Yangyang Yan

12 papers Journal 7Unranked 5
YearRankTypeTitle / Venue / Authors
2025 J jnl
Classification of nighttime light types in China's nature protected areas based on SDGSAT-1.
Int. J. Digit. Earth
Yangyang Yan, Rong Zhang, Zongming Wang, Chuanpeng Zhao, Haihang Zeng, Qian Shi, Mingming Jia
2025 J jnl
Zero-Training Task-Specific Model Synthesis for Few-Shot Medical Image Classification.
CoRR
Yao Qin, Yangyang Yan, YuanChao Yang, Jinhua Pang, Huanyong Bi, Yuan Liu, Haihua Wang
2024 — conf
AI Algorithm for Ultra-widefield Fundus Imaging for Diabetic Retinopathy - RDR, DME.
UWF4DR@MICCAI
Bo Yang, Yue Zhang, Di Liu, Qicheng Li, Yangyang Yan
2024 — conf
AI-Based Diagnostic Model for Predicting ci-DME Development.
DIAMOND/MARIO@MICCAI
Bo Yang, Yangyang Yan, Wencheng Miao
2024 — conf
Image Quality Assessment with Model Fusion for Ultra-widefield Fundus.
UWF4DR@MICCAI
Bo Yang, Yangyang Yan, Di Liu, Qicheng Li, Yue Zhang
2022 J jnl
Analyzing the Dynamic Spatiotemporal Changes in Urban Extension across Zhejiang Province Using NPP-VIIRS Nighttime Light Data.
Remote. Sens.
Yangyang Yan, Hui Lei, Yihong Chen, Bin Zhou
2022 J jnl
DeepIDA: Predicting Isoform-Disease Associations by Data Fusion and Deep Neural Networks.
IEEE ACM Trans. Comput. Biol. Bioinform.
Guoxian Yu, Yeqian Yang, Yangyang Yan, Maozu Guo, Xiangliang Zhang, Jun Wang
2022 J jnl
Research on Ni
IEICE Electron. Express
Fengwei Dai, David Wei Zhang, Yangyang Yan, Guojun Wang, Liqiang Cao
2020 J jnl
Influence of Fluid on Seal and Assembly of Pipeline Fittings Based on the Multiscale Finite Element Model.
Complex.
Yangyang Yan, Yaping Fan
2016 — conf
Low cost polyimide liner formation with vacuum-assisted spin coating for through-silicon-vias.
3DIC
Yangyang Yan, Ziyue Zhang, Zhiqiang Cheng, Lingfeng Zhou, Zhiming Chen, Yingtao Ding
2015 — conf
Vacuum-assisted-spin-coating of polyimide liner for high-aspect-ratio TSVs applications.
3DIC
Yangyang Yan, Yingtao Ding, Qianwen Chen, Kang Wook Lee, Takafumi Fukushima, Mitsumasa Koyanagi
2014 J jnl
Analytical solution on interfacial reliability of 3-D through-silicon-via (TSV) containing dielectric liner.
Microelectron. Reliab.
Yingtao Ding, Yangyang Yan, Qianwen Chen, Shiwei Wang, Rui Su, Hua Dang