| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2026 | J | jnl |
Comput. Ind. Eng.
|
| 2026 | J | jnl |
Comput. Biol. Chem.
|
| 2026 | J | jnl |
Qual. Reliab. Eng. Int.
|
| 2025 | J | jnl |
Expert Syst. Appl.
|
| 2025 | J | jnl |
Comput. Networks
|
| 2025 | J | jnl |
Int. J. Fuzzy Syst.
|
| 2025 | J | jnl |
CoRR
|
| 2025 | — | conf |
ICONIP (4)
|
| 2025 | J | jnl |
CoRR
|
| 2025 | B | conf |
COLING
|
| 2025 | — | conf |
ICONIP (5)
|
| 2025 | J | jnl |
CoRR
|
| 2025 | — | conf |
ICONIP (1)
|
| 2024 | J | jnl |
Expert Syst. Appl.
|
| 2024 | A | conf |
CIKM
|
| 2024 | J | jnl |
CoRR
|
| 2024 | — | conf |
ECML/PKDD (8)
|
| 2024 | J | jnl |
Appl. Soft Comput.
|
| 2024 | J | jnl |
CoRR
|
| 2024 | J | jnl |
CoRR
|
| 2024 | J | jnl |
IEEE Trans. Aerosp. Electron. Syst.
|
| 2024 | J | jnl |
IEEE Trans. Aerosp. Electron. Syst.
|
| 2024 | J | jnl |
IEEE Trans. Aerosp. Electron. Syst.
|
| 2023 | J | jnl |
Inf. Sci.
|
| 2023 | J | jnl |
IEEE Trans. Aerosp. Electron. Syst.
|
| 2023 | J | jnl |
IEEE Trans. Aerosp. Electron. Syst.
|
| 2023 | J | jnl |
IEEE Trans. Aerosp. Electron. Syst.
|
| 2023 | — | conf |
CCL
|
| 2023 | J | jnl |
IEEE Trans. Aerosp. Electron. Syst.
|
| 2023 | J | jnl |
IEEE Commun. Lett.
|
| 2023 | A* | conf |
EMNLP
|
| 2023 | J | jnl |
CoRR
|
| 2022 | J | jnl |
CoRR
|
| 2022 | J | jnl |
Earth Sci. Informatics
|
| 2022 | J | jnl |
Appl. Soft Comput.
|
| 2022 | J | jnl |
IEEE Trans. Wirel. Commun.
|
| 2022 | — | conf |
ICETT
|
| 2021 | J | jnl |
Soft Comput.
|
| 2021 | J | jnl |
IEEE Trans. Signal Process.
|
| 2021 | — | conf |
ACAI
|
| 2020 | J | jnl |
Comput. Ind. Eng.
|
| 2020 | J | jnl |
Comput. Ind. Eng.
|
| 2020 | — | conf |
ACAI
|
| 2019 | — | conf |
ICNC-FSKD
|
| 2012 | J | jnl |
J. Softw.
|
| 2012 | J | jnl |
J. Softw.
|