| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2024 | J | jnl |
IEEE Internet Things J.
|
| 2023 | J | jnl |
IEEE Trans. Neural Networks Learn. Syst.
|
| 2021 | J | jnl |
IEEE J. Solid State Circuits
|
| 2021 | J | jnl |
IEEE Internet Things J.
|
| 2020 | — | conf |
ISSCC
|
| 2020 | J | jnl |
IEEE J. Solid State Circuits
|
| 2020 | J | jnl |
IEEE Trans. Circuits Syst. II Express Briefs
|
| 2020 | J | jnl |
IEEE J. Solid State Circuits
|
| 2020 | A | conf |
DATE
|
| 2020 | — | conf |
Seal Integrity Testing Utilizing Non-Destructive Capacitive Sensing for Product Packaging Assurance.
IEEE SENSORS
|
| 2019 | — | conf |
CICC
|
| 2019 | — | conf |
ICICDT
|