| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2026 | J | jnl |
CoRR
|
| 2026 | J | jnl |
CoRR
|
| 2026 | J | jnl |
CoRR
|
| 2024 | A* | conf |
ICLR
|
| 2024 | J | jnl |
CoRR
|
| 2024 | J | jnl |
CoRR
|
| 2024 | — | conf |
ACL (1)
|
| 2024 | J | jnl |
CoRR
|
| 2024 | J | jnl |
CoRR
|
| 2023 | J | jnl |
CoRR
|
| 2023 | J | jnl |
Data Min. Knowl. Discov.
|
| 2023 | A* | conf |
EMNLP
|
| 2023 | J | jnl |
Trans. Assoc. Comput. Linguistics
|
| 2023 | J | jnl |
CoRR
|
| 2023 | J | jnl |
Neural Networks
|
| 2022 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2022 | J | jnl |
IEEE Trans. Cloud Comput.
|
| 2022 | A* | conf |
NeurIPS
|
| 2022 | — | conf |
ACL (1)
|
| 2021 | J | jnl |
IEEE Trans. Parallel Distributed Syst.
|
| 2021 | J | jnl |
IEEE Trans. Parallel Distributed Syst.
|
| 2021 | J | jnl |
IEEE ACM Trans. Audio Speech Lang. Process.
|
| 2021 | J | jnl |
IEEE Access
|
| 2020 | J | jnl |
IEEE Trans. Ind. Electron.
|
| 2020 | J | jnl |
ACM Comput. Surv.
|
| 2020 | J | jnl |
CCF Trans. Netw.
|
| 2020 | A* | conf |
ISCA
|
| 2020 | J | jnl |
CoRR
|
| 2020 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2020 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2019 | J | jnl |
IEEE/ACM Trans. Netw.
|
| 2019 | — | conf |
NEAT@SIGCOMM
|
| 2019 | A* | conf |
MICRO
|
| 2018 | J | jnl |
IEEE Comput. Archit. Lett.
|
| 2018 | J | jnl |
CoRR
|
| 2018 | — | conf |
ECCV (9)
|
| 2018 | A* | conf |
AAAI
|
| 2018 | — | conf |
ICSE (Companion Volume)
|
| 2018 | A* | conf |
AAAI
|
| 2018 | J | jnl |
IEEE Trans. Parallel Distributed Syst.
|
| 2018 | A | conf |
RTAS
|
| 2017 | A* | conf |
ISCA
|
| 2017 | C | conf |
ICIS
|
| 2017 | J | jnl |
CoRR
|
| 2017 | A* | conf |
DAC
|
| 2017 | — | conf |
I3D
|
| 2017 | J | jnl |
ACM Comput. Surv.
|
| 2017 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2016 | J | jnl |
IEEE Trans. Computers
|
| 2016 | J | jnl |
IEEE Trans. Cybern.
|
| 2015 | — | conf |
SIGGRAPH Asia Mobile Graphics and Interactive Applications
|
| 2015 | J | jnl |
IEEE Trans. Ind. Electron.
|
| 2015 | A | conf |
DATE
|
| 2015 | J | jnl |
Concurr. Comput. Pract. Exp.
|
| 2015 | C | conf |
ISCAS
|
| 2014 | J | jnl |
IEEE Geosci. Remote. Sens. Lett.
|
| 2014 | — | conf |
SIGGRAPH ASIA Mobile Graphics and Interactive Applications
|
| 2014 | B | conf |
ICPADS
|
| 2014 | Misc | conf |
FIT
|
| 2014 | — | conf |
I3D
|
| 2014 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2014 | J | jnl |
IEICE Trans. Inf. Syst.
|
| 2014 | J | jnl |
IEICE Trans. Inf. Syst.
|
| 2013 | B | conf |
FG
|
| 2013 | — | conf |
ESEC/SIGSOFT FSE
|
| 2013 | J | jnl |
Found. Trends Electron. Des. Autom.
|
| 2013 | J | jnl |
IEICE Trans. Inf. Syst.
|
| 2013 | C | conf |
ICCD
|
| 2013 | — | conf |
SIGGRAPH ASIA Technical Briefs
|
| 2012 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2012 | — | conf |
IPDPS Workshops
|
| 2012 | — | conf |
Asian Test Symposium
|
| 2012 | J | jnl |
IEEE Trans. Biomed. Eng.
|
| 2012 | C | conf |
ISCAS
|
| 2012 | — | conf |
BioCAS
|
| 2012 | J | jnl |
Integr.
|
| 2011 | J | jnl |
VLSI Design
|
| 2011 | A | conf |
ICCAD
|
| 2011 | J | jnl |
VLSI Design
|
| 2011 | A | conf |
DATE
|
| 2011 | A* | conf |
INFOCOM
|
| 2011 | A* | conf |
DAC
|
| 2011 | J | jnl |
ACM Trans. Design Autom. Electr. Syst.
|
| 2010 | A* | conf |
DAC
|
| 2010 | J | jnl |
Integr.
|
| 2010 | C | conf |
CIT
|
| 2009 | A | conf |
ICCAD
|
| 2009 | A | conf |
ICCAD
|
| 2006 | J | jnl |
J. Low Power Electron.
|
| 2005 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2005 | C | conf |
ICCD
|
| 2003 | C | conf |
ICCD
|
| 2002 | — | conf |
ASP-DAC/VLSI Design
|
| 2001 | — | conf |
ISPD
|