| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2025 | J | jnl |
IEEE Trans. Pattern Anal. Mach. Intell.
|
| 2025 | J | jnl |
Int. J. Comput. Vis.
|
| 2025 | A | conf |
WACV
|
| 2025 | A* | conf |
ICLR
|
| 2025 | J | jnl |
CoRR
|
| 2024 | J | jnl |
CoRR
|
| 2024 | J | jnl |
Sensors
|
| 2024 | J | jnl |
CoRR
|
| 2024 | J | jnl |
CoRR
|
| 2024 | โ | conf |
ECCV (59)
|
| 2024 | J | jnl |
J. Intell. Manuf.
|
| 2023 | A* | conf |
ICCV
|
| 2023 | J | jnl |
CoRR
|
| 2023 | J | jnl |
CoRR
|
| 2023 | A | conf |
IROS
|
| 2023 | A | conf |
IROS
|
| 2022 | J | jnl |
CoRR
|
| 2022 | J | jnl |
IEEE Access
|
| 2022 | โ | conf |
ECCV (23)
|
| 2022 | โ | conf |
SIGGRAPH Asia Technical Communications
|
| 2022 | B | conf |
ICCP
|
| 2022 | J | jnl |
CoRR
|
| 2021 | J | jnl |
CoRR
|
| 2021 | J | jnl |
IEEE Access
|