| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2026 | J | jnl |
Expert Syst. Appl.
|
| 2026 | J | jnl |
IEEE Trans Autom. Sci. Eng.
|
| 2026 | J | jnl |
IEEE Trans. Syst. Man Cybern. Syst.
|
| 2026 | J | jnl |
Knowl. Based Syst.
|
| 2026 | — | conf |
ASPLOS (2)
|
| 2026 | J | jnl |
CoRR
|
| 2026 | J | jnl |
ACM Trans. Reconfigurable Technol. Syst.
|
| 2026 | J | jnl |
IEEE Trans Autom. Sci. Eng.
|
| 2026 | J | jnl |
Expert Syst. Appl.
|
| 2026 | J | jnl |
CoRR
|
| 2025 | J | jnl |
IEEE Trans. Ind. Electron.
|
| 2025 | J | jnl |
IEEE Trans. Ind. Informatics
|
| 2025 | J | jnl |
Neural Networks
|
| 2025 | J | jnl |
ACM Trans. Design Autom. Electr. Syst.
|
| 2025 | J | jnl |
CoRR
|
| 2025 | J | jnl |
IEEE Trans. Big Data
|
| 2025 | — | conf |
IJCNLP-AACL (long papers)
|
| 2025 | J | jnl |
CoRR
|
| 2025 | — | conf |
HCI (71)
|
| 2025 | J | jnl |
Future Gener. Comput. Syst.
|
| 2025 | A* | conf |
MICRO
|
| 2025 | J | jnl |
CoRR
|
| 2025 | J | jnl |
IEEE Micro
|
| 2025 | — | conf |
ICRCA
|
| 2025 | J | jnl |
IEEE Trans Autom. Sci. Eng.
|
| 2025 | — | conf |
ICIC (14)
|
| 2025 | B | conf |
IWQoS
|
| 2025 | J | jnl |
CoRR
|
| 2025 | J | jnl |
Eng. Appl. Artif. Intell.
|
| 2025 | J | jnl |
IACR Cryptol. ePrint Arch.
|
| 2024 | J | jnl |
CoRR
|
| 2024 | J | jnl |
IEEE Trans. Instrum. Meas.
|
| 2024 | J | jnl |
Sensors
|
| 2024 | C | conf |
MODELSWARD
|
| 2024 | A* | conf |
DAC
|
| 2024 | J | jnl |
CoRR
|
| 2024 | J | jnl |
ACM Trans. Archit. Code Optim.
|
| 2024 | J | jnl |
CoRR
|
| 2024 | A* | conf |
INFOCOM
|
| 2024 | A* | conf |
MICRO
|
| 2024 | J | jnl |
CoRR
|
| 2024 | A* | conf |
EC
|
| 2024 | J | jnl |
CoRR
|
| 2024 | — | conf |
ACL (Findings)
|
| 2024 | A* | conf |
SOSP
|
| 2024 | J | jnl |
CoRR
|
| 2024 | — | conf |
CNIOT
|
| 2024 | — | conf |
ACAI
|
| 2024 | J | jnl |
Appl. Soft Comput.
|
| 2023 | J | jnl |
IEEE Trans. Instrum. Meas.
|
| 2023 | J | jnl |
IEEE Trans. Artif. Intell.
|
| 2023 | J | jnl |
Simul. Model. Pract. Theory
|
| 2023 | C | conf |
SAFEPROCESS
|
| 2023 | J | jnl |
IET Softw.
|
| 2023 | J | jnl |
IEEE Trans. Instrum. Meas.
|
| 2023 | J | jnl |
IEEE Trans. Syst. Man Cybern. Syst.
|
| 2023 | A* | conf |
G10: Enabling An Efficient Unified GPU Memory and Storage Architecture with Smart Tensor Migrations.
MICRO
|
| 2023 | J | jnl |
G10: Enabling An Efficient Unified GPU Memory and Storage Architecture with Smart Tensor Migrations.
CoRR
|
| 2023 | J | jnl |
CoRR
|
| 2023 | A* | conf |
NeurIPS
|
| 2023 | J | jnl |
CoRR
|
| 2023 | J | jnl |
J. Biomed. Informatics
|
| 2023 | J | jnl |
IEEE Access
|
| 2023 | — | conf |
APPT
|
| 2023 | A | conf |
HotOS
|
| 2023 | A* | conf |
ISCA
|
| 2022 | J | jnl |
IEEE Trans. Instrum. Meas.
|
| 2022 | B | conf |
ICPADS
|
| 2022 | — | conf |
AIM
|
| 2022 | J | jnl |
CoRR
|
| 2022 | — | conf |
ICBDE
|
| 2021 | J | jnl |
Appl. Soft Comput.
|
| 2021 | — | conf |
ICEA
|
| 2021 | J | jnl |
Investigation of 2D Nano-Structured Winding Insulation for High Torque Density Medium-Voltage Motor.
IEEE Access
|
| 2021 | J | jnl |
Int. J. Prod. Res.
|
| 2021 | — | conf |
ICEA
|
| 2020 | J | jnl |
IEEE Access
|
| 2020 | J | jnl |
Sensors
|
| 2020 | — | conf |
EMBC
|
| 2020 | J | jnl |
IEEE Access
|
| 2020 | J | jnl |
IEEE Access
|
| 2020 | J | jnl |
Reliab. Eng. Syst. Saf.
|
| 2019 | J | jnl |
IEEE Trans. Control. Syst. Technol.
|
| 2019 | J | jnl |
IEEE Access
|
| 2019 | J | jnl |
IEEE Access
|
| 2019 | J | jnl |
IEEE Access
|
| 2019 | J | jnl |
Reliab. Eng. Syst. Saf.
|
| 2018 | J | jnl |
IEEE Trans. Ind. Electron.
|
| 2018 | J | jnl |
IEEE Access
|
| 2018 | C | conf |
FUSION
|
| 2018 | J | jnl |
IEEE Access
|
| 2018 | J | jnl |
IEEE Trans. Reliab.
|
| 2017 | J | jnl |
Comput. Stat.
|
| 2017 | J | jnl |
Neural Networks
|
| 2016 | J | jnl |
Int. J. Fuzzy Syst.
|
| 2016 | J | jnl |
Neural Networks
|
| 2015 | J | jnl |
Neurocomputing
|
| 2014 | J | jnl |
Comput. Chem. Eng.
|