| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2026 | J | jnl |
IEEE J. Solid State Circuits
|
| 2026 | B | conf |
CHIIR
|
| 2026 | J | jnl |
Eng. Appl. Artif. Intell.
|
| 2026 | B | conf |
CHIIR
|
| 2026 | — | conf |
KDD (1)
|
| 2026 | J | jnl |
CoRR
|
| 2025 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2025 | J | jnl |
IEEE Access
|
| 2025 | J | jnl |
Pattern Recognit.
|
| 2025 | — | conf |
WACV (Workshops)
|
| 2025 | J | jnl |
CoRR
|
| 2025 | — | conf |
EMNLP (Findings)
|
| 2025 | J | jnl |
CoRR
|
| 2025 | — | conf |
CVPR Workshops
|
| 2024 | C | conf |
ISCAS
|
| 2024 | J | jnl |
IEEE Trans. Circuits Syst. II Express Briefs
|
| 2024 | J | jnl |
IEEE Trans. Circuits Syst. II Express Briefs
|
| 2024 | — | conf |
ISOCC
|
| 2024 | — | conf |
ISOCC
|
| 2024 | J | jnl |
IEEE Trans. Circuits Syst. I Regul. Pap.
|
| 2024 | — | conf |
ICEIC
|
| 2024 | J | jnl |
CoRR
|
| 2024 | C | conf |
ISCAS
|
| 2024 | — | conf |
MIE
|
| 2024 | A* | conf |
AAAI
|
| 2024 | J | jnl |
CoRR
|
| 2024 | J | jnl |
Eng. Appl. Artif. Intell.
|
| 2024 | A* | conf |
CVPR
|
| 2024 | J | jnl |
CoRR
|
| 2024 | J | jnl |
CoRR
|
| 2024 | J | jnl |
Expert Syst. Appl.
|
| 2024 | J | jnl |
J. Assoc. Inf. Sci. Technol.
|
| 2023 | A* | conf |
ICML
|
| 2023 | J | jnl |
CoRR
|
| 2023 | J | jnl |
Inf. Sci.
|
| 2023 | J | jnl |
Appl. Intell.
|
| 2023 | J | jnl |
IEEE Access
|
| 2023 | J | jnl |
CoRR
|
| 2023 | A* | conf |
NeurIPS
|
| 2023 | J | jnl |
Appl. Soft Comput.
|
| 2023 | J | jnl |
CoRR
|
| 2023 | B | conf |
CHIIR
|
| 2023 | J | jnl |
CoRR
|
| 2022 | B | conf |
CHIIR
|
| 2021 | J | jnl |
Comput. Geom.
|
| 2021 | — | conf |
HECKTOR@MICCAI
|
| 2019 | — | conf |
FSTTCS
|
| 2019 | J | jnl |
CoRR
|