Yang Du - RankMe

15 papers A* 4A 2C 1Journal 5Unranked 3

Year	Rank	Type	Title / Venue / Authors
2017	J	`jnl`	Full Chip Impact Study of Power Delivery Network Designs in Gate-Level Monolithic 3-D ICs. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. Sandeep Kumar Samal, Kambiz Samadi, Pratyush Kamal, Yang Du, Sung Kyu Lim
2017	J	`jnl`	Shrunk-2-D: A Physical Design Methodology to Build Commercial-Quality Monolithic 3-D ICs. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. Shreepad Panth, Kambiz Samadi, Yang Du, Sung Kyu Lim
2017	J	`jnl`	Tier Degradation of Monolithic 3-D ICs: A Power Performance Study at Different Technology Nodes. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. Shreepad Panth, Sandeep Kumar Samal, Kambiz Samadi, Yang Du, Sung Kyu Lim
2016	J	`jnl`	Adaptive Regression-Based Thermal Modeling and Optimization for Monolithic 3-D ICs. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. Sandeep Kumar Samal, Shreepad Panth, Kambiz Samadi, Mehdi Saedi, Yang Du, Sung Kyu Lim
2016	C	`conf`	BEOL stack-aware routability prediction from placement using data mining techniques. ICCD Wei-Ting Jonas Chan, Yang Du, Andrew B. Kahng, Siddhartha Nath, Kambiz Samadi
2015	—	`conf`	3D VLSI: A Scalable Integration Beyond 2D. ISPD Karim Arabi, Kambiz Samadi, Yang Du
2015	A*	`conf`	3DIC benefit estimation and implementation guidance from 2DIC implementation. DAC Wei-Ting Jonas Chan, Siddhartha Nath, Andrew B. Kahng, Yang Du, Kambiz Samadi
2015	J	`jnl`	Placement-Driven Partitioning for Congestion Mitigation in Monolithic 3D IC Designs. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. Shreepad Panth, Kambiz Samadi, Yang Du, Sung Kyu Lim
2015	A*	`conf`	Tier-partitioning for power delivery vs cooling tradeoff in 3D VLSI for mobile applications. DAC Shreepad Panth, Kambiz Samadi, Yang Du, Sung Kyu Lim
2014	A	`conf`	Design and CAD methodologies for low power gate-level monolithic 3D ICs. ISLPED Shreepad A. Panth, Kambiz Samadi, Yang Du, Sung Kyu Lim
2014	A*	`conf`	Fast and Accurate Thermal Modeling and Optimization for Monolithic 3D ICs. DAC Sandeep Kumar Samal, Shreepad Panth, Kambiz Samadi, Mehdi Saedi, Yang Du, Sung Kyu Lim
2014	A	`conf`	Full chip impact study of power delivery network designs in monolithic 3D ICs. ICCAD Sandeep Kumar Samal, Kambiz Samadi, Pratyush Kamal, Yang Du, Sung Kyu Lim
2014	—	`conf`	Placement-driven partitioning for congestion mitigation in monolithic 3D IC designs. ISPD Shreepad Panth, Kambiz Samadi, Yang Du, Sung Kyu Lim
2014	A*	`conf`	Power-Performance Study of Block-Level Monolithic 3D-ICs Considering Inter-Tier Performance Variations. DAC Shreepad Panth, Kambiz Samadi, Yang Du, Sung Kyu Lim
2013	—	`conf`	High-density integration of functional modules using monolithic 3D-IC technology. ASP-DAC Shreepad Panth, Kambiz Samadi, Yang Du, Sung Kyu Lim