Yang Du

15 papers A* 4A 2C 1Journal 5Unranked 3
YearRankTypeTitle / Venue / Authors
2017 J jnl
Full Chip Impact Study of Power Delivery Network Designs in Gate-Level Monolithic 3-D ICs.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
Sandeep Kumar Samal, Kambiz Samadi, Pratyush Kamal, Yang Du, Sung Kyu Lim
2017 J jnl
Shrunk-2-D: A Physical Design Methodology to Build Commercial-Quality Monolithic 3-D ICs.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
Shreepad Panth, Kambiz Samadi, Yang Du, Sung Kyu Lim
2017 J jnl
Tier Degradation of Monolithic 3-D ICs: A Power Performance Study at Different Technology Nodes.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
Shreepad Panth, Sandeep Kumar Samal, Kambiz Samadi, Yang Du, Sung Kyu Lim
2016 J jnl
Adaptive Regression-Based Thermal Modeling and Optimization for Monolithic 3-D ICs.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
Sandeep Kumar Samal, Shreepad Panth, Kambiz Samadi, Mehdi Saedi, Yang Du, Sung Kyu Lim
2016 C conf
BEOL stack-aware routability prediction from placement using data mining techniques.
ICCD
Wei-Ting Jonas Chan, Yang Du, Andrew B. Kahng, Siddhartha Nath, Kambiz Samadi
2015 — conf
3D VLSI: A Scalable Integration Beyond 2D.
ISPD
Karim Arabi, Kambiz Samadi, Yang Du
2015 A* conf
3DIC benefit estimation and implementation guidance from 2DIC implementation.
DAC
Wei-Ting Jonas Chan, Siddhartha Nath, Andrew B. Kahng, Yang Du, Kambiz Samadi
2015 J jnl
Placement-Driven Partitioning for Congestion Mitigation in Monolithic 3D IC Designs.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
Shreepad Panth, Kambiz Samadi, Yang Du, Sung Kyu Lim
2015 A* conf
Tier-partitioning for power delivery vs cooling tradeoff in 3D VLSI for mobile applications.
DAC
Shreepad Panth, Kambiz Samadi, Yang Du, Sung Kyu Lim
2014 A conf
Design and CAD methodologies for low power gate-level monolithic 3D ICs.
ISLPED
Shreepad A. Panth, Kambiz Samadi, Yang Du, Sung Kyu Lim
2014 A* conf
Fast and Accurate Thermal Modeling and Optimization for Monolithic 3D ICs.
DAC
Sandeep Kumar Samal, Shreepad Panth, Kambiz Samadi, Mehdi Saedi, Yang Du, Sung Kyu Lim
2014 A conf
Full chip impact study of power delivery network designs in monolithic 3D ICs.
ICCAD
Sandeep Kumar Samal, Kambiz Samadi, Pratyush Kamal, Yang Du, Sung Kyu Lim
2014 — conf
Placement-driven partitioning for congestion mitigation in monolithic 3D IC designs.
ISPD
Shreepad Panth, Kambiz Samadi, Yang Du, Sung Kyu Lim
2014 A* conf
Power-Performance Study of Block-Level Monolithic 3D-ICs Considering Inter-Tier Performance Variations.
DAC
Shreepad Panth, Kambiz Samadi, Yang Du, Sung Kyu Lim
2013 — conf
High-density integration of functional modules using monolithic 3D-IC technology.
ASP-DAC
Shreepad Panth, Kambiz Samadi, Yang Du, Sung Kyu Lim