| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2026 | J | jnl |
CoRR
|
| 2025 | J | jnl |
IEEE Trans. Signal Process.
|
| 2025 | J | jnl |
Reliab. Eng. Syst. Saf.
|
| 2025 | J | jnl |
J. Comput. Inf. Sci. Eng.
|
| 2024 | J | jnl |
CoRR
|
| 2024 | J | jnl |
Reliab. Eng. Syst. Saf.
|
| 2024 | A | conf |
SDM
|
| 2024 | J | jnl |
CoRR
|
| 2024 | J | jnl |
IEEE Wirel. Commun.
|
| 2024 | J | jnl |
IEEE Trans. Instrum. Meas.
|
| 2023 | J | jnl |
IEEE Trans. Instrum. Meas.
|
| 2023 | J | jnl |
IEEE Internet Things J.
|
| 2023 | — | conf |
M2VIP
|
| 2023 | — | conf |
M2VIP
|
| 2023 | A* | conf |
ICML
|
| 2023 | J | jnl |
IEEE Trans. Instrum. Meas.
|
| 2017 | — | conf |
IScIDE
|
| 2010 | — | conf |
CCTA (3)
|