| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2025 | J | jnl |
IEEE Trans. Ind. Electron.
|
| 2025 | J | jnl |
IEICE Electron. Express
|
| 2025 | J | jnl |
IEEE J. Sel. Top. Appl. Earth Obs. Remote. Sens.
|
| 2025 | J | jnl |
IEEE Trans. Aerosp. Electron. Syst.
|
| 2025 | J | jnl |
IEEE Trans. Aerosp. Electron. Syst.
|
| 2023 | J | jnl |
IEEE Trans. Geosci. Remote. Sens.
|
| 2023 | J | jnl |
IEEE J. Sel. Top. Appl. Earth Obs. Remote. Sens.
|
| 2022 | J | jnl |
IET Signal Process.
|
| 2022 | J | jnl |
IEEE Trans. Geosci. Remote. Sens.
|
| 2021 | — | conf |
CONF-CDS
|
| 2021 | — | conf |
ICTA
|
| 2019 | C | conf |
VCIP
|
| 2019 | J | jnl |
IEEE Access
|
| 2019 | — | conf |
ADHIP (2)
|
| 2019 | J | jnl |
Appl. Math. Lett.
|
| 2019 | — | conf |
ADHIP (2)
|
| 2019 | J | jnl |
Sci. China Inf. Sci.
|
| 2019 | — | conf |
CSIA
|
| 2018 | J | jnl |
J. Electron. Test.
|
| 2018 | J | jnl |
Analytical Parameter Extraction for Small-Signal Equivalent Circuit of 3D FinFET Into Sub-THz Range.
IEEE Access
|
| 2017 | J | jnl |
Microelectron. Reliab.
|
| 2017 | J | jnl |
IEEE Trans. Circuits Syst. Video Technol.
|
| 2017 | J | jnl |
Signal Process.
|
| 2016 | J | jnl |
Microelectron. Reliab.
|
| 2016 | J | jnl |
Microelectron. Reliab.
|
| 2016 | J | jnl |
IEEE Geosci. Remote. Sens. Lett.
|
| 2015 | J | jnl |
Appl. Math. Comput.
|
| 2012 | J | jnl |
J. Digit. Inf. Manag.
|
| 2011 | — | conf |
ICAIC (1)
|