| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2017 | J | jnl |
Proc. IEEE
|
| 2016 | — | conf |
3D Image Processing, Measurement (3DIPM), and Applications
|
| 2016 | C | conf |
ICCE
|
| 2015 | B | conf |
ICIP
|
| 2013 | C | conf |
ICCE
|
| 2013 | J | jnl |
IEEE Trans. Circuits Syst. Video Technol.
|
| 2012 | — | conf |
ACCV (4)
|
| 2012 | — | conf |
SD&A
|
| 2010 | B | conf |
ICIP
|
| 2009 | B | conf |
ICIP
|
| 2006 | — | conf |
Color Imaging: Processing, Hardcopy, and Applications
|
| 2005 | — | conf |
Color Imaging: Processing, Hardcopy, and Applications
|
| 2005 | — | conf |
ICIP (1)
|
| 2005 | — | conf |
Color Imaging: Processing, Hardcopy, and Applications
|
| 2005 | — | conf |
CIC
|
| 2004 | — | conf |
CGIV
|
| 2004 | — | conf |
Color Imaging: Processing, Hardcopy, and Applications
|
| 2004 | B | conf |
ICIP
|
| 2003 | — | conf |
Color Imaging: Processing, Hardcopy, and Applications
|
| 2003 | — | conf |
Color Imaging: Processing, Hardcopy, and Applications
|
| 2003 | — | conf |
Color Imaging: Processing, Hardcopy, and Applications
|