| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2026 | J | jnl |
J. Circuits Syst. Comput.
|
| 2026 | — | conf |
ASP-DAC
|
| 2026 | J | jnl |
IEEE Internet Things J.
|
| 2025 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2025 | J | jnl |
IEEE Trans. Inf. Forensics Secur.
|
| 2025 | J | jnl |
IEEE Trans. Emerg. Top. Comput.
|
| 2025 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2025 | J | jnl |
IEEE Internet Things J.
|
| 2025 | J | jnl |
Integr.
|
| 2025 | J | jnl |
Integr.
|
| 2025 | J | jnl |
Microelectron. J.
|
| 2025 | J | jnl |
IEEE Internet Things J.
|
| 2024 | — | conf |
MCSoC
|
| 2024 | — | conf |
ITC-Asia
|
| 2024 | J | jnl |
Comput. Biol. Medicine
|
| 2024 | J | jnl |
Microelectron. J.
|
| 2024 | J | jnl |
Integr.
|
| 2024 | J | jnl |
Comput. Biol. Medicine
|
| 2024 | J | jnl |
Microelectron. J.
|
| 2024 | J | jnl |
IEEE Trans. Circuits Syst. II Express Briefs
|
| 2023 | J | jnl |
IET Circuits Devices Syst.
|
| 2023 | — | conf |
ASICON
|
| 2023 | J | jnl |
Comput. Biol. Medicine
|
| 2023 | — | conf |
ASICON
|
| 2023 | — | conf |
ASICON
|
| 2023 | J | jnl |
Microelectron. J.
|
| 2023 | J | jnl |
IEEE Trans. Circuits Syst. I Regul. Pap.
|
| 2023 | — | conf |
ASICON
|
| 2023 | — | conf |
ASICON
|
| 2023 | — | conf |
ASICON
|
| 2023 | J | jnl |
Comput. Electr. Eng.
|
| 2023 | J | jnl |
Microelectron. J.
|
| 2023 | — | conf |
ASICON
|
| 2022 | J | jnl |
Microelectron. J.
|
| 2022 | J | jnl |
Comput. Biol. Medicine
|
| 2022 | J | jnl |
Microelectron. J.
|
| 2022 | J | jnl |
Microelectron. J.
|
| 2022 | J | jnl |
Microelectron. J.
|
| 2022 | J | jnl |
IET Circuits Devices Syst.
|
| 2021 | J | jnl |
Integr.
|
| 2021 | — | conf |
ASICON
|
| 2021 | — | conf |
ASICON
|
| 2021 | — | conf |
ASICON
|
| 2021 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2021 | — | conf |
ASICON
|
| 2021 | — | conf |
ASICON
|
| 2021 | — | conf |
ASICON
|
| 2021 | — | conf |
ASICON
|
| 2021 | J | jnl |
Integr.
|
| 2021 | J | jnl |
Microelectron. J.
|
| 2020 | J | jnl |
IET Circuits Devices Syst.
|
| 2020 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2020 | J | jnl |
J. Circuits Syst. Comput.
|
| 2020 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2019 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2019 | — | conf |
A-SSCC
|
| 2019 | — | conf |
ASICON
|
| 2019 | — | conf |
ASICON
|
| 2019 | — | conf |
AsianHOST
|
| 2019 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2019 | — | conf |
ASICON
|
| 2019 | — | conf |
ASICON
|
| 2019 | J | jnl |
Microelectron. J.
|
| 2018 | J | jnl |
Microelectron. J.
|
| 2018 | C | conf |
APCC
|
| 2017 | — | conf |
ASICON
|
| 2017 | J | jnl |
A multi-port low-power current mode PUF using MOSFET current-division deviation in 65 nm technology.
Microelectron. J.
|
| 2017 | — | conf |
ASICON
|
| 2016 | — | conf |
ISVLSI
|
| 2015 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2015 | — | conf |
ASICON
|
| 2015 | J | jnl |
J. Intell. Manuf.
|
| 2014 | J | jnl |
IEICE Electron. Express
|
| 2014 | — | conf |
ISIC
|
| 2013 | J | jnl |
IEICE Trans. Fundam. Electron. Commun. Comput. Sci.
|
| 2013 | — | conf |
ASICON
|
| 2012 | J | jnl |
IEICE Electron. Express
|
| 2012 | J | jnl |
IEICE Electron. Express
|
| 2011 | — | conf |
ASICON
|
| 2008 | B | conf |
ICALT
|
| 2007 | — | conf |
DIGITEL
|
| 2006 | B | conf |
ICALT
|
| 2006 | — | conf |
WMTE
|
| 2006 | C | conf |
ICCE
|
| 2005 | C | conf |
ICCE
|