Yangyang Yan - RankMe

12 papers Journal 7Unranked 5

Year	Rank	Type	Title / Venue / Authors
2025	J	`jnl`	Classification of nighttime light types in China's nature protected areas based on SDGSAT-1. Int. J. Digit. Earth Yangyang Yan, Rong Zhang, Zongming Wang, Chuanpeng Zhao, Haihang Zeng, Qian Shi, Mingming Jia
2025	J	`jnl`	Zero-Training Task-Specific Model Synthesis for Few-Shot Medical Image Classification. CoRR Yao Qin, Yangyang Yan, YuanChao Yang, Jinhua Pang, Huanyong Bi, Yuan Liu, Haihua Wang
2024	—	`conf`	AI Algorithm for Ultra-widefield Fundus Imaging for Diabetic Retinopathy - RDR, DME. UWF4DR@MICCAI Bo Yang, Yue Zhang, Di Liu, Qicheng Li, Yangyang Yan
2024	—	`conf`	AI-Based Diagnostic Model for Predicting ci-DME Development. DIAMOND/MARIO@MICCAI Bo Yang, Yangyang Yan, Wencheng Miao
2024	—	`conf`	Image Quality Assessment with Model Fusion for Ultra-widefield Fundus. UWF4DR@MICCAI Bo Yang, Yangyang Yan, Di Liu, Qicheng Li, Yue Zhang
2022	J	`jnl`	Analyzing the Dynamic Spatiotemporal Changes in Urban Extension across Zhejiang Province Using NPP-VIIRS Nighttime Light Data. Remote. Sens. Yangyang Yan, Hui Lei, Yihong Chen, Bin Zhou
2022	J	`jnl`	DeepIDA: Predicting Isoform-Disease Associations by Data Fusion and Deep Neural Networks. IEEE ACM Trans. Comput. Biol. Bioinform. Guoxian Yu, Yeqian Yang, Yangyang Yan, Maozu Guo, Xiangliang Zhang, Jun Wang
2022	J	`jnl`	Research on Ni IEICE Electron. Express Fengwei Dai, David Wei Zhang, Yangyang Yan, Guojun Wang, Liqiang Cao
2020	J	`jnl`	Influence of Fluid on Seal and Assembly of Pipeline Fittings Based on the Multiscale Finite Element Model. Complex. Yangyang Yan, Yaping Fan
2016	—	`conf`	Low cost polyimide liner formation with vacuum-assisted spin coating for through-silicon-vias. 3DIC Yangyang Yan, Ziyue Zhang, Zhiqiang Cheng, Lingfeng Zhou, Zhiming Chen, Yingtao Ding
2015	—	`conf`	Vacuum-assisted-spin-coating of polyimide liner for high-aspect-ratio TSVs applications. 3DIC Yangyang Yan, Yingtao Ding, Qianwen Chen, Kang Wook Lee, Takafumi Fukushima, Mitsumasa Koyanagi
2014	J	`jnl`	Analytical solution on interfacial reliability of 3-D through-silicon-via (TSV) containing dielectric liner. Microelectron. Reliab. Yingtao Ding, Yangyang Yan, Qianwen Chen, Shiwei Wang, Rui Su, Hua Dang