| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2026 | J | jnl |
CoRR
|
| 2026 | J | jnl |
CoRR
|
| 2026 | J | jnl |
CoRR
|
| 2026 | J | jnl |
CoRR
|
| 2026 | J | jnl |
CoRR
|
| 2026 | J | jnl |
CoRR
|
| 2026 | J | jnl |
CoRR
|
| 2025 | J | jnl |
CoRR
|
| 2025 | J | jnl |
CoRR
|
| 2025 | J | jnl |
A Spatio-Temporal Attention Network With Multiframe Information for Infrared Small Target Detection.
IEEE J. Sel. Top. Appl. Earth Obs. Remote. Sens.
|
| 2025 | J | jnl |
IEEE Trans. Instrum. Meas.
|
| 2025 | J | jnl |
CoRR
|
| 2025 | J | jnl |
CoRR
|
| 2025 | J | jnl |
CoRR
|
| 2025 | J | jnl |
CoRR
|
| 2025 | J | jnl |
CoRR
|
| 2025 | J | jnl |
CoRR
|
| 2025 | J | jnl |
CoRR
|
| 2025 | J | jnl |
CoRR
|
| 2025 | J | jnl |
Int. J. Comput. Vis.
|
| 2025 | J | jnl |
CoRR
|
| 2025 | J | jnl |
CoRR
|
| 2025 | J | jnl |
CoRR
|
| 2025 | A* | conf |
CVPR
|
| 2025 | J | jnl |
CoRR
|
| 2025 | J | jnl |
CoRR
|
| 2025 | J | jnl |
CoRR
|
| 2025 | J | jnl |
CoRR
|
| 2025 | J | jnl |
CoRR
|
| 2025 | J | jnl |
IEEE Trans. Geosci. Remote. Sens.
|
| 2025 | J | jnl |
CoRR
|
| 2024 | — | conf |
ECCV (53)
|
| 2024 | J | jnl |
CoRR
|
| 2024 | J | jnl |
Eng. Appl. Artif. Intell.
|
| 2024 | J | jnl |
IEEE Trans. Circuits Syst. Video Technol.
|
| 2024 | — | conf |
MIDL
|
| 2024 | J | jnl |
IEEE Trans. Image Process.
|
| 2024 | J | jnl |
CoRR
|
| 2024 | A* | conf |
ACM Multimedia
|
| 2024 | J | jnl |
Microelectron. J.
|
| 2024 | J | jnl |
IEEE Trans. Instrum. Meas.
|
| 2023 | J | jnl |
IEEE Access
|
| 2023 | — | conf |
PRCV (2)
|
| 2021 | J | jnl |
Sensors
|
| 2021 | A | conf |
ITC
|
| 2021 | — | conf |
ICIG (1)
|
| 2021 | — | conf |
ICIGP
|
| 2020 | J | jnl |
IEEE Access
|
| 2019 | J | jnl |
Scheimpflug Camera-Based Stereo-Digital Image Correlation for Full-Field 3D Deformation Measurement.
J. Sensors
|
| 2017 | — | conf |
CICC
|
| 2017 | J | jnl |
IEEE Trans. Circuits Syst. Video Technol.
|
| 2017 | J | jnl |
Pattern Recognit. Lett.
|
| 2016 | J | jnl |
J. Sensors
|
| 2016 | J | jnl |
Pattern Recognit.
|
| 2016 | C | conf |
ISCAS
|
| 2016 | J | jnl |
IET Comput. Vis.
|
| 2015 | — | conf |
ASICON
|
| 2015 | J | jnl |
Sensors
|
| 2014 | — | conf |
CICC
|
| 2014 | — | conf |
ESSCIRC
|
| 2014 | — | conf |
CICC
|
| 2014 | — | conf |
ESSDERC
|
| 2014 | J | jnl |
Sci. China Inf. Sci.
|
| 2014 | C | conf |
DASC
|
| 2014 | J | jnl |
J. Electronic Imaging
|
| 2014 | J | jnl |
Image Vis. Comput.
|
| 2013 | J | jnl |
IEEE Trans. Circuits Syst. II Express Briefs
|
| 2013 | Misc | conf |
ICIG
|
| 2013 | J | jnl |
IEEE J. Emerg. Sel. Topics Circuits Syst.
|
| 2013 | J | jnl |
EURASIP J. Adv. Signal Process.
|
| 2013 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2013 | — | conf |
Thermal-reliable 3D clock-tree synthesis considering nonlinear electrical-thermal-coupled TSV model.
ASP-DAC
|
| 2012 | J | jnl |
Analysis and Modeling of Internal State Variables for Dynamic Effects of Nonvolatile Memory Devices.
IEEE Trans. Circuits Syst. I Regul. Pap.
|
| 2012 | — | conf |
ASP-DAC
|
| 2012 | — | conf |
Sensors, Cameras, and Systems for Industrial and Scientific Applications
|
| 2012 | J | jnl |
EURASIP J. Adv. Signal Process.
|
| 2006 | — | conf |
CASE
|
| 2005 | — | conf |
CGIV
|