| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2021 | — | conf |
MeMeA
|
| 2020 | C | conf |
ISCAS
|
| 2019 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2019 | C | conf |
ISCAS
|
| 2019 | Misc | conf |
ICASSP
|
| 2019 | — | conf |
ISOEN
|
| 2019 | J | jnl |
Sensors
|
| 2019 | — | conf |
UEMCON
|
| 2019 | J | jnl |
IEEE Trans. Biomed. Circuits Syst.
|
| 2018 | A | conf |
MobiSys
|
| 2018 | — | conf |
BioCAS
|
| 2018 | J | jnl |
IEEE Trans. Biomed. Circuits Syst.
|
| 2017 | — | conf |
BioCAS
|
| 2017 | — | conf |
RFID
|
| 2017 | C | conf |
ISCAS
|
| 2017 | C | conf |
ISCAS
|
| 2017 | C | conf |
ISCAS
|
| 2017 | — | conf |
Novel integration and packaging concepts of highly miniaturized inductively powered neural implants.
EMBC
|
| 2017 | J | jnl |
IEEE Embed. Syst. Lett.
|
| 2016 | C | conf |
ISCAS
|
| 2012 | J | jnl |
IEICE Electron. Express
|