Yi-Shao Lai

55 papers Journal 54Unranked 1
YearRankTypeTitle / Venue / Authors
2015 J jnl
Characterising Arrhenius moisture diffusivity constants using non-isothermal sorption.
Microelectron. Reliab.
Ee-Hua Wong, Jarrod Cook, M. Dreno, Dao-Long Chen, Yi-Shao Lai
2015 J jnl
Power electronics packaging.
Microelectron. Reliab.
Katsuaki Suganuma, Jenn-Ming Song, Yi-Shao Lai
2015 J jnl
Thermal resistance of side by side multi-chip package: Thermal mode analysis.
Microelectron. Reliab.
Dao-Long Chen, Tei-Chen Chen, Ping-Feng Yang, Yi-Shao Lai
2014 J jnl
Investigation of electromigration reliability of redistribution lines in wafer-level chip-scale packages.
Microelectron. Reliab.
Chin-Li Kao, Tei-Chen Chen, Yi-Shao Lai, Ying-Ta Chiu
2014 J jnl
Nanotribological properties of ALD-processed bilayer TiO
Microelectron. Reliab.
Wun-Kai Wang, Hua-Chiang Wen, Chun-Hu Cheng, Ching-Hua Hung, Wu-Ching Chou, Wei-Hung Yau, Ping-Feng Yang, Yi-Shao Lai
2013 J jnl
Reliability of micro-interconnects in 3D IC packages.
Microelectron. Reliab.
C. Robert Kao, Albert T. Wu, King-Ning Tu, Yi-Shao Lai
2013 J jnl
Study of factors affecting warpage of HFCBGA subjected to reflow soldering-liked profile.
Microelectron. Reliab.
Tong Hong Wang, Ching-I Tsai, Chang-Chi Lee, Yi-Shao Lai
2012 J jnl
A review of three-dimensional viscoelastic models with an application to viscoelasticity characterization using nanoindentation.
Microelectron. Reliab.
Dao-Long Chen, Ping-Feng Yang, Yi-Shao Lai
2012 J jnl
Guest Editorial - Low Temperature Processing for Microelectronics and Microsystems Packaging.
Microelectron. Reliab.
Tadatomo Suga, Jenn-Ming Song, Yi-Shao Lai
2012 J jnl
Influence of trace alloying elements on the ball impact test reliability of SnAgCu solder joints.
Microelectron. Reliab.
Jenn-Ming Song, Yao-Ren Liu, Yi-Shao Lai, Ying-Ta Chiu, Ning-Cheng Lee
2012 J jnl
Reliability of high-power LED packaging and assembly.
Microelectron. Reliab.
Cheng-Yi Liu, S. W. Ricky Lee, Moo Whan Shin, Yi-Shao Lai
2012 J jnl
Structural design guideline to minimize extreme low-k delamination potential in 40 nm flip-chip packages.
Microelectron. Reliab.
Yi-Shao Lai, Meng-Kai Shih, Chang-Chi Lee, Tong Hong Wang
2012 J jnl
The performance and fracture mechanism of solder joints under mechanical reliability test.
Microelectron. Reliab.
Wei-Luen Jang, Tai-Siang Wang, Yen-Fen Lai, Kwang-Lung Lin, Yi-Shao Lai
2011 J jnl
Characteristic of copper wire and transient analysis on wirebonding process.
Microelectron. Reliab.
Hsiang-Chen Hsu, Wei-Yao Chang, Chang-Lin Yeh, Yi-Shao Lai
2011 J jnl
Copper Wire Bonding.
Microelectron. Reliab.
Michael Mayer, Yi-Shao Lai
2011 J jnl
Determination of residual strains of the EMC in PBGA during manufacturing and IR solder reflow processes.
Microelectron. Reliab.
Ming-Yi Tsai, C. W. Ting, C. Y. Huang, Yi-Shao Lai
2011 J jnl
Effect of surface roughness of silicon die and copper heat spreader on thermal performance of HFCBGA.
Microelectron. Reliab.
Tong Hong Wang, Sara N. Paisner, Chang-Chi Lee, Susan Chen, Yi-Shao Lai
2011 J jnl
Evaluating nanotribological behavior of annealing Si
Microelectron. Reliab.
Ming-Jhang Wu, Hua-Chiang Wen, Shyh-Chi Wu, Ping-Feng Yang, Yi-Shao Lai, Wen-Kuang Hsu, Wen-Fa Wu, Chang-Pin Chou
2011 J jnl
Fine pitch copper wire bonding in high volume production.
Microelectron. Reliab.
Bernd K. Appelt, Andy Tseng, Chun-Hsiung Chen, Yi-Shao Lai
2011 J jnl
Investigation of growth behavior of Al-Cu intermetallic compounds in Cu wire bonding.
Microelectron. Reliab.
Jiunn Chen, Yi-Shao Lai, Yi-Wun Wang, C. Robert Kao
2011 J jnl
Warpage evolution of overmolded ball grid array package during post-mold curing thermal process.
Microelectron. Reliab.
Tz-Cheng Chiu, Hong-Wei Huang, Yi-Shao Lai
2010 J jnl
Advances in Wafer Level Packaging (WLP).
Microelectron. Reliab.
Tong Yan Tee, Xuejun Fan, Yi-Shao Lai
2010 J jnl
Early experience with in situ chip-to-chip alignment characterization of Proximity Communication flip-chip package.
Microelectron. Reliab.
Theresa Sze, Darko Popovic, Jing Shi, Yi-Shao Lai, James G. Mitchell, Bruce Guenin, Tsung-Yueh Tsai, Chin-Li Kao, Matthew Giere
2010 J jnl
Effect of annealing treatment and nanomechanical properties for multilayer Si
Microelectron. Reliab.
Bo-Ching He, Hua-Chiang Wen, Meng-Hung Lin, Yi-Shao Lai, Wen-Fa Wu, Chang-Pin Chou
2010 J jnl
Evaluation of the nanoindentation behaviors of SiGe epitaxial layer on Si substrate.
Microelectron. Reliab.
Bo-Ching He, Chun-Hu Cheng, Hua-Chiang Wen, Yi-Shao Lai, Ping-Feng Yang, Meng-Hung Lin, Wen-Fa Wu, Chang-Pin Chou
2010 J jnl
Geometric design for ultra-long needle probe card for digital light processing wafer testing.
Microelectron. Reliab.
Hao-Yuan Chang, Wen-Fung Pan, Meng-Kai Shih, Yi-Shao Lai
2010 J jnl
Redistribution in wafer level chip size packaging technology for high power device applications: Process and design considerations.
Microelectron. Reliab.
Jiunn Chen, Yi-Shao Lai, Chueh-An Hsieh, Chia Yi Hu
2009 J jnl
Alloying modification of Sn-Ag-Cu solders by manganese and titanium.
Microelectron. Reliab.
Li-Wei Lin, Jenn-Ming Song, Yi-Shao Lai, Ying-Ta Chiu, Ning-Cheng Lee, Jun-Yen Uan
2009 J jnl
Electromigration on void formation of Sn3Ag1.5Cu FCBGA solder joints.
Microelectron. Reliab.
Ming-Hwa R. Jen, Lee-Cheng Liu, Yi-Shao Lai
2009 J jnl
High strain rate compression behavior for Sn-37Pb eutectic alloy, lead-free Sn-1Ag-0.5Cu and Sn-3Ag-0.5Cu alloys.
Microelectron. Reliab.
S. T. Jenq, Hsuan-Hu Chang, Yi-Shao Lai, Tsung-Yueh Tsai
2009 J jnl
Recent research advances in Pb-free solders.
Microelectron. Reliab.
Yi-Shao Lai, Ho-Ming Tong, King-Ning Tu
2009 J jnl
Towards elastic anisotropy and strain-induced void formation in Cu-Sn crystalline phases.
Microelectron. Reliab.
Jiunn Chen, Yi-Shao Lai
2008 J jnl
Characteristics of ZnO thin films prepared by radio frequency magnetron sputtering.
Microelectron. Reliab.
Ping-Feng Yang, Hua-Chiang Wen, Sheng-Rui Jian, Yi-Shao Lai, Sean Wu, Rong-Sheng Chen
2008 J jnl
Effects of different drop test conditions on board-level reliability of chip-scale packages.
Microelectron. Reliab.
Yi-Shao Lai, Po-Chuan Yang, Chang-Lin Yeh
2008 J jnl
Finite element model verification for packaged printed circuit board by experimental modal analysis.
Microelectron. Reliab.
Ying-Chih Lee, Bor-Tsuen Wang, Yi-Shao Lai, Chang-Lin Yeh, Rong-Sheng Chen
2008 J jnl
Investigations of solder joint damage potentials for board-level chip-scale packages subjected to consecutive drops.
Microelectron. Reliab.
Chang-Lin Yeh, Yi-Shao Lai
2008 J jnl
Reliability evaluations for board-level chip-scale packages under coupled power and thermal cycling test conditions.
Microelectron. Reliab.
Tong Hong Wang, Yi-Shao Lai, Yu-Cheng Lin
2008 J jnl
Structural design optimization for board-level drop reliability of wafer-level chip-scale packages.
Microelectron. Reliab.
Tsung-Yueh Tsai, Yi-Shao Lai, Chang-Lin Yeh, Rong-Sheng Chen
2007 J jnl
Cyclic bending reliability of wafer-level chip-scale packages.
Microelectron. Reliab.
Yi-Shao Lai, Tong Hong Wang, Han-Hui Tsai, Ming-Hwa R. Jen
2007 J jnl
Electromigration of Sn-37Pb and Sn-3Ag-1.5Cu/Sn-3Ag-0.5Cu composite flip-chip solder bumps with Ti/Ni(V)/Cu under bump metallurgy.
Microelectron. Reliab.
Yi-Shao Lai, Kuo-Ming Chen, Chin-Li Kao, Chiu-Wen Lee, Ying-Ta Chiu
2007 J jnl
Empirical correlation between package-level ball impact test and board-level drop reliability.
Microelectron. Reliab.
Chang-Lin Yeh, Yi-Shao Lai, Hsiao-Chuan Chang, Tsan-Hsien Chen
2007 J jnl
Evaluation of solder joint strengths under ball impact test.
Microelectron. Reliab.
Yi-Shao Lai, Hsiao-Chuan Chang, Chang-Lin Yeh
2007 J jnl
Optimal design towards enhancement of board-level thermomechanical reliability of wafer-level chip-scale packages.
Microelectron. Reliab.
Yi-Shao Lai, Tong Hong Wang
2007 J jnl
Response spectra analysis for undamped structural systems subjected to half-sine impact acceleration pulses.
Microelectron. Reliab.
Tsung-Yueh Tsai, Chang-Lin Yeh, Yi-Shao Lai, Rong-Sheng Chen
2007 J jnl
Transient analysis of drop responses of board-level electronic packages using response spectra incorporated with modal superposition.
Microelectron. Reliab.
Chang-Lin Yeh, Tsung-Yueh Tsai, Yi-Shao Lai
2006 J jnl
Characteristics of current crowding in flip-chip solder bumps.
Microelectron. Reliab.
Yi-Shao Lai, Chin-Li Kao
2006 J jnl
Electrothermal coupling analysis of current crowding and Joule heating in flip-chip packages.
Microelectron. Reliab.
Yi-Shao Lai, Chin-Li Kao
2006 J jnl
Evaluation of board-level reliability of electronic packages under consecutive drops.
Microelectron. Reliab.
Chang-Lin Yeh, Yi-Shao Lai, Chin-Li Kao
2006 J jnl
Experimental studies of board-level reliability of chip-scale packages subjected to JEDEC drop test condition.
Microelectron. Reliab.
Yi-Shao Lai, Ping-Feng Yang, Chang-Lin Yeh
2006 J jnl
On solution schemes for time-independent thermomechanical analysis for structures containing polymeric materials.
Microelectron. Reliab.
Yi-Shao Lai
2006 J jnl
Support excitation scheme for transient analysis of JEDEC board-level drop test.
Microelectron. Reliab.
Chang-Lin Yeh, Yi-Shao Lai
2006 J jnl
Transient fracturing of solder joints subjected to displacement-controlled impact loads.
Microelectron. Reliab.
Chang-Lin Yeh, Yi-Shao Lai
2005 J jnl
Transient analysis of the impact stage of wirebonding on Cu/low-K wafers.
Microelectron. Reliab.
Chang-Lin Yeh, Yi-Shao Lai
2005 J jnl
Verification of submodeling technique in thermomechanical reliability assessment of flip-chip package assembly.
Microelectron. Reliab.
Yi-Shao Lai, Tong Hong Wang
1993 — conf
An Observation on Fractal Characteristics of Individual River Plan Forms.
Fractals in the Natural and Applied Sciences
Ray-Shyan Wu, Yi-Shao Lai