| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2025 | — | conf |
ISSCC
|
| 2025 | J | jnl |
Proc. Priv. Enhancing Technol.
|
| 2025 | A | conf |
DATE
|
| 2025 | J | jnl |
CoRR
|
| 2025 | J | jnl |
CoRR
|
| 2025 | Misc | conf |
SenSys
|
| 2024 | J | jnl |
CoRR
|
| 2023 | J | jnl |
Environ. Model. Softw.
|
| 2023 | J | jnl |
CoRR
|
| 2023 | A* | conf |
CCS
|
| 2023 | J | jnl |
IEEE Trans. Aerosp. Electron. Syst.
|
| 2023 | A* | conf |
CCS
|
| 2022 | A | conf |
ICCAD
|
| 2022 | J | jnl |
CoRR
|
| 2020 | J | jnl |
Sensors
|
| 2020 | J | jnl |
IEEE Access
|
| 2019 | J | jnl |
Data dependency reduction for high-performance FPGA implementation of DEFLATE compression algorithm.
J. Syst. Archit.
|
| 2019 | J | jnl |
IEEE Access
|
| 2018 | — | conf |
WF-IoT
|
| 2018 | C | conf |
ICCE
|
| 2018 | J | jnl |
IEICE Electron. Express
|
| 2018 | J | jnl |
J. Syst. Archit.
|
| 2017 | J | jnl |
Qual. Reliab. Eng. Int.
|
| 2016 | J | jnl |
Qual. Reliab. Eng. Int.
|
| 2016 | J | jnl |
Qual. Reliab. Eng. Int.
|
| 2016 | C | conf |
ICCE
|
| 2015 | C | conf |
ICCE
|
| 2014 | — | conf |
ISSCC
|
| 2014 | J | jnl |
IEEE Trans. Biomed. Circuits Syst.
|
| 2014 | J | jnl |
Qual. Reliab. Eng. Int.
|
| 2014 | J | jnl |
IEICE Electron. Express
|
| 2013 | J | jnl |
IEICE Electron. Express
|
| 2013 | J | jnl |
IEICE Electron. Express
|
| 2013 | J | jnl |
IEICE Electron. Express
|
| 2012 | C | conf |
ICCE
|
| 2012 | J | jnl |
IEEE Trans. Consumer Electron.
|
| 2012 | B | conf |
ICIP
|
| 2012 | J | jnl |
Qual. Reliab. Eng. Int.
|
| 2011 | — | conf |
ITNG
|
| 2011 | — | conf |
HotPlanet@MobiSys
|
| 2010 | — | conf |
CHANTS@MobiCom
|
| 2009 | — | conf |
ISA
|
| 2007 | — | conf |
VTC Spring
|
| 2005 | — | conf |
OTM Conferences (1)
|
| 2004 | J | jnl |
Comput. Stand. Interfaces
|
| 1999 | A | conf |
CIKM
|