Yingtao Ding

23 papers C 1Journal 15Unranked 7
YearRankTypeTitle / Venue / Authors
2022 J jnl
A Ka-band calibratable phased-array front-end chip with high element-consistency.
Sci. China Inf. Sci.
Shiyan Sun, An'an Li, Yingtao Ding, Zipeng Chen, Wei Wang, Sijia Jiang, Zhiming Chen, Baoyong Chi
2022 J jnl
Coprime Nested Arrays for DOA Estimation: Exploiting the Nesting Property of Coprime Array.
IEEE Signal Process. Lett.
Zhe Peng, Yingtao Ding, Shiwei Ren, Haixia Wu, Weijiang Wang
2022 J jnl
Supplementary coprime array with enhanced DOFs exploiting hole filling strategy based on the difference and sum coarray.
Digit. Signal Process.
Zhe Peng, Yingtao Ding, Shiwei Ren, Weijiang Wang, Wei Gu
2021 — conf
A Low-Cost and Low-Temperature Method to Realize Carbon Nanotube Conductor in Through-Silicon-Via.
3DIC
Ziyue Zhang, Yingtao Ding, Baoyan Yang, Anrun Ren, Zhiming Chen
2021 — conf
Paper-based flexible broadband photodetectors functionalized by PbS quantum dots/Carbon nanotube networks hybrid structure.
ICTA
Yilin Sun, Zhifang Liu, Yingtao Ding
2020 J jnl
A Fully Integrated K-Band Dual Down-Conversion Receiver for Radar Applications in 90 nm CMOS.
IEEE Access
An'an Li, Min Lin, Baoyong Chi, Yingtao Ding, Zheng Song, Zipeng Chen, Shiyan Sun, Yutian Li, Yinghang Wu, Zhenwu Wang, Zhiming Chen
2020 J jnl
Coupled Thermo-Mechanical Analysis of 3D ICs Based on an Equivalent Modeling Methodology With Sub-Modeling.
IEEE Access
Zhiqiang Cheng, Yingtao Ding, Ziyue Zhang, Mingrui Zhou, Zhiming Chen
2020 J jnl
Extended Transformed Nested Arrays for DOA Estimation of Non-Circular Sources.
IEEE Access
Zhe Peng, Yingtao Ding, Shiwei Ren, Xiaohua Wang
2019 J jnl
1.15 GHz image rejection filter with 45 dB image rejection ratio and 8.4 mW DC power in 90 nm CMOS.
Microelectron. J.
An'an Li, Yingtao Ding, Zhiming Chen, Baoyong Chi
2019 J jnl
A 25-35 GHz 5-bit digital attenuator with low RMS amplitude error and low phase variation in 65 nm CMOS.
IEICE Electron. Express
An'an Li, Yingtao Ding, Zhiming Chen, Baoyong Chi
2019 — conf
A Fully Integrated 27.5-30.5 GHz 8-Element Phased-Array Transmit Front-end Module in 65 nm CMOS.
A-SSCC
An'an Li, Yingtao Ding, Zipeng Chen, Wei Wang, Sijia Jiang, Shiyan Sun, Zhiming Chen, Baoyong Chi
2019 — conf
Design and Evaluation of a Novel and Ultra-Compact Fully-TGV-based Self-Shielding Bandpass Filter for 5G Applications.
3DIC
Ziyue Zhang, Yingtao Ding, Zhiming Chen, Mingrui Zhou, Lei Xiao, Ziru Cai, Miao Xiong, Xiao Gong
2019 J jnl
Sampling and Reconstruction of Multiband Signals in Multiresolution Subspaces Associated With the Fractional Wavelet Transform.
IEEE Signal Process. Lett.
Jiatong Wang, Yingtao Ding, Shiwei Ren, Weijiang Wang
2018 J jnl
A Novel Nested Configuration Based on the Difference and Sum Co-Array Concept.
Sensors
Zhenhong Chen, Yingtao Ding, Shiwei Ren, Zhiming Chen
2018 J jnl
A Novel Noncircular MUSIC Algorithm Based on the Concept of the Difference and Sum Coarray.
Sensors
Zhenhong Chen, Yingtao Ding, Shiwei Ren, Zhiming Chen
2016 — conf
Low cost polyimide liner formation with vacuum-assisted spin coating for through-silicon-vias.
3DIC
Yangyang Yan, Ziyue Zhang, Zhiqiang Cheng, Lingfeng Zhou, Zhiming Chen, Yingtao Ding
2016 J jnl
Temperature-aware multi-application mapping on network-on-chip based many-core systems.
Microprocess. Microsystems
Shan Cao, Zoran Salcic, Zhaolin Li, Shaojun Wei, Yingtao Ding
2016 C conf
Temperature-aware task scheduling heuristics on Network-on-Chips.
ISCAS
Shan Cao, Zoran Salcic, Yingtao Ding, Zhaolin Li, Shaojun Wei, Xianli Zhao
2015 — conf
Design of a dynamically reconfigurable arithmetic unit for matrix algorithms.
ASICON
Weijiang Wang, Yingtao Ding, Shan Cao, Xianli Zhao
2015 — conf
Vacuum-assisted-spin-coating of polyimide liner for high-aspect-ratio TSVs applications.
3DIC
Yangyang Yan, Yingtao Ding, Qianwen Chen, Kang Wook Lee, Takafumi Fukushima, Mitsumasa Koyanagi
2014 J jnl
An Efficient Algorithm for Direction Finding against Unknown Mutual Coupling.
Sensors
Weijiang Wang, Shiwei Ren, Yingtao Ding, Haoyu Wang
2014 J jnl
Analytical solution on interfacial reliability of 3-D through-silicon-via (TSV) containing dielectric liner.
Microelectron. Reliab.
Yingtao Ding, Yangyang Yan, Qianwen Chen, Shiwei Wang, Rui Su, Hua Dang
2011 J jnl
Design of DDS based on Hybird-CORDIC Architecture.
Int. J. Comput. Intell. Syst.
Xiujie Qu, He Chen, Yubin Zhang, Yingtao Ding