| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2026 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2026 | — | conf |
ASP-DAC
|
| 2026 | J | jnl |
CoRR
|
| 2026 | J | jnl |
ACM Trans. Design Autom. Electr. Syst.
|
| 2026 | — | conf |
ASP-DAC
|
| 2026 | — | conf |
ASP-DAC
|
| 2026 | — | conf |
ASP-DAC
|
| 2026 | J | jnl |
ACM Trans. Design Autom. Electr. Syst.
|
| 2026 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2026 | — | conf |
ASP-DAC
|
| 2026 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2026 | J | jnl |
ACM Trans. Design Autom. Electr. Syst.
|
| 2026 | — | conf |
ASP-DAC
|
| 2026 | A | conf |
TDM Signal Grouping and Package Pin Assignment for 2.5D Multi-FPGA Systems with Lookahead Placement.
FPGA
|
| 2025 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2025 | A* | conf |
DAC
|
| 2025 | J | jnl |
CoRR
|
| 2025 | A | conf |
DATE
|
| 2025 | J | jnl |
CoRR
|
| 2025 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2025 | J | jnl |
CoRR
|
| 2025 | J | jnl |
CoRR
|
| 2025 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2025 | J | jnl |
CoRR
|
| 2025 | A* | conf |
ICML
|
| 2025 | A | conf |
ICCAD
|
| 2025 | A | conf |
ICCAD
|
| 2025 | J | jnl |
CoRR
|
| 2025 | J | jnl |
CoRR
|
| 2025 | — | conf |
ASP-DAC
|
| 2025 | J | jnl |
IEEE Access
|
| 2025 | A* | conf |
DAC
|
| 2025 | J | jnl |
CoRR
|
| 2025 | A* | conf |
DAC
|
| 2025 | A | conf |
ICCAD
|
| 2025 | A | conf |
ICCAD
|
| 2025 | A | conf |
DATE
|
| 2025 | J | jnl |
CoRR
|
| 2025 | A | conf |
ICCAD
|
| 2025 | J | jnl |
IEEE Trans. Instrum. Meas.
|
| 2025 | A | conf |
ICCAD
|
| 2025 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2025 | — | conf |
ISPD
|
| 2025 | J | jnl |
CoRR
|
| 2025 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2025 | C | conf |
ISCAS
|
| 2025 | J | jnl |
Integr.
|
| 2025 | A | conf |
ICCAD
|
| 2025 | J | jnl |
CoRR
|
| 2025 | A | conf |
DATE
|
| 2025 | A | conf |
ICCAD
|
| 2025 | J | jnl |
CoRR
|
| 2025 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2025 | — | conf |
ASP-DAC
|
| 2025 | A* | conf |
DAC
|
| 2025 | A* | conf |
DAC
|
| 2025 | A | conf |
DATE
|
| 2025 | J | jnl |
CoRR
|
| 2025 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2025 | A* | conf |
DAC
|
| 2025 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2025 | — | conf |
ASP-DAC
|
| 2024 | — | conf |
MLCAD
|
| 2024 | A | conf |
ICCAD
|
| 2024 | C | conf |
HPC Asia
|
| 2024 | J | jnl |
CoRR
|
| 2024 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2024 | J | jnl |
CoRR
|
| 2024 | — | conf |
ACM Great Lakes Symposium on VLSI
|
| 2024 | A* | conf |
ICLR
|
| 2024 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2024 | A* | conf |
DAC
|
| 2024 | J | jnl |
CoRR
|
| 2024 | J | jnl |
Sci. China Inf. Sci.
|
| 2024 | A | conf |
ICCAD
|
| 2024 | — | conf |
VLSI Technology and Circuits
|
| 2024 | A | conf |
ICCAD
|
| 2024 | A* | conf |
DAC
|
| 2024 | A | conf |
ICCAD
|
| 2024 | A* | conf |
MICRO
|
| 2024 | A | conf |
ICCAD
|
| 2024 | A | conf |
DATE
|
| 2024 | J | jnl |
IEEE Trans. Circuits Syst. II Express Briefs
|
| 2024 | — | conf |
ISPD
|
| 2024 | A | conf |
ICCAD
|
| 2024 | J | jnl |
IEEE Trans. Circuits Syst. I Regul. Pap.
|
| 2024 | J | jnl |
Sci. China Inf. Sci.
|
| 2024 | J | jnl |
CoRR
|
| 2024 | A* | conf |
DAC
|
| 2024 | J | jnl |
CoRR
|
| 2024 | A | conf |
ICCAD
|
| 2024 | — | conf |
ISPD
|
| 2024 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2024 | A* | conf |
DAC
|
| 2024 | J | jnl |
CoRR
|
| 2024 | A* | conf |
DAC
|
| 2024 | J | jnl |
Sci. China Inf. Sci.
|
| 2024 | A* | conf |
DAC
|
| 2024 | — | ed. |
MLCAD
|
| 2024 | — | conf |
ISPD
|
| 2024 | A | conf |
SAGERoute 2.0: Hierarchical Analog and Mixed Signal Routing Considering Versatile Routing Scenarios.
DATE
|
| 2024 | J | jnl |
CoRR
|
| 2024 | A* | conf |
DAC
|
| 2023 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2023 | — | conf |
ASP-DAC
|
| 2023 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2023 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2023 | J | jnl |
CoRR
|
| 2023 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2023 | A* | conf |
DAC
|
| 2023 | J | jnl |
ACM Trans. Design Autom. Electr. Syst.
|
| 2023 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2023 | J | jnl |
IEEE Trans. Circuits Syst. II Express Briefs
|
| 2023 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2023 | A* | conf |
IJCAI
|
| 2023 | A* | conf |
DAC
|
| 2023 | J | jnl |
CoRR
|
| 2023 | J | jnl |
CoRR
|
| 2023 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2023 | J | jnl |
ACM Trans. Design Autom. Electr. Syst.
|
| 2023 | A | conf |
ICCAD
|
| 2023 | A* | conf |
MICRO
|
| 2023 | J | jnl |
CoRR
|
| 2023 | A* | conf |
DAC
|
| 2023 | A* | conf |
DAC
|
| 2023 | — | conf |
ASP-DAC
|
| 2023 | A* | conf |
DAC
|
| 2023 | J | jnl |
CoRR
|
| 2023 | A* | conf |
DAC
|
| 2023 | — | conf |
ASICON
|
| 2023 | J | jnl |
CoRR
|
| 2023 | J | jnl |
CoRR
|
| 2023 | A | conf |
READ: Reliability-Enhanced Accelerator Dataflow Optimization Using Critical Input Pattern Reduction.
ICCAD
|
| 2023 | A | conf |
READ: Reliability-Enhanced Accelerator Dataflow Optimization using Critical Input Pattern Reduction.
DATE
|
| 2023 | J | jnl |
READ: Reliability-Enhanced Accelerator Dataflow Optimization using Critical Input Pattern Reduction.
CoRR
|
| 2023 | A | conf |
DATE
|
| 2023 | A | conf |
ICCAD
|
| 2022 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2022 | — | conf |
MLCAD
|
| 2022 | A* | conf |
DAC
|
| 2022 | A* | conf |
DAC
|
| 2022 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2022 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2022 | J | jnl |
CoRR
|
| 2022 | J | jnl |
Sci. China Inf. Sci.
|
| 2022 | — | conf |
IPDPS Workshops
|
| 2022 | J | jnl |
CoRR
|
| 2022 | A | conf |
DATE
|
| 2022 | A | conf |
ICCAD
|
| 2022 | A* | conf |
DAC
|
| 2022 | — | conf |
ASP-DAC
|
| 2022 | — | conf |
MLCAD
|
| 2022 | A | conf |
DATE
|
| 2022 | — | conf |
ASP-DAC
|
| 2022 | A | conf |
DATE
|
| 2022 | A | conf |
ICCAD
|
| 2022 | J | jnl |
CoRR
|
| 2022 | A* | conf |
DAC
|
| 2022 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2022 | A | conf |
DATE
|
| 2022 | A* | conf |
DAC
|
| 2022 | J | jnl |
CoRR
|
| 2022 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2022 | J | jnl |
IEEE Trans. Parallel Distributed Syst.
|
| 2022 | J | jnl |
CoRR
|
| 2022 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2021 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2021 | A* | conf |
DAC
|
| 2021 | — | conf |
IC-NIDC
|
| 2021 | A | conf |
DATE
|
| 2021 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2021 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2021 | — | conf |
ASP-DAC
|
| 2021 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2021 | A | conf |
ICCAD
|
| 2021 | A* | conf |
DAC
|
| 2021 | A | conf |
DATE
|
| 2021 | A | conf |
ICCAD
|
| 2021 | A* | conf |
DAC
|
| 2021 | — | conf |
ASP-DAC
|
| 2021 | J | jnl |
IEEE Des. Test
|
| 2021 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2021 | — | conf |
ASP-DAC
|
| 2021 | A | conf |
DATE
|
| 2021 | A* | conf |
DAC
|
| 2020 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2020 | A* | conf |
DAC
|
| 2020 | J | jnl |
CoRR
|
| 2020 | A | conf |
ICCAD
|
| 2020 | A | conf |
ICCAD
|
| 2020 | A | conf |
ICCAD
|
| 2020 | — | conf |
ASP-DAC
|
| 2020 | J | jnl |
IEEE Access
|
| 2020 | — | conf |
HOST
|
| 2020 | — | conf |
ASP-DAC
|
| 2020 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2020 | — | conf |
ISPD
|
| 2019 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2019 | A* | conf |
DAC
|
| 2019 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2019 | — | conf |
ISPD
|
| 2019 | A* | conf |
DAC
|
| 2019 | A | conf |
ICCAD
|
| 2019 | A | conf |
DATE
|
| 2019 | A* | conf |
DAC
|
| 2019 | — | conf |
ASP-DAC
|
| 2019 | A | conf |
ICCAD
|
| 2019 | A | conf |
ICCAD
|
| 2019 | — | conf |
ASICON
|
| 2019 | — | conf |
ASP-DAC
|
| 2019 | — | conf |
ASP-DAC
|
| 2019 | A | conf |
AISTATS
|
| 2019 | A* | conf |
DAC
|
| 2019 | A | conf |
ICCAD
|
| 2018 | — | conf |
ASP-DAC
|
| 2018 | — | conf |
ISPD
|
| 2018 | J | jnl |
CoRR
|
| 2018 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2018 | — | conf |
ASP-DAC
|
| 2018 | A* | conf |
ICML
|
| 2018 | J | jnl |
CoRR
|
| 2018 | A | conf |
ITC
|
| 2018 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2018 | J | jnl |
CoRR
|
| 2018 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2018 | J | jnl |
CoRR
|
| 2018 | J | jnl |
ACM Trans. Design Autom. Electr. Syst.
|
| 2017 | A* | conf |
DAC
|
| 2017 | — | conf |
ISPD
|
| 2017 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2017 | C | conf |
ICCD
|
| 2017 | A | conf |
ISLPED
|
| 2017 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2017 | J | jnl |
Integr.
|
| 2017 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2016 | A | conf |
ICCAD
|
| 2016 | J | jnl |
Sci. China Inf. Sci.
|
| 2016 | A | conf |
ICCAD
|
| 2016 | — | conf |
ASP-DAC
|
| 2015 | A* | conf |
DAC
|
| 2015 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2015 | A* | conf |
DAC
|
| 2015 | A | conf |
ICCAD
|
| 2010 | J | jnl |
Comput. Educ.
|
| 2009 | J | jnl |
Electron. J. Inf. Syst. Dev. Ctries.
|
| 2009 | C | conf |
ICTD
|