Y. C. Chan

32 papers B 1Journal 29Unranked 2
YearRankTypeTitle / Venue / Authors
2016 J jnl
Temporal dynamics of visual working memory.
NeuroImage
Monika Sobczak-Edmans, T. H. B. Ng, Y. C. Chan, E. Chew, Kai-Hsiang Chuang, Shen-Hsing Annabel Chen
2014 J jnl
Growth mechanism of intermetallic compounds and damping properties of Sn-Ag-Cu-1 wt% nano-ZrO
Microelectron. Reliab.
Asit Kumar Gain, Y. C. Chan
2014 J jnl
Reliability of washable wearable screen printed UHF RFID tags.
Microelectron. Reliab.
Johanna Virkki, Toni Björninen, T. Kellomäki, Sari Merilampi, I. Shafiq, Leena Ukkonen, Lauri Sydänheimo, Y. C. Chan
2012 — conf
FPGA Implementation of SRAM-based Ternary Content Addressable Memory.
IPDPS Workshops
Zahid Ullah, Manish Kumar Jaiswal, Y. C. Chan, Ray C. C. Cheung
2011 J jnl
Effect of additions of ZrO
Microelectron. Reliab.
Asit Kumar Gain, Y. C. Chan, Winco K. C. Yung
2011 J jnl
Microstructure, thermal analysis and hardness of a Sn-Ag-Cu-1 wt% nano-TiO
Microelectron. Reliab.
Asit Kumar Gain, Y. C. Chan, Winco K. C. Yung
2010 J jnl
Effect of nano Al
Microelectron. Reliab.
Tama Fouzder, Asit Kumar Gain, Y. C. Chan, Ahmed Sharif, Winco K. C. Yung
2010 J jnl
Influence of Ag micro-particle additions on the microstructure, hardness and tensile properties of Sn-9Zn binary eutectic solder alloy.
Microelectron. Reliab.
Mansur Ahmed, Tama Fouzder, Ahmed Sharif, Asit Kumar Gain, Y. C. Chan
2010 J jnl
Self-Monitoring and Self-Assessing Atomic Clocks.
IEEE Trans. Instrum. Meas.
Y. C. Chan, W. A. Johnson, S. K. Karuza, A. M. Young, J. C. Camparo
2009 J jnl
Interfacial microstructure and shear strength of Ag nano particle doped Sn-9Zn solder in ball grid array packages.
Microelectron. Reliab.
Asit Kumar Gain, Y. C. Chan, Ahmed Sharif, N. B. Wong, Winco K. C. Yung
2009 J jnl
Research advances in nano-composite solders.
Microelectron. Reliab.
Jun Shen, Y. C. Chan
2008 B conf
A hybrid prognostics methodology for electronic products.
IJCNN
Sachin Kumar, Myra Torres, Y. C. Chan, Michael G. Pecht
2008 J jnl
Do air pollution emissions and fuel consumption models for roadways include the effects of congestion in the roadway traffic flow?
Environ. Model. Softw.
Robin Smit, A. L. Brown, Y. C. Chan
2006 J jnl
Comparative study of wetting behavior and mechanical properties (microhardness) of Sn-Zn and Sn-Pb solders.
Microelectron. J.
Rashed Adnan Islam, Y. C. Chan, W. Jillek, Samia Islam
2005 J jnl
Study of anisotropic conductive adhesive joint behavior under 3-point bending.
Microelectron. Reliab.
M. J. Rizvi, Y. C. Chan, Chris Bailey, Hua Lu
2004 J jnl
Bias-HAST on tape ball grid array (TBGA) test pattern.
Microelectron. Reliab.
N. H. Yeung, Victor Lau, Y. C. Chan
2004 J jnl
Effect of microwave preheating on the bonding performance of flip chip on flex joint.
Microelectron. Reliab.
Rashed Adnan Islam, Y. C. Chan
2004 J jnl
Investigation on bondability and reliability of UV-curable adhesive joints for stable mechanical properties in photonic device packaging.
Microelectron. Reliab.
C. W. Tan, Y. C. Chan, H. P. Chan, N. W. Leung, C. K. So
2004 J jnl
Thermal stability performance of anisotropic conductive film at different bonding temperatures.
Microelectron. Reliab.
S. C. Tan, Y. C. Chan, Y. W. Chiu, C. W. Tan
2003 J jnl
Behaviour of anisotropic conductive joints under mechanical loading.
Microelectron. Reliab.
C. W. Tan, Y. C. Chan, N. H. Yeung
2003 J jnl
Effect of autoclave test on anisotropic conductive joints.
Microelectron. Reliab.
C. W. Tan, Y. C. Chan, N. H. Yeung
2002 J jnl
Application of adhesive bonding techniques in hard disk drive head assembly.
Microelectron. Reliab.
C. F. Luk, Y. C. Chan, K. C. Hung
2002 J jnl
Development of gold to gold interconnection flip chip bonding for chip on suspension assemblies.
Microelectron. Reliab.
C. F. Luk, Y. C. Chan, K. C. Hung
2002 J jnl
Effect of misalignment on electrical characteristics of ACF joints for flip chip on flex applications.
Microelectron. Reliab.
S. H. Fan, Y. C. Chan
2002 J jnl
Effects of bonding parameters on the reliability performance of anisotropic conductive adhesive interconnects for flip-chip-on-flex packages assembly I. Different bonding temperature.
Microelectron. Reliab.
Y. C. Chan, D. Y. Luk
2002 J jnl
Effects of bonding parameters on the reliability performance of anisotropic conductive adhesive interconnects for flip-chip-on-flex packages assembly II. Different bonding pressure.
Microelectron. Reliab.
Y. C. Chan, D. Y. Luk
2002 J jnl
No-flow underfill flip chip assembly--an experimental and modeling analysis.
Microelectron. Reliab.
Hua Lu, K. C. Hung, Stoyan Stoyanov, Chris Bailey, Y. C. Chan
2002 J jnl
Study of short-circuiting between adjacent joints under electric field effects in fine pitch anisotropic conductive adhesive interconnects.
Microelectron. Reliab.
Y. W. Chiu, Y. C. Chan, S. M. Lui
2001 J jnl
Reliability of microBGA assembly using no-flow underfill.
Microelectron. Reliab.
P. L. Tu, Y. C. Chan, K. C. Hung
2001 J jnl
Study of micro-BGA solder joint reliability.
Microelectron. Reliab.
P. L. Tu, Y. C. Chan, K. C. Hung, J. K. L. Lai
2001 J jnl
Study of the self-alignment of no-flow underfill for micro-BGA assembly.
Microelectron. Reliab.
Y. C. Chan, P. L. Tu, K. C. Hung
1985 — conf
FORTLOG = Fortran + Logique.
SPLT
Y. C. Chan