| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2026 | — | conf |
CHI Extended Abstracts
|
| 2026 | A* | conf |
AAAI
|
| 2026 | J | jnl |
CoRR
|
| 2025 | J | jnl |
IEEE Trans. Aerosp. Electron. Syst.
|
| 2025 | J | jnl |
Appl. Intell.
|
| 2025 | — | conf |
CACML
|
| 2025 | A* | conf |
CHI
|
| 2025 | J | jnl |
CoRR
|
| 2025 | A* | conf |
EMNLP
|
| 2025 | J | jnl |
CoRR
|
| 2025 | J | jnl |
CoRR
|
| 2025 | — | conf |
HCI (20)
|
| 2025 | J | jnl |
IEEE Trans. Instrum. Meas.
|
| 2025 | — | conf |
HCI (20)
|
| 2024 | J | jnl |
IEEE Trans. Instrum. Meas.
|
| 2024 | J | jnl |
IET Signal Process.
|
| 2024 | J | jnl |
IEEE Commun. Lett.
|
| 2024 | J | jnl |
Digit. Signal Process.
|
| 2024 | J | jnl |
IEEE Signal Process. Lett.
|
| 2024 | — | conf |
TE
|
| 2023 | — | conf |
RICAI
|
| 2023 | J | jnl |
Remote. Sens.
|
| 2023 | J | jnl |
IET Signal Process.
|
| 2023 | J | jnl |
IEICE Electron. Express
|
| 2022 | J | jnl |
IET Signal Process.
|
| 2022 | — | conf |
ITQM
|
| 2017 | J | jnl |
Symmetry
|
| 2016 | — | conf |
ICSAI
|
| 2013 | J | jnl |
Int. J. Comput. Appl. Technol.
|
| 2005 | J | jnl |
J. Chem. Inf. Model.
|