| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2026 | J | jnl |
IEEE Wirel. Commun. Lett.
|
| 2026 | J | jnl |
IEEE Wirel. Commun. Lett.
|
| 2026 | J | jnl |
IEEE Wirel. Commun. Lett.
|
| 2026 | J | jnl |
IEEE Wirel. Commun. Lett.
|
| 2026 | J | jnl |
IEEE Trans. Circuits Syst. II Express Briefs
|
| 2026 | J | jnl |
IEEE Wirel. Commun. Lett.
|
| 2025 | J | jnl |
IEEE J. Solid State Circuits
|
| 2025 | J | jnl |
IEEE Trans. Commun.
|
| 2025 | — | conf |
SiPS
|
| 2025 | J | jnl |
Sci. China Inf. Sci.
|
| 2025 | J | jnl |
IEEE J. Emerg. Sel. Topics Circuits Syst.
|
| 2025 | J | jnl |
Sci. China Inf. Sci.
|
| 2024 | C | conf |
ISCAS
|
| 2024 | J | jnl |
IEEE Trans. Circuits Syst. II Express Briefs
|
| 2024 | J | jnl |
IEEE Trans. Veh. Technol.
|
| 2024 | J | jnl |
IEEE Wirel. Commun. Lett.
|
| 2024 | J | jnl |
IEEE Wirel. Commun. Lett.
|
| 2024 | C | conf |
ISCAS
|
| 2024 | J | jnl |
IEEE Trans. Circuits Syst. II Express Briefs
|
| 2023 | — | conf |
ISSCC
|
| 2023 | C | conf |
ISCAS
|
| 2023 | — | conf |
ESSCIRC
|
| 2023 | — | conf |
ASICON
|
| 2023 | J | jnl |
IEEE Trans. Veh. Technol.
|
| 2023 | J | jnl |
IEEE Wirel. Commun. Lett.
|
| 2023 | J | jnl |
IEEE Trans. Veh. Technol.
|
| 2022 | J | jnl |
IEEE Trans. Veh. Technol.
|
| 2022 | J | jnl |
IET Commun.
|
| 2022 | J | jnl |
IEEE Trans. Veh. Technol.
|
| 2020 | J | jnl |
IEEE Commun. Lett.
|
| 2019 | C | conf |
ISCAS
|
| 2019 | B | conf |
WCNC
|
| 2019 | B | conf |
IWCMC
|
| 2017 | J | jnl |
Sci. China Inf. Sci.
|
| 2014 | — | conf |
HCC
|