| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2026 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2026 | J | jnl |
IEEE Trans. Inf. Forensics Secur.
|
| 2025 | J | jnl |
ACM Trans. Embed. Comput. Syst.
|
| 2025 | J | jnl |
IEEE Trans. Mob. Comput.
|
| 2024 | J | jnl |
Earth Sci. Informatics
|
| 2024 | A* | conf |
ICSE
|
| 2024 | J | jnl |
IEEE J. Biomed. Health Informatics
|
| 2024 | J | jnl |
CoRR
|
| 2024 | A | conf |
DATE
|
| 2024 | A* | conf |
MobiCom
|
| 2024 | J | jnl |
Microelectron. J.
|
| 2024 | J | jnl |
ACM Trans. Sens. Networks
|
| 2023 | A | conf |
ICCAD
|
| 2023 | J | jnl |
IEEE Trans. Inf. Forensics Secur.
|
| 2023 | — | conf |
SIGMETRICS (Abstracts)
|
| 2023 | J | jnl |
Proc. ACM Meas. Anal. Comput. Syst.
|
| 2023 | J | jnl |
Proc. ACM Interact. Mob. Wearable Ubiquitous Technol.
|
| 2023 | A* | conf |
MobiCom
|
| 2022 | — | conf |
HOST
|
| 2022 | J | jnl |
Earth Sci. Informatics
|
| 2022 | J | jnl |
IEEE Trans. Emerg. Top. Comput.
|
| 2022 | J | jnl |
Proc. ACM Interact. Mob. Wearable Ubiquitous Technol.
|
| 2021 | — | conf |
EMBC
|
| 2021 | — | conf |
UbiComp/ISWC Adjunct
|
| 2021 | J | jnl |
Earth Sci. Informatics
|
| 2021 | — | conf |
ITC-Asia
|
| 2021 | — | conf |
ACM Great Lakes Symposium on VLSI
|
| 2021 | A | conf |
ITC
|
| 2021 | — | conf |
AsianHOST
|
| 2020 | J | jnl |
IEEE Trans. Emerg. Top. Comput. Intell.
|
| 2020 | B | conf |
CEC
|
| 2019 | — | conf |
MMMI@MICCAI
|
| 2019 | J | jnl |
CoRR
|
| 2019 | J | jnl |
Inf. Sci.
|
| 2019 | J | jnl |
Remote. Sens.
|
| 2019 | J | jnl |
Comput. Geosci.
|
| 2018 | B | conf |
CEC
|
| 2018 | — | conf |
SmartWorld/SCALCOM/UIC/ATC/CBDCom/IOP/SCI
|
| 2018 | — | conf |
ICCS (1)
|
| 2018 | Misc | conf |
DICTA
|
| 2018 | — | conf |
ICACI
|
| 2017 | J | jnl |
CoRR
|
| 2012 | Misc | conf |
ICNC
|
| 2004 | J | jnl |
Comput. Geosci.
|