| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2026 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2026 | J | jnl |
Neurocomputing
|
| 2026 | J | jnl |
Inf. Syst.
|
| 2026 | J | jnl |
EAI Endorsed Trans. Scalable Inf. Syst.
|
| 2026 | J | jnl |
CoRR
|
| 2026 | J | jnl |
CoRR
|
| 2026 | J | jnl |
Frontiers Comput. Sci.
|
| 2025 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2025 | J | jnl |
IEEE Trans. Biomed. Circuits Syst.
|
| 2025 | J | jnl |
CoRR
|
| 2025 | A* | conf |
ICRA
|
| 2025 | J | jnl |
IEEE Internet Things J.
|
| 2025 | J | jnl |
CoRR
|
| 2025 | J | jnl |
IEEE Robotics Autom. Lett.
|
| 2025 | J | jnl |
CoRR
|
| 2025 | J | jnl |
Int. J. Web Eng. Technol.
|
| 2025 | J | jnl |
Entropy
|
| 2025 | J | jnl |
CoRR
|
| 2025 | J | jnl |
CoRR
|
| 2025 | J | jnl |
IEICE Trans. Electron.
|
| 2025 | J | jnl |
Neural Process. Lett.
|
| 2025 | A | conf |
DATE
|
| 2025 | J | jnl |
CoRR
|
| 2025 | C | conf |
IMX
|
| 2024 | J | jnl |
CoRR
|
| 2024 | J | jnl |
IEEE Trans. Circuits Syst. II Express Briefs
|
| 2024 | A | conf |
DATE
|
| 2024 | J | jnl |
IEEE Access
|
| 2024 | J | jnl |
CoRR
|
| 2024 | J | jnl |
Int. J. Inf. Syst. Supply Chain Manag.
|
| 2024 | J | jnl |
Int. J. Inf. Syst. Serv. Sect.
|
| 2024 | — | conf |
CNIOT
|
| 2024 | — | conf |
BigComp
|
| 2024 | J | jnl |
IEEE Internet Things J.
|
| 2024 | — | conf |
CHI Extended Abstracts
|
| 2024 | A* | conf |
CHI
|
| 2024 | J | jnl |
Sensors
|
| 2024 | J | jnl |
CoRR
|
| 2024 | J | jnl |
CoRR
|
| 2024 | B | conf |
ASPDAC
|
| 2024 | — | conf |
ICCT
|
| 2024 | — | conf |
CSNDSP
|
| 2024 | J | jnl |
Sensors
|
| 2024 | — | — |
|
| 2024 | J | jnl |
CoRR
|
| 2024 | A* | conf |
ICRA
|
| 2024 | J | jnl |
CoRR
|
| 2024 | — | conf |
ECCV (66)
|
| 2024 | J | jnl |
CoRR
|
| 2023 | J | jnl |
IEEE Trans. Inf. Theory
|
| 2023 | — | conf |
ASICON
|
| 2023 | J | jnl |
CoRR
|
| 2023 | C | conf |
IV
|
| 2023 | J | jnl |
Appl. Intell.
|
| 2023 | J | jnl |
IEEE Trans. Ind. Electron.
|
| 2023 | J | jnl |
Int. J. Inf. Technol. Proj. Manag.
|
| 2023 | J | jnl |
Sensors
|
| 2023 | J | jnl |
Proc. ACM Hum. Comput. Interact.
|
| 2023 | B | conf |
TEI
|
| 2023 | J | jnl |
CoRR
|
| 2023 | J | jnl |
IEEE Trans. Intell. Veh.
|
| 2023 | A* | conf |
ICCV
|
| 2023 | J | jnl |
CoRR
|
| 2023 | J | jnl |
Discret. Math.
|
| 2023 | A* | conf |
ICRA
|
| 2023 | A* | conf |
ICCV
|
| 2022 | J | jnl |
Sensors
|
| 2022 | B | conf |
SMC
|
| 2022 | A* | conf |
CVPR
|
| 2022 | J | jnl |
CoRR
|
| 2022 | J | jnl |
Appl. Soft Comput.
|
| 2022 | J | jnl |
IEEE Trans. Ind. Electron.
|
| 2022 | A* | conf |
ICRA
|
| 2022 | J | jnl |
J. Comb. Theory A
|
| 2022 | J | jnl |
CoRR
|
| 2022 | J | jnl |
Proc. ACM Hum. Comput. Interact.
|
| 2022 | J | jnl |
J. Ambient Intell. Humaniz. Comput.
|
| 2022 | J | jnl |
IEEE Trans. Ind. Electron.
|
| 2022 | J | jnl |
Proc. ACM Hum. Comput. Interact.
|
| 2021 | — | conf |
ASICON
|
| 2021 | A* | conf |
ICCV
|
| 2021 | J | jnl |
CoRR
|
| 2021 | J | jnl |
J. Intell. Fuzzy Syst.
|
| 2021 | A* | conf |
ICRA
|
| 2021 | J | jnl |
CoRR
|
| 2021 | J | jnl |
Proc. ACM Hum. Comput. Interact.
|
| 2020 | J | jnl |
IEEE Trans. Circuits Syst.
|
| 2020 | Misc | conf |
CoRL
|
| 2020 | J | jnl |
CoRR
|
| 2019 | — | conf |
CCECE
|
| 2019 | J | jnl |
Int. J. Inf. Syst. Supply Chain Manag.
|
| 2019 | C | conf |
PDCAT
|
| 2019 | J | jnl |
IEEE Trans. Geosci. Remote. Sens.
|
| 2019 | J | jnl |
Int. J. Inf. Syst. Serv. Sect.
|
| 2019 | J | jnl |
Int. J. Oper. Res. Inf. Syst.
|
| 2018 | J | jnl |
Int. J. Inf. Syst. Supply Chain Manag.
|
| 2018 | J | jnl |
Sensors
|
| 2018 | J | jnl |
IEEE Trans. Ind. Electron.
|
| 2018 | — | conf |
CISP-BMEI
|
| 2018 | J | jnl |
Phys. Commun.
|
| 2018 | — | conf |
QRS Companion
|
| 2017 | — | conf |
ICICDT
|
| 2017 | J | jnl |
Commun. Nonlinear Sci. Numer. Simul.
|
| 2017 | J | jnl |
Int. J. Inf. Syst. Supply Chain Manag.
|
| 2016 | — | conf |
A-SSCC
|
| 2016 | — | conf |
ICSAI
|
| 2016 | J | jnl |
J. Commun.
|
| 2015 | J | jnl |
IEEE Trans. Ind. Electron.
|
| 2015 | J | jnl |
IEEE Trans. Ind. Electron.
|
| 2014 | — | conf |
A scheme for remotely preparing a two-atom entangled state in cavity quantum electrodynamics system.
ICSAI
|
| 2014 | J | jnl |
IEEE Trans. Ind. Electron.
|
| 2014 | J | jnl |
IEEE Trans. Ind. Electron.
|
| 2014 | — | conf |
ICSAI
|
| 2014 | J | jnl |
Commun. Nonlinear Sci. Numer. Simul.
|
| 2014 | J | jnl |
IEEE Trans. Ind. Electron.
|
| 2013 | J | jnl |
Neural Process. Lett.
|
| 2013 | J | jnl |
Appl. Soft Comput.
|
| 2013 | — | conf |
SOCA
|
| 2013 | C | conf |
VLSI-SoC
|
| 2013 | — | conf |
VLSI-SoC (Selected Papers)
|
| 2013 | — | conf |
IEEE SCC
|
| 2013 | J | jnl |
J. Appl. Log.
|
| 2013 | J | jnl |
IEEE Trans. Instrum. Meas.
|
| 2013 | — | conf |
UIC/ATC
|
| 2012 | B | conf |
IJCNN
|
| 2012 | — | conf |
ICONIP (2)
|
| 2012 | J | jnl |
IEEE Trans. Ind. Electron.
|
| 2012 | — | conf |
SoCC
|
| 2012 | J | jnl |
IEEE Trans. Ind. Electron.
|
| 2011 | — | conf |
ICONIP (3)
|
| 2011 | — | conf |
IJCCI (NCTA)
|
| 2011 | J | jnl |
IEEE Trans. Ind. Electron.
|
| 2010 | J | jnl |
J. Comput.
|
| 2010 | — | conf |
TWOMDE@TOOLS
|
| 2009 | J | jnl |
Comput. Biol. Chem.
|
| 2009 | C | conf |
DASC
|
| 2008 | — | conf |
CSSE (1)
|
| 2008 | — | conf |
ICIC (1)
|
| 2007 | — | ch. |
Model-Based Reasoning in Science, Technology, and Medicine
|
| 2007 | J | jnl |
Neurocomputing
|
| 2005 | — | conf |
FSKD (1)
|