Yasuhiro Take

27 papers A 1B 2Journal 9Unranked 15
YearRankTypeTitle / Venue / Authors
2017 — conf
An image sensor/processor 3D stacked module featuring ThruChip interfaces.
ASP-DAC
Masayuki Ikebe, Tetsuya Asai, Masafumi Mori, Toshiyuki Itou, Daisuke Uchida, Yasuhiro Take, Tadahiro Kuroda, Masato Motomura
2016 — conf
Analytical thruchip inductive coupling channel design optimization.
ASP-DAC
Li-Chung Hsu, Junichiro Kadomoto, So Hasegawa, Atsutake Kosuge, Yasuhiro Take, Tadahiro Kuroda
2016 J jnl
Efficient 3-D Bus Architectures for Inductive-Coupling ThruChip Interfaces.
IEEE Trans. Very Large Scale Integr. Syst.
Takahiro Kagami, Hiroki Matsutani, Michihiro Koibuchi, Yasuhiro Take, Tadahiro Kuroda, Hideharu Amano
2016 — conf
Motion-vector estimation and cognitive classification on an image sensor/processor 3D stacked system featuring ThruChip interfaces.
ESSCIRC
Tetsuya Asai, Masafumi Mori, Toshiyuki Itou, Yasuhiro Take, Masayuki Ikebe, Tadahiro Kuroda, Masato Motomura
2015 J jnl
A Study of Physical Design Guidelines in ThruChip Inductive Coupling Channel.
IEICE Trans. Fundam. Electron. Commun. Comput. Sci.
Li-Chung Hsu, Junichiro Kadomoto, So Hasegawa, Atsutake Kosuge, Yasuhiro Take, Tadahiro Kuroda
2015 — conf
Circuit and package design for 44GB/s inductive-coupling DRAM/SoC interface.
ASP-DAC
Akira Okada, Abdul Raziz Junaidi, Yasuhiro Take, Atsutake Kosuge, Tadahiro Kuroda
2015 — conf
Design and analysis for ThruChip design for manufacturing (DFM).
ASP-DAC
Li-Chung Hsu, Yasuhiro Take, Atsutake Kosuge, So Hasegawa, Junichiro Kadamoto, Tadahiro Kuroda
2015 — conf
Image sensor/digital logic 3D stacked module featuring inductive coupling channels for high speed/low-noise image transfer.
VLSIC
Masayuki Ikebe, Daisuke Uchida, Yasuhiro Take, Makito Someya, Satoshi Chikuda, Kento Matsuyama, Tetsuya Asai, Tadahiro Kuroda, Masato Motomura
2015 J jnl
Relay Transmission Thruchip Interface with Low-Skew 3D Clock Distribution Network.
IEICE Trans. Electron.
Yasuhiro Take, Tadahiro Kuroda
2015 J jnl
Through Chip Interface Based Three-Dimensional FPGA Architecture Exploration.
IEICE Trans. Electron.
Li-Chung Hsu, Masato Motomura, Yasuhiro Take, Tadahiro Kuroda
2014 J jnl
3D NoC with Inductive-Coupling Links for Building-Block SiPs.
IEEE Trans. Computers
Yasuhiro Take, Hiroki Matsutani, Daisuke Sasaki, Michihiro Koibuchi, Tadahiro Kuroda, Hideharu Amano
2014 — conf
A 352Gb/s inductive-coupling DRAM/SoC interface using overlapping coils with phase division multiplexing and ultra-thin fan-out wafer level package.
VLSIC
Abdul Raziz Junaidi, Yasuhiro Take, Tadahiro Kuroda
2014 A conf
Low-latency wireless 3D NoCs via randomized shortcut chips.
DATE
Hiroki Matsutani, Michihiro Koibuchi, Ikki Fujiwara, Takahiro Kagami, Yasuhiro Take, Tadahiro Kuroda, Paul Bogdan, Radu Marculescu, Hideharu Amano
2013 — conf
3D clock distribution using vertically/horizontally-coupled resonators.
ISSCC
Yasuhiro Take, Noriyuki Miura, Hiroki Ishikuro, Tadahiro Kuroda
2013 J jnl
A Scalable 3D Heterogeneous Multicore with an Inductive ThruChip Interface.
IEEE Micro
Noriyuki Miura, Yusuke Koizumi, Yasuhiro Take, Hiroki Matsutani, Tadahiro Kuroda, Hideharu Amano, Ryuichi Sakamoto, Mitaro Namiki, Kimiyoshi Usami, Masaaki Kondo, Hiroshi Nakamura
2013 — conf
A case for wireless 3D NoCs for CMPs.
ASP-DAC
Hiroki Matsutani, Paul Bogdan, Radu Marculescu, Yasuhiro Take, Daisuke Sasaki, Hao Zhang, Michihiro Koibuchi, Tadahiro Kuroda, Hideharu Amano
2013 — conf
A scalable 3D heterogeneous multi-core processor with inductive-coupling thruchip interface.
COOL Chips
Noriyuki Miura, Yusuke Koizumi, Eiichi Sasaki, Yasuhiro Take, Hiroki Matsutani, Tadahiro Kuroda, Hideharu Amano, Ryuichi Sakamoto, Mitaro Namiki, Kimiyoshi Usami, Masaaki Kondo, Hiroshi Nakamura
2013 — conf
A scalable 3D heterogeneous multi-core processor with inductive-coupling thruchip interface.
Hot Chips Symposium
Noriyuki Miura, Yusuke Koizumi, Eiichi Sasaki, Yasuhiro Take, Hiroki Matsutani, Tadahiro Kuroda, Hideharu Amano, Ryuichi Sakamoto, Mitaro Namiki, Kimiyoshi Usami, Masaaki Kondo, Hiroshi Nakamura
2013 B conf
Demonstration of a heterogeneous multi-core processor with 3-D inductive coupling links.
FPL
Yusuke Koizumi, Noriyuki Miura, Yasuhiro Take, Hiroki Matsutani, Tadahiro Kuroda, Hideharu Amano, Ryuichi Sakamoto, Mitaro Namiki, Kimiyoshi Usami, Masaaki Kondo, Hiroshi Nakamura
2013 J jnl
Vertical Link On/Off Regulations for Inductive-Coupling Based Wireless 3-D NoCs.
IEICE Trans. Inf. Syst.
Hao Zhang, Hiroki Matsutani, Yasuhiro Take, Tadahiro Kuroda, Hideharu Amano
2012 B conf
CMA-Cube: A scalable reconfigurable accelerator with 3-D wireless inductive coupling interconnect.
FPL
Yusuke Koizumi, Eiichi Sasaki, Hideharu Amano, Hiroki Matsutani, Yasuhiro Take, Tadahiro Kuroda, Ryuichi Sakamoto, Mitaro Namiki, Kimiyoshi Usami, Masaaki Kondo, Hiroshi Nakamura
2012 J jnl
Simultaneous 6-Gb/s Data and 10-mW Power Transmission Using Nested Clover Coils for Noncontact Memory Card.
IEEE J. Solid State Circuits
Andrzej Radecki, Yuxiang Yuan, Noriyuki Miura, Iori Aikawa, Yasuhiro Take, Hiroki Ishikuro, Tadahiro Kuroda
2012 — conf
Simultaneous data and power transmission using nested clover coils.
ASP-DAC
Yasuhiro Take, Hayun Chung, Noriyuki Miura, Tadahiro Kuroda
2012 — conf
Vertical Link On/Off Control Methods for Wireless 3-D NoCs.
ARCS
Hao Zhang, Hiroki Matsutani, Yasuhiro Take, Tadahiro Kuroda, Hideharu Amano
2011 — conf
A 2.7Gb/s/mm
ISSCC
Noriyuki Miura, Yasuhiro Take, Mitsuko Saito, Yoichi Yoshida, Tadahiro Kuroda
2011 J jnl
A 30 Gb/s/Link 2.2 Tb/s/mm
IEEE J. Solid State Circuits
Yasuhiro Take, Noriyuki Miura, Tadahiro Kuroda
2011 — conf
A vertical bubble flow network using inductive-coupling for 3-D CMPs.
NOCS
Hiroki Matsutani, Yasuhiro Take, Daisuke Sasaki, Masayuki Kimura, Yuki Ono, Yukinori Nishiyama, Michihiro Koibuchi, Tadahiro Kuroda, Hideharu Amano