jnl |
IEEE Internet Things J.
|
| 2021 | J | jnl |
BMC Bioinform.
|
| 2021 | — | conf |
RFID
|
| 2020 | — | conf |
RFID
|
| 2020 | J | jnl |
IEEE Access
|
| 2020 | — | conf |
PerCom Workshops
|
| 2020 | B | conf |
EWSN
|
| 2020 | — | conf |
ITSC
|
| 2019 | J | jnl |
J. Frankl. Inst.
|
| 2019 | — | conf |
RFID-TA
|
| 2019 | J | jnl |
Sensors
|
| 2019 | — | conf |
SmartWorld/SCALCOM/UIC/ATC/CBDCom/IOP/SCI
|
| 2019 | J | jnl |
IEEE Access
|
| 2019 | J | jnl |
Complex.
|
| 2019 | — | conf |
RFID
|
| 2019 | J | jnl |
CoRR
|
| 2018 | J | jnl |
J. Inf. Hiding Multim. Signal Process.
|
| 2018 | J | jnl |
J. Inf. Hiding Multim. Signal Process.
|
| 2018 | — | conf |
SOLI
|
| 2018 | J | jnl |
IEEE Trans. Veh. Technol.
|
| 2018 | J | jnl |
IEICE Trans. Commun.
|
| 2018 | J | jnl |
Int. J. Online Eng.
|
| 2017 | J | jnl |
J. Electr. Comput. Eng.
|
| 2017 | C | conf |
IECON
|
| 2017 | C | conf |
IECON
|
| 2016 | C | conf |
IAS
|
| 2016 | J | jnl |
IEEE Trans. Ind. Electron.
|
| 2016 | — | conf |
WPMC
|
| 2016 | — | conf |
WCSP
|
| 2016 | J | jnl |
Multim. Tools Appl.
|
| 2014 | A | conf |
ICME
|
| 2014 | A* | conf |
ICRA
|
| 2014 | J | jnl |
Inf. Sci.
|
| 2014 | B | conf |
IJCNN
|
| 2013 | — | conf |
IEEE WISA
|
| 2013 | — | conf |
WISE (1)
|
| 2013 | B | conf |
IJCNN
|
| 2013 | B | conf |
IJCNN
|
| 2012 | C | conf |
APSCC
|
| 2012 | — | conf |
IPDPS Workshops
|
| 2012 | Misc | conf |
ICNC
|
| 2011 | C | conf |
APSCC
|
| 2009 | — | conf |
ICNC (1)
|
| 2002 | — | conf |
ISCAS (1)
|