| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2026 | J | jnl |
J. Intell. Manuf.
|
| 2025 | J | jnl |
CoRR
|
| 2025 | — | conf |
PLANS
|
| 2025 | A | conf |
DATE
|
| 2025 | J | jnl |
CoRR
|
| 2025 | J | jnl |
Inf. Sci.
|
| 2025 | J | jnl |
CoRR
|
| 2025 | A* | conf |
DAC
|
| 2024 | J | jnl |
CoRR
|
| 2024 | — | conf |
UbiComp Companion
|
| 2024 | — | conf |
ACM Great Lakes Symposium on VLSI
|
| 2024 | J | jnl |
Telecommun. Syst.
|
| 2024 | J | jnl |
Sensors
|
| 2024 | J | jnl |
IEEE J. Sel. Top. Appl. Earth Obs. Remote. Sens.
|
| 2024 | J | jnl |
CoRR
|
| 2024 | J | jnl |
CoRR
|
| 2023 | — | conf |
GCCE
|
| 2023 | J | jnl |
Automating Style Analysis and Visualization With Explainable AI - Case Studies on Brand Recognition.
CoRR
|
| 2023 | — | conf |
PLANS
|
| 2023 | J | jnl |
Sensors
|
| 2023 | — | conf |
APSIPA ASC
|
| 2023 | C | conf |
ICCE
|
| 2023 | Misc | conf |
ICASSP
|
| 2023 | A* | conf |
ACM Multimedia
|
| 2023 | — | conf |
MMAsia
|
| 2022 | — | conf |
HCI (5)
|
| 2022 | — | conf |
ICCE-TW
|
| 2021 | J | jnl |
IEEE Trans. Aerosp. Electron. Syst.
|
| 2020 | J | jnl |
IEEE Intell. Transp. Syst. Mag.
|
| 2020 | — | conf |
ENC
|
| 2019 | J | jnl |
IEEE Access
|
| 2018 | B | conf |
SMC
|
| 2018 | — | conf |
PLANS
|
| 2018 | J | jnl |
Interact. Learn. Environ.
|
| 2017 | — | conf |
MISNC
|
| 2017 | J | jnl |
IEEE J. Biomed. Health Informatics
|
| 2017 | J | jnl |
Microelectron. Reliab.
|
| 2017 | J | jnl |
IEEE Trans. Biomed. Eng.
|
| 2016 | A | conf |
MSWiM
|
| 2016 | — | conf |
PLANS
|
| 2015 | J | jnl |
J. Assoc. Inf. Sci. Technol.
|
| 2015 | — | conf |
NVMTS
|
| 2015 | — | conf |
IWBBIO (2)
|
| 2014 | — | conf |
TAAI
|
| 2014 | J | jnl |
Knowl. Based Syst.
|
| 2013 | J | jnl |
Inf. Process. Manag.
|
| 2013 | — | conf |
ACIIDS (2)
|
| 2013 | — | conf |
SIGHAN@IJCNLP
|
| 2012 | J | jnl |
Sensors
|
| 2011 | J | jnl |
Sensors
|
| 2009 | J | jnl |
IEEE Trans. Consumer Electron.
|
| 2009 | B | conf |
SMC
|
| 2009 | J | jnl |
IEEE J. Sel. Top. Signal Process.
|